Patents by Inventor Tae Shin Kim
Tae Shin Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240131624Abstract: Embodiments of the inventive concept provide a substrate treating apparatus and a substrate treating method for not letting an irradiation region of a laser deviate from a target region, even if a shaking angle of a chemical deviates from an allowable range due to a vibration or an airflow. The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes: a substrate support unit configured to support a substrate having a chemical coated thereon; a laser generation unit configured to irradiate a laser to the substrate; and a light-transmitter positioned along a path at which the laser is irradiated.Type: ApplicationFiled: October 2, 2023Publication date: April 25, 2024Applicant: SEMES CO., LTD.Inventors: Tae Shin KIM, Ki Hoon CHOI, Tae Hee KIM, Sang Gun LEE, Jin Yeong SUNG, Jang Jin LEE
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Publication number: 20240106073Abstract: Provided are a separator coating composition for a secondary battery including inorganic particles and a silane salt compound having a specific structure, a separator using the same, and an electrochemical device including the same. Specifically, a separator coating composition for a secondary battery which implements adhesion between an inorganic material layer and a porous substrate without including an acid/polymer-based organic binder in a coating composition for forming the inorganic material layer on one or both surfaces of the porous substrate and does not need a separate dispersing agent for dispersing the inorganic particles, a separator manufactured using the same, and an electrochemical device including the separator are provided.Type: ApplicationFiled: September 13, 2023Publication date: March 28, 2024Inventors: Tae Wook KWON, Sang Ick LEE, Won Sub KWACK, Cheol Woo KIM, Hyo Shin KWAK, Heung Taek BAE
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Publication number: 20240092913Abstract: The present disclosure relates to an isolated anti-FcRN antibody, which is an antibody binding to FcRN (stands for neonatal Fc receptor, also called FcRP, FcRB or Brambell receptor) that is a receptor with a high affinity for IgG or a fragment thereof, a method of preparing thereof, a composition for treating autoimmune disease, which comprises the antibody, and a method of treating and diagnosing autoimmunre diseases using the antibody. The FcRn-specific antibody according to the present disclosure binds to FcRn non-competitively with IgG to reduce serum pathogenic auto-antibody levels, and thus can be used for the treatment of autoimmune diseases.Type: ApplicationFiled: November 17, 2023Publication date: March 21, 2024Applicant: HANALL BIOPHARMA CO., LTD.Inventors: Sung Wuk KIM, Seung Kook PARK, Jae Kap JEONG, Hyea Kyung AHN, Min Sun KIM, Eun Sun KIM, Hae-Young YONG, Dongok SHIN, Yeon Jung SONG, Tae Hyoung YOO
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Publication number: 20240090286Abstract: A display device may include a substrate including a display area and a non-display area surrounding at least a portion of the display area, a first organic insulating layer disposed on the substrate in the non-display area, a first conductive layer disposed on the first organic insulating layer and including first discharge holes, a second organic insulating layer disposed on the first conductive layer, and a transparent conductive layer disposed on the second organic insulating layer and including second discharge holes that respectively overlap the first discharge holes.Type: ApplicationFiled: October 10, 2023Publication date: March 14, 2024Inventors: Kwangsik Shin, Tae Wook Kim, Joohong Seo
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Patent number: 11923213Abstract: Proposed is a substrate heating unit including: a laser generator providing a laser beam for heating a substrate; and a beam shaper processing the laser beam from the laser generator and selectively providing one of a first beam having a uniform energy distribution and a second beam having an edge-enhanced energy distribution to the substrate.Type: GrantFiled: December 20, 2020Date of Patent: March 5, 2024Assignee: SEMES CO., LTD.Inventors: Tae Shin Kim, Young Dae Chung, Ji Hoon Jeong, Jee Young Lee, Won Geun Kim
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Publication number: 20240035166Abstract: A method of processing a substrate includes an etchant supplying operation of supplying an etchant to a substrate; a puddle operation of, by rotating the substrate at a first rotational speed, forming a liquid film of the etchant supplied to the substrate in a puddle shape; and a thickness adjusting operation of changing a rotational speed of the substrate to a rotational speed different from the first rotational speed to adjust a thickness of the liquid film of the etchant. Using the method, dispersion of the etching rate may be effectively controlled.Type: ApplicationFiled: February 9, 2023Publication date: February 1, 2024Inventors: Jee Young LEE, Won Geun KIM, Young Dae CHUNG, Ji Hoon JEONG, Tae Shin KIM, Won Sik SON
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Publication number: 20230360933Abstract: The present invention provides a substrate treating facility, including: a process chamber including an annular beam emitting unit which emits an annular laser beam to a substrate and heats the substrate; and a laser beam generator configured to generate the laser beam emitted to the substrate through the annular beam emitting unit of the process chamber.Type: ApplicationFiled: May 9, 2022Publication date: November 9, 2023Inventors: Tae Shin KIM, Ji Hoon JEONG, Young Dae CHUNG, Jee Young LEE, Won-Geun KIM
