Patents by Inventor Tae-young Song
Tae-young Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250141746Abstract: The present disclosure according to at least one embodiment provides a method of providing a multi-transmission path service on a cloud virtual network, the method being performed by a computing system.Type: ApplicationFiled: October 28, 2024Publication date: May 1, 2025Applicant: Samsung SDS TowerInventors: Seon Ok PARK, Hyun Min JUNG, Byung Hyun CHO, Seung Je LEE, Si Hun SONG, Tae Kyoung SON, Kyu CHOI, Yong Ho KIM, Ji Hee SUH, Dong Mun YANG, Jang Myoung LEE, Seung Ki KIM, Kyoung Ho SEO, Ji Young YOON, Jin Yong PARK, Won Ho NA
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Publication number: 20250120261Abstract: A display device includes: a first substrate including an emission area and a non-emission area; a light emitting element on the first substrate in the emission area; a pixel defining layer on the first substrate in the non-emission area; an encapsulation layer on the light emitting element and the pixel defining layer; a first bank on the encapsulation layer in the non-emission area; and a second bank on the encapsulation layer in the non-emission area, and including: a main portion that does not overlap with the first bank; and a protrusion portion overlapping with the first bank, and connected to the main portion.Type: ApplicationFiled: June 14, 2024Publication date: April 10, 2025Inventors: Tae Young SONG, Bu Yong KIM, Jin Won KIM, Dong Gyu BAECK, Hye Jin PAEK
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Patent number: 12260909Abstract: Operating a selector device that controls access of a signal to a memory element may comprise applying a main operating voltage pulse and a refresh voltage pulse to the selector device. The refresh voltage pulse and main operating voltage pulse have opposite polarities. A magnitude of the main operating voltage pulse is greater than or equal to a threshold voltage for turning on the selector device, and a maximum magnitude of the refresh voltage pulse is less than the threshold voltage. The refresh voltage pulse reduces a difference between the threshold voltage and a turn-off voltage of the selector device, and may be applied immediately before or immediately after the main operating voltage pulse. An electronic circuit may include the selector device and a driving circuit for apply the pulses. A nonvolatile memory may include the driving circuit and a plurality of nonvolatile memory elements each including a selector device.Type: GrantFiled: March 22, 2023Date of Patent: March 25, 2025Assignees: SK hynix Inc., FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUSInventors: Tae Jung Ha, Soo Gil Kim, Jeong Hwan Song, Byung Joon Choi, Ha Young Lee
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Publication number: 20250074624Abstract: An aircraft assembly system includes a jig; and a position adjuster connected to the jig and configured to adjust a position of the jig, wherein the jig includes a ball stud between the jig and the position adjuster, and the position adjuster includes a socket in which at least a portion of the ball stud is accommodated and in which the ball stud is rotatably fastened.Type: ApplicationFiled: January 29, 2024Publication date: March 6, 2025Inventors: Dong Ho Lee, Myung Kyun Jeong, Chang Hoon Lee, Tae Hwan Kwak, Sang Bin Han, Suk Hyun Yoon, Tae Jin Song, Jun Young Choi, Cheol Bae Park
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Publication number: 20250068041Abstract: A camera module is provided. The lens module includes a substrate on which an image sensor is disposed; a lens module, disposed in an inner housing of the camera module, and further disposed on a first surface of the substrate; and a heat transfer member, including a thermoelectric element, and disposed on a second surface of the substrate, wherein the substrate includes a heat transfer portion, wherein the heat transfer portion includes a plurality of holes which penetrate the substrate, and wherein a heat transfer material is disposed in the plurality of holes.Type: ApplicationFiled: April 17, 2024Publication date: February 27, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Won SONG, Tae Young CHOI, Young An CHOI
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Publication number: 20250063892Abstract: There is provided a display device including a first substrate including a light emission area and a non-light emission area; a first pixel electrode on the light emission area of the first substrate; a pixel defining layer on the non-light emission area of the first substrate, defining a first opening; a thin film encapsulation layer on the first pixel electrode and the pixel defining layer; a first light control layer overlapping the light emission area, on the thin film encapsulation layer; a planarization layer on the thin film encapsulation layer; and a bank pattern overlapping the non-light emission area, on the planarization layer and defining a second opening, wherein the first light control layer includes a first surface directed toward the first pixel electrode, a first side directed toward the bank pattern, and a first inclined surface connecting the first surface with the first side, and the planarization layer is in contact with the first inclined surface.Type: ApplicationFiled: February 7, 2024Publication date: February 20, 2025Inventors: Tae Young SONG, Sun Young KWON, Bu Yong KIM, Jin Won KIM, Hye Jin PAEK, Won Gap YOON
