Patents by Inventor Tae-Seong Park

Tae-Seong Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND APPARATUS FOR GENERATING SAFETY CONTROL SIGNAL NOTIFYING RISK OF ACCIDENT ON ROAD
    Publication number: 20240071219
    Abstract: Provided are a method and apparatus for generating a safety control signal of a road. The method includes inputting road state information for a first time point, including a safety control signal for the first time point and dynamic information for the first time point obtained from a video of a road, to a prediction model, inferring dangerous situation prediction information for a second time point after the first time point, by using the prediction model, and generating a safety control signal notifying a risk of accident on the road for the second time point, based on the inferred dangerous situation prediction information, wherein the prediction model is trained by using a loss function configured by dangerous situation prediction information inferred for a specific time point from road state information before the specific time point, and dangerous situation measurement information calculated from road state information for the specific time point.
    Type: Application
    Filed: August 21, 2023
    Publication date: February 29, 2024
    Applicant: NOTA, INC.
    Inventors: Hwan Hyo PARK, Dong Ho KA, Tae Seong MOON
  • Storage node, phase change memory device and methods of operating and fabricating the same
    Patent number: 8742514
    Abstract: A storage node may include a lower electrode, a phase change layer on the lower electrode and an upper electrode on the phase change layer, and the lower electrode and the upper electrode may be composed of thermoelectric materials having a melting point higher than that of the phase change layer, and having different conductivity types. An upper surface of the lower electrode may have a recessed shape, and a lower electrode contact layer may be provided between the lower electrode and the phase change layer.
    Type: Grant
    Filed: January 11, 2012
    Date of Patent: June 3, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Seok Suh, Tae-Seong Park
  • Method of forming a solder ball on a board and the board
    Patent number: 7213329
    Abstract: In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: May 8, 2007
    Assignee: Samsung Electronics, Co., Ltd.
    Inventors: Seung-Woo Kim, Pyeong-Wan Kim, Sang-Ho Ahn, Bo-Seong Kim, Ho-Jeong Mun, Tae-Seong Park, Hee-Guk Choi
  • Method of forming a solder ball on a board and the board
    Publication number: 20060035453
    Abstract: In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.
    Type: Application
    Filed: August 4, 2005
    Publication date: February 16, 2006
    Inventors: Seung-Woo Kim, Pyeong-Wan Kim, Sang-Ho Ahn, Bo-Seong Kim, Ho-Jeong Moon, Tae-Seong Park, Hee-Guk Choi