Patents by Inventor Tae-sung Moon

Tae-sung Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip
    Patent number: 7282801
    Abstract: A microelectronic device chip including a hybrid Au bump in which foreign materials are not generated in a probe tip in an electrical die sorting (EDS) test is provided. The microelectronic device chip includes a chip pad which is connected to a microelectronic device formed on a substrate and on which the microelectronic device is brought into electrical contact with the outside of the chip. Further, the microelectronic device chip includes a bump which is formed on the chip pad and made up of a composite layer including two or more layers.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: October 16, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung-keun Park, Woo-jin Jang, Young-ho Kim, Tae-sung Moon
  • Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip
    Publication number: 20060055037
    Abstract: A microelectronic device chip including a hybrid Au bump in which foreign materials are not generated in a probe tip in an electrical die sorting (EDS) test is provided. The microelectronic device chip includes a chip pad which is connected to a microelectronic device formed on a substrate and on which the microelectronic device is brought into electrical contact with the outside of the chip. Further, the microelectronic device chip includes a bump which is formed on the chip pad and made up of a composite layer including two or more layers.
    Type: Application
    Filed: September 14, 2005
    Publication date: March 16, 2006
    Inventors: Hyung-keun Park, Woo-jin Jang, Young-ho Kim, Tae-sung Moon