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Publication number: 20250042944Abstract: The present invention relates to squid-derived peptides and uses thereof and, more specifically, to uses of squid-derived peptides squidtocin and pro-sepiatocin for prevention or treatment of V1B receptor-related diseases. It has been confirmed that the squidtocin and pro-sepiatocin according to the present invention have an effect of inducing activation of a V1B receptor which is a type of vasopressin receptor. The V1B receptor which is a type of vasopressin receptor is present in the anterior pituitary and in the hippocampal CA2 region, and it is known that the V1B receptor increases intracellular calcium concentration and is involved in response to stress and sociality. Accordingly, the squidtocin and the pro-sepiatocin according to the present invention can be used in various ways in the field of prevention, amelioration, or treatment of V1B receptor-related diseases.Type: ApplicationFiled: December 5, 2022Publication date: February 6, 2025Inventors: Seon Mi Jo, Seung Hyun Jung, Jei Ha Lee, Hea Bin Kim, Jeong Hyeon Choi, Kyung Hwa Baek, Ha Yeun Song, Tae Young Choi, Ki Hyun Kim
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Patent number: 12217707Abstract: A display device includes light emitting pixels that emit light, photosensors each controlling a sensed current according to an incident light, and a read-out circuit that senses the sensed current of each of the photosensors and converts the sensed current into digital sensed data. In a sensing mode including a first frame period and a second frame period, the light emitting pixels include first sensing pixels that emit the light during the first frame period and second sensing pixels that do not emit the light during the first frame period, the photosensors include first photosensors and second photosensors, and a first distance between any one of the first sensing pixels and a first photosensor adjacent to the first sensing pixel among the first photosensors is greater than a second distance between the first sensing pixel and a second photosensor adjacent to the first sensing pixel among the second photosensors.Type: GrantFiled: March 1, 2023Date of Patent: February 4, 2025Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Bo Kwang Song, Tae Kyung Ahn, Gun Hee Kim, Dae Young Lee
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Publication number: 20250037373Abstract: The present specification provides: a method for generating a virtual organoid having various shapes and features; and a virtual organoid imaging method capable of obtaining the same effect as image data obtained from an actual organoid. The virtual organoid generation method according to the present specification may generate data relating to an organoid structure in a virtual space so as to apply the feature of an actual organoid. The imaging method using the virtual organoid according to the present specification enables generation of image data which can obtain the same effect as capturing an image of an actual organoid.Type: ApplicationFiled: May 6, 2022Publication date: January 30, 2025Inventors: Ji Hun YANG, Eui Jeong SONG, Tae Hwan KWAK, Si Young LEE
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Publication number: 20250026835Abstract: The present disclosure relates to an isolated anti-FcRN antibody, which is an antibody binding to FcRN (stands for neonatal Fc receptor, also called FcRP, FcRB or Brambell receptor) that is a receptor with a high affinity for IgG or a fragment thereof, a method of preparing thereof, a composition for treating autoimmune disease, which comprises the antibody, and a method of treating and diagnosing autoimmunre diseases using the antibody. The FcRn-specific antibody according to the present disclosure binds to FcRn non-competitively with IgG to reduce serum pathogenic auto-antibody levels, and thus can be used for the treatment of autoimmune diseases.Type: ApplicationFiled: July 3, 2024Publication date: January 23, 2025Applicant: HANALL BIOPHARMA CO., LTD.Inventors: Sung Wuk KIM, Seung Kook PARK, Jae Kap JEONG, Hyea Kyung AHN, Min Sun KIM, Eun Sun KIM, Hae-Young YONG, Dongok SHIN, Yeon Jung SONG, Tae Hyoung YOO
