Patents by Inventor Tae-Seok Sim

Tae-Seok Sim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DNA CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20100204063
    Abstract: A DNA chip package includes; a base substrate, a photoresist layer disposed on the base substrate, at least one DNA chip mounting groove disposed in the photoresist layer and exposing the base substrate therethrough, and at least one DNA chip mounted in the at least one DNA chip mounting groove.
    Type: Application
    Filed: November 16, 2009
    Publication date: August 12, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Tae-seok SIM
  • Biochip Package Body, Method of Forming the Same, and Biochip Package Including the Biochip Package Body
    Publication number: 20100068101
    Abstract: A biochip package body, a method of forming the same, and a biochip package including the biochip package body are provided. The biochip package body includes a mounting package body having a mounting plate. The mounting plate has at least one protruding portion that protrudes therefrom. The protruding portion has a chip mounting portion and a chip protection portion. The chip mounting portion is disposed substantially in the center of the protruding portion. The chip protection portion surrounds the chip mounting portion.
    Type: Application
    Filed: September 15, 2009
    Publication date: March 18, 2010
    Inventors: TAE-SEOK SIM, DONG-HO LEE
  • Method of aligning micro structures using guides
    Publication number: 20020026724
    Abstract: A method of aligning microstructures using guides, which enables an align bonding technique, which is a technique in the Micro Electro Mechanical System (MEMS) field, with a cheap microscope of low power.
    Type: Application
    Filed: December 28, 2000
    Publication date: March 7, 2002
    Inventors: Sung Moon, Tae Seok Sim, Hyung Hwan Oh