Abstract: A method for coding image information includes generating prediction information by predicting information on a current coding unit, and determining whether the information on the current coding unit is the same as the prediction information. When the information on the current coding unit is the same as the prediction information, a flag indicating that the information on the current coding unit is the same as the prediction information is coded and transmitted. When the information on the current coding unit is not the same as the prediction information, a flag indicating that the information on the current coding unit is not the same as the prediction information and the information on the current coding unit are coded and transmitted.

Abstract: Flow barriers such as trenches (144) and/or walls (152) laterally surrounding an aperture (142) in a coating (140) on a transparent substrate (120) help control the flow of replication material (124) during the formation of a replicated optical element on the aperture (142).

Abstract: Optoelectronic modules, such as imaging cameras, proximity sensors, range cameras, structured-light/pattern generators, and image projectors, and methods for their manufacture, are disclosed. The optoelectronic modules exhibit particularly small dimensions. The optoelectronic modules include an optical assembly, an intermediate substrate, and a base substrate. The optical assembly includes a flange portion. An adhesive layer between the flange portion and the intermediate substrate, and an additional adhesive layer between the intermediate substrate and the base can be substantially non-transmissive to light and can resist dimensional changes dues to moisture absorption, for example.

Abstract: Optoelectronic modules include overmolds that support an optical assembly and, in some case, protect wiring providing electrical connections between an image sensor and a printed circuit board (PCB) or other substrate. The disclosure also describes wafer-level fabrication methods for making the modules.

Abstract: Optoelectronic modules include overmolds that support an optical assembly and, in some case, protect wiring providing electrical connections between an image sensor and a printed circuit board (PCB) or other substrate. The disclosure also describes wafer-level fabrication methods for making the modules.

Abstract: Provided are an apparatus and method for manufacturing a current collector for a secondary battery. In the current collector manufacturing method, a current collector source material is first prepared, pre-treated and then passed between rollers, one of which has patterns shaped like openings to be formed in the source material to then coat a pattern forming composition. Then, the resultant is dried and etched to form the openings, thereby completing the current collector. The current collector manufacturing apparatus includes a main roller, a guide roller coupled to the main roller so that the current collector passes therebetween, and a pattern forming composition storage unit, installed under the main roller, for supplying the pattern forming composition to a patterned portion.