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Patent number: 11772198Abstract: A thin layer etching apparatus includes an etchant supply unit configured to supply an etchant onto a substrate to etch a thin layer formed on the substrate, a temperature measuring unit configured to measure a temperature of the substrate while an etching process is performed by the etchant, a laser irradiating unit configured to irradiate a first laser beam on a first portion including a central portion of the substrate and to irradiate a second laser beam in a ring shape on a second portion surrounding the first portion so that the temperature of the substrate is maintained at a predetermined temperature during the etching process, and a process control unit configured to control power of the first and second laser beams based on the temperature of the substrate measured by the temperature measuring unit to reduce a temperature difference between the first and second portions of the substrate.Type: GrantFiled: December 8, 2020Date of Patent: October 3, 2023Assignee: SEMES CO., LTD.Inventors: Won Geun Kim, Tae Shin Kim
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Patent number: 11715651Abstract: A substrate treatment apparatus includes a substrate support unit, a chemical supply unit supplying a chemical solution onto an upper surface of a substrate supported on the substrate support unit, a laser irradiation unit applying a laser pulse to the substrate to heat the substrate, and a controller controlling the laser irradiation unit to emit the laser pulse such that the substrate is repeatedly heated and cooled to maintain a preset temperature.Type: GrantFiled: October 24, 2020Date of Patent: August 1, 2023Assignee: SEMES CO., LTD.Inventors: Young Dae Chung, Won Geun Kim, Jee Young Lee, Ji Hoon Jeong, Tae Shin Kim, Jung Suk Goh, Cheng Bin Cui, Ye Rim Yeon
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Publication number: 20230213867Abstract: The inventive concept provides a mask treatment apparatus. The mask treatment may include a support unit that supports the mask, and a light irradiation unit that irradiate the mask with a light to adjust a critical dimension of a pattern formed in the mask, wherein the light irradiation unit includes a light source that generates the light, and a light modulation element that modulates the light generated by the light source and forms an irradiation pattern.Type: ApplicationFiled: December 28, 2022Publication date: July 6, 2023Applicant: SEMES CO., LTD.Inventors: Tae Hee KIM, Ji Hoon JEONG, Tae Shin KIM, Young Dae CHUNG, Young Eun JEON
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Publication number: 20230207350Abstract: Provided is an apparatus for treating a substrate, which includes: a chamber having a treating space; a substrate support unit supporting and rotating a substrate in the treating space; a liquid supply unit supplying a chemical liquid to the substrate supported on the substrate support unit; a laser irradiation unit irradiating a laser to a bottom of the substrate supported on the substrate support unit; and a laser reflection unit coupled to the laser irradiation unit, and reflecting the laser irradiated and reflected to the bottom of the substrate, in which the laser reflection unit includes a reflection member reflecting the laser reflected from the substrate, and a driving member tilting the reflection member at a predetermined tilt angle.Type: ApplicationFiled: December 28, 2022Publication date: June 29, 2023Applicant: SEMES CO., LTD.Inventors: Tae Shin KIM, Young Dae Chung, Won-Geun Kim, Jee Young Lee, Ji Hoon Jeong
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Publication number: 20230176485Abstract: Provided is a method for treating a substrate. The method for treating the substrate may include heating a substrate formed with a plurality of thin film layers including a photoresist layer formed on a surface, and irradiating light to a first thin film layer including a metal among the plurality of thin film layers to heat the first thin film layer.Type: ApplicationFiled: December 2, 2022Publication date: June 8, 2023Applicant: SEMES CO., LTD.Inventors: DONGWOON PARK, GI HUN JUNG, JIN TAEK OH, TAE SHIN KIM, JU WON KIM, A RAH CHO, BYOUNG DOO CHOI
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Publication number: 20230039663Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit horizontally maintaining a substrate; a laser irradiation unit for irradiating the substrate with a laser; a photo-detector for detecting an energy of a reflective light reflected from the substrate among a laser irradiated on the substrate; and a processor, and wherein the processor irradiates a first laser of a first output to the substrate, and sets a second output of a second laser for irradiating the substrate to heat the substrate, based on an energy of a first reflective light reflected from the substrate by the first laser detected from the photo-detector.Type: ApplicationFiled: July 15, 2022Publication date: February 9, 2023Applicant: SEMES CO., LTD.Inventors: Jee Young LEE, Young Dae CHUNG, Ji Hoon JEONG, Won-Geun KIM, Tae Shin KIM
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Patent number: 11495467Abstract: Method and apparatus for etching a thin layer including silicon nitride formed on a substrate are disclosed. Etchant including phosphoric acid and water is supplied on the substrate so that a liquid layer is formed on the substrate. The thin layer is etched by reaction between the thin layer and the etchant. Thickness of the liquid layer is measured to detect variation in the thickness of the liquid layer while etching the thin layer. Variation in the concentration of the phosphoric acid and the water is calculated based on the variation in the thickness of the liquid layer. Water is supplied on the substrate based on the variation in the concentration of the phosphoric acid and the water so that the concentration of the phosphoric acid and the water becomes a predetermined value.Type: GrantFiled: December 8, 2020Date of Patent: November 8, 2022Assignee: SEMES CO., LTD.Inventors: Jung Suk Goh, Jae Seong Lee, Do Youn Lim, Kuk Saeng Kim, Young Dae Chung, Tae Shin Kim, Jee Young Lee, Won Geun Kim, Ji Hoon Jeong, Kwang Sup Kim, Pil Kyun Heo, Yoon Ki Sa, Ye Rim Yeon, Hyun Yoon, Do Yeon Kim, Yong Jun Seo, Byeong Geun Kim, Young Je Um
