Abstract: An exposure apparatus for exposing a photoresist film formed on a semiconductor substrate includes a plurality of reticle stages on which respective reticles can be supported at the same time. The reticles can be selectively and hence, successively, positioned along the optical axis of the apparatus that extends from the light source of the apparatus to a substrate stage. One region of the photoresist film is exposed to light directed through the first reticle. Then the second reticle stage is aligned and another region of the photoresist film is exposed to light directed through the second reticle.

Abstract: A semiconductor fabricating device and method that minimize the influence of a process deteriorating material that is generated during first processes on second processes, when the plurality of processes are continually performed step by step. Operational failures are prevented during the course of the semiconductor fabricating processes, by directing air flow from a location where the second processes are carried out to a location where the first processes are carried out, to carry the process deteriorating gas away from the second processes. This reduces the frequency of failures during processing.

Abstract: An in-line system having an overlay measurement function and a method thereof capable of reducing overlay measurement time and simplifying related jobs are disclosed. The system for performing wafer processing comprises an in-line system comprising a stepper for performing alignment and photo-exposure of a wafer and a spinner, in-line connected to the stepper, for performing coating and development of the wafer, and an overlay measurement device, in-line connected to the spinner, for automatically measuring an overlay accuracy of the wafer after wafer development is completed by the spinner.

Abstract: An exposure apparatus for exposing a photoresist film formed on a semiconductor substrate includes a plurality of reticle stages on which respective reticles can be supported at the same time. The reticles can be selectively and hence, successively, positioned along the optical axis of the apparatus that extends from the light source of the apparatus to a substrate stage. One region of the photoresist film is exposed to light directed through the first reticle. Then the second reticle stage is aligned and another region of the photoresist film is exposed to light directed through the second reticle.

Abstract: An in-line system having an overlay measurement function and a method thereof capable of reducing overlay measurement time and simplifying related jobs are disclosed. The system for performing wafer processing comprises an in-line system comprising a stepper for performing alignment and photo-exposure of a wafer and a spinner, in-line connected to the stepper, for performing coating and development of the wafer, and an overlay measurement device, in-line connected to the spinner, for automatically measuring an overlay accuracy of the wafer after wafer development is completed by the spinner.

Abstract: A photolithographic apparatus for rapidly processing semiconductor wafers. In the photolithographic apparatus, a plurality of steppers are in parallel connected to one coater/developer. The steppers are in parallel connected to one coater/developers, where the steppers process the semiconductor wafer at a low speed and the coater/developers process the semiconductor wafer at a high speed, to thereby remove a bottleneck phenomenon. Therefore, the photolithographic apparatus according to the present invention may rapidly perform a photolithography process.

Abstract: A semiconductor fabricating device and method that minimize the influence of a process deteriorating material that is generated during first processes on second processes, when the plurality of processes are continually performed step by step. Operational failures are prevented during the course of the semiconductor fabricating processes, by directing air flow from a location where the second processes are carried out to a location where the first processes are carried out, to carry the process deteriorating gas away from the second processes. This reduces the frequency of failures during processing.

Abstract: A photolithographic apparatus for rapidly processing semiconductor wafers. In the photolithographic apparatus, a plurality of steppers are in parallel connected to one coater/developer. The steppers are in parallel connected to one coater/developers, where the steppers process the semiconductor wafer at a low speed and the coater/developers process the semiconductor wafer at a high speed, to thereby remove a bottleneck phenomenon. Therefore, the photolithographic apparatus according to the present invention may rapidly perform a photolithography process.

Abstract: A polyimide coating device includes a bubble sensor for sensing the supply of a polyimide from a main polyimide storage tank. The coating device also includes an auxiliary storage tank filled with a predetermined amount of polyimide at all the times. A discharge pipe is connected to the auxiliary storage tank such that any gas introduced into a supply pipe between the main storage tank and the auxiliary storage tank is easily discharged prior to the polyimide entering a reaction chamber.