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Patent number: 12204365Abstract: A data receiver, which communicates with a data transmitter through a plurality of lanes, includes: a first reception unit which receives first data through a first lane; a second reception unit which receives second data through a second lane; and a detector which compares the first data and the second data to detect a skew between the first lane and the second lane. The first reception unit includes a first clock data recovery unit which recovers a first clock and first payload data from the first data. The first reception unit controls a loop speed of the first clock data recovery unit based on a skew level of the skew.Type: GrantFiled: March 25, 2022Date of Patent: January 21, 2025Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Jun Dal Kim, Dong Won Park, Hyun Su Kim, Kyung Youl Min, Jong Man Bae, Jun Yong Song, Tae Young Jin
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Publication number: 20240413273Abstract: A display device includes a first substrate, a transistor disposed on the first substrate, a light emitting device connected to the transistor, an encapsulation layer covering the light emitting device, a plurality of banks disposed to overlap the encapsulation layer in a plan view and partitioning a first emission area, a second emission area, and a third emission area, a first color conversion layer disposed in the first emission area, a second color conversion layer disposed in the second emission area, and a transmission layer disposed in the third emission area. A thickness of at least one of the first color conversion layer or the second color conversion layer is greater than a thickness of the plurality of banks.Type: ApplicationFiled: February 28, 2024Publication date: December 12, 2024Applicant: Samsung Display Co., LTD.Inventors: Tae Young SONG, Jin Won KIM, Hye-Jin PAEK
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Publication number: 20230209959Abstract: A display device includes: a substrate including a first emission area, a second emission area, and a third emission area; a first wavelength conversion pattern overlapping the first emission area; a second wavelength conversion pattern overlapping the second emission area; and a light-transmitting pattern overlapping the third emission area, wherein the first wavelength conversion pattern includes first wavelength shifters configured to convert a first light into a second light, and first scatterers, the second wavelength conversion pattern includes second wavelength shifters configured to convert the first light into a third light, and second scatterers, and a ratio between a concentration of the first wavelength shifters and a concentration of the second wavelength shifters is 1:1.1 to 1:1.3.Type: ApplicationFiled: September 21, 2022Publication date: June 29, 2023Inventors: Young Soo KWON, Sun Young KWON, Min Seok KIM, Bu Yong KIM, Song Yi KIM, Soo Dong KIM, Su Jin KIM, Jin Won KIM, Da Hye PARK, Dong Gyu BAECK, Hye Jin PAEK, Tae Young SONG, Keun Chan OH, Won Gap YOON, Ki Heon LEE, Myung Jin LEE, Hyeok Jin LEE, Woo Man JI, Ho Yeon JI, Yong Seok CHOI
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Publication number: 20230187463Abstract: An image sensor substrate includes a semiconductor substrate layer and a semiconductor epitaxial layer on the substrate layer. The semiconductor substrate layer has a boron (B) doping concentration therein in a range from 3×1018 cm?3 to 1×1019 cm?3, whereas the semiconductor epitaxial layer has a boron (B) doping concentration therein in a range from 1×1016 cm?3 to 6×1016 cm?3.Type: ApplicationFiled: November 30, 2022Publication date: June 15, 2023Inventors: Hye Yun Park, Yeon Sook Kim, In Ji Lee, Tae Young Song
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Publication number: 20230139303Abstract: A manufacturing method of a display device according to an embodiment includes forming a bank separating a first opening, a second opening, and a third opening on a first substrate, forming a scatterer layer in the first opening, the second opening, and the third opening, forming a first ink layer in the first opening, forming a second ink layer in the second opening, and forming a third ink layer in the third opening.Type: ApplicationFiled: July 7, 2022Publication date: May 4, 2023Applicant: Samsung Display Co., LTD.Inventors: Youngsoo KWON, Sun Young KWON, Tae Young SONG, Keun Chan OH, Won-Gap YOON, Myung Jin LEE, Hyeok Jin LEE, Yongseok CHOI
