Abstract: Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.

Abstract: Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.

Abstract: A method for a radome structure having a heating and a light emitting function according to the present invention comprises forming a three dimensional shape with a film part comprising a film, and a light emitting circuit and a heating circuit printed on the film in a stack; cutting the film part, and integrating an upper cover, a lower cover, and the film part disposed between the upper and the lower cover, into one body using one of a bonding process or an injection-molding process.

Abstract: An in-mold electronic structure according to the present invention comprises a film with a design; a first plastic resin disposed under the film, and a second plastic resin disposed under the first plastic resin, wherein an electronic circuit is formed on a top side or both sides of the second plastic resin, wherein an electronic device is mounted on the top side or the both sides of the second plastic resin, wherein the film, the first plastic resin, and the second resin with the electronic circuit and the electronic device, are integrated.

Abstract: The present disclosure provides a vehicle cruise control sensor-cover and a method of manufacturing the vehicle cruise control sensor-cover, the vehicle cruise control sensor-cover including a bottom cover member wherein indium or an indium-containing alloy is deposited, by using a non-conductive vacuum metallization (NCVM) method, on a front surface of a bottom cover body having a logo and an outer frame protruding three-dimensionally and a top cover body including a transparent material and having a back surface formed in a shape corresponding to the front surface of the bottom cover member, wherein the top cover member is assembled integrally with the front surface of the bottom cover member, and a laser etching process is partially selectively performed only on the logo or the outer edge on the back surface of the top cover body to partially form an etched surface.

Abstract: A method of manufacturing a radar transparent cover may include steps of: injection molding a first transparent cover; inserting into a mold the first transparent cover made by the step of injection molding the first transparent cover and then, double injection molding a color resin on a back surface of the first transparent cover; and inserting into a mold the injection molded article made by the step of double injection molding the color resin and then, double injection molding a second transparent cover on a front surface of the first transparent cover.

Abstract: The present disclosure provides a vehicle cruise control sensor-cover and a method of manufacturing the vehicle cruise control sensor-cover, the vehicle cruise control sensor-cover including a bottom cover member wherein indium or an indium-containing alloy is deposited, by using a non-conductive vacuum metallization (NCVM) method, on a front surface of a bottom cover body having a logo and an outer frame protruding three-dimensionally and a top cover body including a transparent material and having a back surface formed in a shape corresponding to the front surface of the bottom cover member, wherein the top cover member is assembled integrally with the front surface of the bottom cover member, and a laser etching process is partially selectively performed only on the logo or the outer edge on the back surface of the top cover body to partially form an etched surface.