Abstract: The present disclosure relates to an OLED that includes a first electrode; a second electrode facing the first electrode; a first emitting material layer including a first host, a second host and a blue dopant and positioned between the first and second electrodes; a first electron blocking layer including an electron blocking material of a spirofluorene-substituted amine derivative and positioned between the first electrode and the first emitting material layer; and a first hole blocking layer including a first hole blocking material of an azine derivative and positioned between the second electrode and the first emitting material layer, wherein the first host is an anthracene derivative, and the second host is a deuterated anthracene derivative.

Abstract: A vehicle body includes a floor member, a support member coupled to an upper surface of the floor member, and a frame member coupled to an upper end of the support member to define a space between the floor member and the frame member, wherein the space is configured to house an item. The item may include a high-voltage battery.

Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.

Abstract: A nanoparticle to which an imidazolium salt is chemically bonded, a method of preparing the same, and a nanogel electrolyte for dye-sensitized solar cells comprising the same are disclosed. The present invention may provide a dye-sensitive solar cell with good economic feasibility, stability and photoelectric conversion efficiency using the nanogel electrolyte, wherein the nanogel electrolyte may reduce the concentration of ionic liquids and preparation costs while improving economic feasibility, long term stability, and photoelectric conversion efficiency.

Abstract: A nanoparticle to which an imidazolium salt is chemically bonded, a method of preparing the same, and a nanogel electrolyte for dye- sensitized solar cells comprising the same are disclosed. The present invention may provide a dye-sensitive solar cell with good economic feasibility, stability and photoelectric conversion efficiency using the nanogel electrolyte, wherein the nanogel electrolyte may reduce the concentration of ionic liquids and preparation costs while improving economic feasibility, long term stability, and photoelectric conversion efficiency.

Abstract: A method for mounting parts may include recognizing a particular part feeder where a part to be mounted is contained among a plurality of part feeders, moving a head unit to a position for picking up a part on the part feeder, moving an image sensor installed to be capable of moving to a position close to the particular part feeder, picking up a part from the particular part feeder with a suction nozzle installed at the had unit, moving the head unit to a position above the image sensor, detecting an image of the part held by the suction nozzle, moving the suction nozzle to a printed circuit board from the image sensor, and aligning the part with the printed circuit board while determining and compensating for an error generated when the part is picked up, and mounting the aligned part on the printed circuit board.

Abstract: A surface mounter includes: a component supply unit in which a plurality of components to be mounted are placed; a head unit which mounts a component on a circuit board by lifting the component from the component supply unit with suction; and a transfer unit including a carry-in portion with a single distribution lane, a mounting portion with dual working lanes, and a carry-out portion with a single carry-out lane, wherein a circuit board is transferred along the distribution lane and distributed to the mounting portion, components are mounted on the circuit board stopped at a position of the mounting portion, and the circuit board with the components mounted thereon is transferred out of the transfer unit along the carry-out lane. In the surface mounter, a number of circuit boards can be distributed to dual working lanes via a single distribution lane, not via common dual carry-in lanes, at higher working speed, so that working efficiency is improved. In addition, the surface mounter occupies less space.

Abstract: A surface mounter includes: a component supply unit in which a plurality of components to be mounted are placed; a head unit which mounts a component on a circuit board by lifting the component from the component supply unit with suction; and a transfer unit including a carry-in portion with a single distribution lane, a mounting portion with dual working lanes, and a carry-out portion with a single carry-out lane, wherein a circuit board is transferred along the distribution lane and distributed to the mounting portion, components are mounted on the circuit board stopped at a position of the mounting portion, and the circuit board with the components mounted thereon is transferred out of the transfer unit along the carry-out lane. In the surface mounter, a number of circuit boards can be distributed to dual working lanes via a single distribution lane, not via common dual carry-in lanes, at higher working speed, so that working efficiency is improved. In addition, the surface mounter occupies less space.

Abstract: Mounting parts is performed by recognizing a particular part feeder where a part to be mounted is contained among a plurality of part feeders, moving a head unit to a position for picking up a part on the part feeder, moving an image sensor installed to be capable of moving to a position close to the particular part feeder, picking up a part from the particular part feeder with a suction nozzle installed at the head unit, moving the head unit to a position above the image sensor, detecting an image of the part held by the suction nozzle, moving the suction nozzle to a printed circuit board from the image sensor, and aligning the part with the printed circuit board while determining and compensating for an error generated when the part is picked up, and mounting the aligned part on the printed circuit board.

Abstract: Mounting parts is performed by recognizing a particular part feeder where a part to be mounted is contained among a plurality of part feeders, moving a head unit to a position for picking up a part on the part feeder, moving an image sensor installed to be capable of moving to a position close to the particular part feeder, picking up a part from the particular part feeder with a suction nozzle installed at the head unit, moving the head unit to a position above the image sensor, detecting an image of the part held by the suction nozzle, moving the suction nozzle to a printed circuit board from the image sensor, and aligning the part with the printed circuit board while determining and compensating for an error generated when the part is picked up, and mounting the aligned part on the printed circuit board.