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Patent number: 11482564Abstract: A method of manufacturing an image sensing apparatus includes: forming a first substrate structure including a first region of a pixel region, the first substrate structure having a first surface and a second surface; forming a second substrate structure including a circuit region for driving the pixel region, the second substrate structure having a third surface and a fourth surface; bonding the first substrate structure to the second substrate structure, such that the first surface is connected to the third surface; forming a second region of the pixel region on the second surface; forming a first connection via, the first connection via extending from the second surface to pass through the first substrate structure; mounting semiconductor chips on the fourth surface, using a conductive bump; and separating a stack structure of the first substrate structure, the second substrate structure, and the semiconductor chips into unit image sensing apparatuses.Type: GrantFiled: July 29, 2020Date of Patent: October 25, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Sung Hyun Yoon, Doo Won Kwon, Kwan Sik Kim, In Gyu Baek, Tae Young Song
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Publication number: 20220243084Abstract: An ink composition includes a plurality of quantum dots, a liquid monomer, an initiator, and optionally an organic solvent, wherein the plurality of quantum dots includes: a first quantum dot including a first ligand, and a second quantum dot including a second ligand different from the first ligand, and the ink composition is configured to emit a first light.Type: ApplicationFiled: November 21, 2021Publication date: August 4, 2022Inventors: Soo Dong Kim, Bu Yong Kim, Da Hye Park, Tae Young Song, Ki Heon Lee
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Patent number: 10998366Abstract: An image sensing apparatus includes a first substrate structure, a second substrate structure, and a memory chip. The first substrate structure includes a pixel region having a photoelectric conversion element. The second substrate structure includes a first surface connected to the first substrate structure and a second surface opposite the first surface, and also includes a circuit region to drive the pixel region. The memory chip is mounted on the second surface of the second substrate structure. The first substrate structure and the second substrate structure are electrically connected by first connection vias passing through the first substrate structure. The second substrate structure and the memory chip are electrically connected by second connection vias passing through a portion of the second substrate structure. The first connection vias and the second connection vias are at different positions on a plane.Type: GrantFiled: January 2, 2020Date of Patent: May 4, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Sung Hyun Yoon, Doo Won Kwon, Kwan Sik Kim, Tae Young Song, Min Jun Choi
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Publication number: 20200357834Abstract: A method of manufacturing an image sensing apparatus includes: forming a first substrate structure including a first region of a pixel region, the first substrate structure having a first surface and a second surface; forming a second substrate structure including a circuit region for driving the pixel region, the second substrate structure having a third surface and a fourth surface; bonding the first substrate structure to the second substrate structure, such that the first surface is connected to the third surface; forming a second region of the pixel region on the second surface; forming a first connection via, the first connection via extending from the second surface to pass through the first substrate structure; mounting semiconductor chips on the fourth surface, using a conductive bump; and separating a stack structure of the first substrate structure, the second substrate structure, and the semiconductor chips into unit image sensing apparatuses.Type: ApplicationFiled: July 29, 2020Publication date: November 12, 2020Inventors: Sung Hyun YOON, Doo Won KWON, Kwan Sik KIM, In Gyu BAEK, Tae Young SONG
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Patent number: 10741607Abstract: A method of manufacturing an image sensing apparatus includes: forming a first substrate structure including a first region of a pixel region, the first substrate structure having a first surface and a second surface; forming a second substrate structure including a circuit region for driving the pixel region, the second substrate structure having a third surface and a fourth surface; bonding the first substrate structure to the second substrate structure, such that the first surface is connected to the third surface; forming a second region of the pixel region on the second surface; forming a first connection via, the first connection via extending from the second surface to pass through the first substrate structure; mounting semiconductor chips on the fourth surface, using a conductive bump; and separating a stack structure of the first substrate structure, the second substrate structure, and the semiconductor chips into unit image sensing apparatuses.Type: GrantFiled: May 2, 2018Date of Patent: August 11, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Sung Hyun Yoon, Doo Won Kwon, Kwan Sik Kim, In Gyu Baek, Tae Young Song