Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support a substrate; and a liquid supply unit configured to supply a treating liquid onto the substrate supported on the support unit, and wherein the liquid supply unit comprises: a tank configured to have an accommodation space for storing the treating liquid therein; a circulation line configured to circulate the treating liquid stored in the accommodation space; a supplementary line configured to supply the treating liquid to the accommodation space, and at which a valve is installed; a heater installed at the circulation line, and for heating the treating liquid; and a controller is configured to control the valve and the heater.

Abstract: An apparatus for processing a substrate includes a housing having a processing space in which the substrate is processed, a support unit that supports the substrate in the processing space, a nozzle that dispenses a chemical onto the substrate placed on the support unit, a chemical supply unit that supplies the chemical to the nozzle, and a controller that controls the chemical supply unit.

Abstract: Provided is an apparatus for supplying a chemical liquid, the apparatus including: a storage tank in which a chemical liquid is stored; a discharge line through which the chemical liquid stored in the storage tank is discharged; a level tube connected to the storage tank so as to check a water level of the chemical liquid in the storage tank and receiving the chemical liquid at the same water level as the water level of the chemical liquid in the storage tank; and a controller for controlling a first valve installed in the discharge line, in which the level tube has one end connected to an upper space of the storage tank and the other end connected to the discharge line.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support a substrate; and a liquid supply unit configured to supply a treating liquid onto the substrate supported on the support unit, and wherein the liquid supply unit comprises: a tank configured to have an accommodation space for storing the treating liquid therein; a circulation line configured to circulate the treating liquid stored in the accommodation space; a supplementary line configured to supply the treating liquid to the accommodation space, and at which a valve is installed; a heater installed at the circulation line, and for heating the treating liquid; and a controller is configured to control the valve and the heater.

Abstract: An apparatus for processing a substrate includes a housing having a processing space in which the substrate is processed, a support unit that supports the substrate in the processing space, a nozzle that dispenses a chemical onto the substrate placed on the support unit, a chemical supply unit that supplies the chemical to the nozzle, and a controller that controls the chemical supply unit.

Abstract: Provided is a substrate treatment apparatus including a housing, a supporting unit located inside the housing and supporting a substrate, a nozzle unit supplying chemicals to the substrate disposed on the supporting unit, and a chemical supplying unit supplying the chemicals to the nozzle unit. Herein, the chemical supplying unit includes a chemical supply source, a first tank and a second tank storing the chemicals, a chemical supplying line supplying the chemicals from the chemical supply source to the first tank and the second tank, a chemical discharge line supplying the chemicals from the first tank and the second tank to the nozzle unit, a circulation line allowing the chemicals to circulate through the first tank and the second tank, respectively, a member installed on the circulation line, and a controller controlling the member.

Abstract: Provided is a substrate treatment apparatus including a housing, a supporting unit located inside the housing and supporting a substrate, a nozzle unit supplying chemicals to the substrate disposed on the supporting unit, and a chemical supplying unit supplying the chemicals to the nozzle unit. Herein, the chemical supplying unit includes a chemical supply source, a first tank and a second tank storing the chemicals, a chemical supplying line supplying the chemicals from the chemical supply source to the first tank and the second tank, a chemical discharge line supplying the chemicals from the first tank and the second tank to the nozzle unit, a circulation line allowing the chemicals to circulate through the first tank and the second tank, respectively, a member installed on the circulation line, and a controller controlling the member.