Patents by Inventor Tae-Seog Kim

Tae-Seog Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package for encapsulating multiple dies and method of manufacturing the same
    Patent number: 7439098
    Abstract: A semiconductor package comprises a silicon substrate having an insulative surface; a patterned metal layer, formed on the insulative surface of the silicon substrate; an insulation layer formed on the patterned metal layer, and the patterned metal layer being partially exposed for functioning as at least a set of the device attaching pads and ball attaching pads; at least a device electrically connected to the set of the device attaching pads; a sealing compound for covering portions of the insulative surface of the silicon substrate and encapsulating the devices; and a plurality of solder balls attached to the set of ball attaching pads.
    Type: Grant
    Filed: September 9, 2005
    Date of Patent: October 21, 2008
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Jun-Young Yang, Tae-Seog Kim, You-Ock Joo