Patents by Inventor Tae Tong Kim

Tae Tong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coreless multi-layer circuit substrate with minimized pad capacitance
    Patent number: 9060428
    Abstract: A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: June 16, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kevin Bills, Mahesh Bohra, Jinwoo Choi, Tae Tong Kim, Rohan Mandrekar