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Publication number: 20220084847Abstract: Substrate treating equipment includes a first process chamber group including a plurality of process chambers, each of which includes a laser beam emitting unit that applies a laser beam to a substrate to heat the substrate, one laser beam generator that generates the laser beam applied to the substrate through the laser beam emitting unit of each of the plurality of process chambers included in the first process chamber group, and a beam shifting module including one or more mirrors corresponsable to the plurality of process chambers included in the first process chamber group. Each of the one or more mirrors is shifted to a position in which the mirror forms an optical path of the laser beam toward a predetermined one of the plurality of process chambers.Type: ApplicationFiled: June 14, 2021Publication date: March 17, 2022Inventors: JEE YOUNG LEE, YOUNG DAE CHUNG, JI HOON JEONG, TAE SHIN KIM, WON-GEUN KIM
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Publication number: 20220068698Abstract: The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a heating unit that irradiates a beam to the substrate and heat the substrate, and the heating unit further includes an irradiation part that irradiates the beam, and a rotation part that rotates the beam.Type: ApplicationFiled: August 5, 2021Publication date: March 3, 2022Inventors: JI HOON JEONG, WON-GEUN KIM, YOUNG DAE CHUNG, JEE YOUNG LEE, TAE SHIN KIM
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Publication number: 20220055074Abstract: The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a laser unit that irradiates a laser beam to the substrate supported by the support unit, the laser unit includes an irradiation member that irradiates the laser beam, a lens disposed on a travel path of the laser beam irradiated by the irradiation member to be rotatable, and a reflection member having an inclined surface for changing the travel path of the laser beam that passed through the lens.Type: ApplicationFiled: August 11, 2021Publication date: February 24, 2022Inventors: JI HOON JEONG, WON-GEUN KIM, YOUNG DAE CHUNG, TAE SHIN KIM, JEE YOUNG LEE
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Publication number: 20210202280Abstract: Proposed is a substrate heating unit including: a laser generator providing a laser beam for heating a substrate; and a beam shaper processing the laser beam from the laser generator and selectively providing one of a first beam having a uniform energy distribution and a second beam having an edge-enhanced energy distribution to the substrate.Type: ApplicationFiled: December 20, 2020Publication date: July 1, 2021Applicant: SEMES CO., LTD.Inventors: Tae Shin KIM, Young Dae CHUNG, Ji Hoon JEONG, Jee Young LEE, Won Geun KIM
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Publication number: 20210183660Abstract: Method and apparatus for etching a thin layer including silicon nitride formed on a substrate are disclosed. Etchant including phosphoric acid and water is supplied on the substrate so that a liquid layer is formed on the substrate. The thin layer is etched by reaction between the thin layer and the etchant. Thickness of the liquid layer is measured to detect variation in the thickness of the liquid layer while etching the thin layer. Variation in the concentration of the phosphoric acid and the water is calculated based on the variation in the thickness of the liquid layer. Water is supplied on the substrate based on the variation in the concentration of the phosphoric acid and the water so that the concentration of the phosphoric acid and the water becomes a predetermined value.Type: ApplicationFiled: December 8, 2020Publication date: June 17, 2021Applicant: SEMES CO., LTD.Inventors: Jung Suk GOH, Jae Seong LEE, Do Youn LIM, Kuk Saeng KIM, Young Dae CHUNG, Tae Shin KIM, Jee Young LEE, Won Geun KIM, Ji Hoon JEONG, Kwang Sup KIM, Pil Kyun HEO, Yoon Ki SA, Ye Rim YEON, Hyun YOON, Do Yeon KIM, Yong Jun SEO, Byeong Geun KIM, Young Je UM
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Publication number: 20210178522Abstract: A thin layer etching apparatus includes an etchant supply unit configured to supply an etchant onto a substrate to etch a thin layer formed on the substrate, a temperature measuring unit configured to measure a temperature of the substrate while an etching process is performed by the etchant, a laser irradiating unit configured to irradiate a first laser beam on a first portion including a central portion of the substrate and to irradiate a second laser beam in a ring shape on a second portion surrounding the first portion so that the temperature of the substrate is maintained at a predetermined temperature during the etching process, and a process control unit configured to control power of the first and second laser beams based on the temperature of the substrate measured by the temperature measuring unit to reduce a temperature difference between the first and second portions of the substrate.Type: ApplicationFiled: December 8, 2020Publication date: June 17, 2021Applicant: SEMES CO., LTD.Inventors: Won Geun KIM, Tae Shin KIM