Patents by Inventor Tae Yeop James Kim

Tae Yeop James Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for electrically connecting contact surfaces of electronic components
    Patent number: 11791309
    Abstract: A process for electrically connecting contact surfaces of electronic components by capillary wedge bonding a round wire of 8 to 80 ?m to the contact surface of a first electronic component, forming a wire loop, and stitch bonding the wire to the contact surface of a second electronic component, wherein the wire comprises a wire core having a silver or silver-based wire core with a double-layered coating comprised of a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: October 17, 2023
    Assignee: HERAEUS MATERIALS SINGAPORE PTE. LTD.
    Inventors: Yean Mee Pun, Murali Sarangapani, Xi Zhang, Il Tae Kang, Abito Danila Bayaras, Kim Hui Chong, Sylvia Sutiono, Chee Wei Tok, Tae Yeop James Kim