Abstract: A driving circuit includes: a display driver to generate a horizontal synchronization signal and a vertical synchronization signal according to a first clock signal of a first oscillator; a sensor driver to generate a touch signal according to a second clock signal of a second oscillator; and a determination circuit to detect a cycle of at least one of the horizontal synchronization signal or the vertical synchronization signal according to the second clock signal, and output a detection signal when the cycle is out of a range. The determination circuit is a part of the display driver or the sensor driver.

Abstract: Photonically steered impedance surface antennas are disclosed. A disclosed example apparatus includes a semiconductor substrate to be communicatively coupled to a radio frequency (RF) source, an at least partially transparent dielectric layer, the semiconductor substrate at a first side of the at least partially transparent dielectric layer, an at least partially transparent conductive film at a second side of the at least partially transparent dielectric layer that is opposite the first side of the at least partially transparent dielectric layer, and an illumination source to illuminate at least a portion of the semiconductor substrate to generate a photoinduced solid-state plasma pattern that beam steers an RF signal corresponding to the RF source.

Abstract: A package-to-package communication system is provided including a first package having integrated on a first substrate a first antenna, a second antenna, and a first transceiver coupled to the first antenna and the second antenna. The first antenna is arranged along a first edge of the first substrate. The second antenna is arranged along a second edge of the first substrate. A second package having integrated on a second substrate a third antenna, a fourth antenna and a second transceiver coupled to the third antenna and the fourth antenna. The third antenna is arranged along a third edge of the second substrate. The fourth antenna is arranged along a fourth edge of the second substrate. The first antenna and the third antenna are configured to communicate signals of a vertical polarization. The second antenna and the fourth antenna are configured to communicate signals of a horizontal polarization.

Abstract: A communication system, including a first carrier and a first antenna mounted on the first carrier; a second carrier and a second antenna mounted on the second carrier, wherein the first antenna and the second antenna are arranged relative to each other that the first antenna and the second antenna can establish wireless link; a third carrier and a third antenna mounted on the third carrier; a fourth carrier and a fourth antenna mounted on the fourth carrier, wherein the third antenna and the fourth antenna are arranged relative to each other that the third antenna and the fourth antenna can establish wireless link; and a transmission structure, within which the signal propagate through, connects the second antenna and the third antenna.

Abstract: An antenna array architecture is provided for beamforming applications. The antenna array architecture facilitates a compact and wideband dual-polarized beam-switching antenna array architecture, which may be implemented in a cost-effective multi-layer PCB or package. The antenna array architecture is implemented as part of a package substrate having a number of layers. Each of the layers comprises various conductive elements such as conductive segments and/or traces that are disposed thereon in accordance with the respective antenna components.

Abstract: Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.

Abstract: In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.

Abstract: In various aspects, a radio frequency circuit is provided. The radio frequency circuit may include a substrate that may include a radio frequency front-end to antenna (RF FE-to-Ant) connector. The RF FE-to-Ant connector may include a conductor track structure and a substrate connection structure coupled to the conductor track structure. The substrate may include radio frequency front-end circuitry monolithically integrated in the substrate. The substrate connection structure may include at least one of a solderable structure, a weldable structure, or an adherable structure. The substrate connection structure may be configured to form at least one radio frequency signal interface with an antenna circuit connection structure of a substrate-external antenna circuit. The substrate may include an edge region. The substrate connection structure may be disposed in the edge region.

Abstract: A communication device may include a millimeter wave (mm-wave) antenna array having antenna elements, a mm-wave element (e.g. lens), and one or more transceivers (e.g. first and second transceivers). The mm-wave lens may be configured to adjust the first beam and the second beam as the first and second beams pass through the mm-wave lens. The first transceiver can selectively couple to the antenna elements, the first transceiver being configured to drive a first selected antenna element of the antenna elements to transmit a beam from the selected first antenna element. The second transceiver may selectively couple to the antenna elements, the second transceiver being configured to drive a second selected antenna element of the antenna elements to transmit a second beam from the selected second antenna element.

Abstract: A substrate integrated waveguide (SIW) cavity antenna is described that enables dual frequency and broadband operation, as well as enhanced protection from radio frequency interference (RFI) that may be present within an electronic device environment. The SIW cavity antenna includes a capacitively-coupled feed that is disposed within the volume of the SIW cavity antenna, which is enclosed on four sides via a set of electrically-conductive plates. The SIW cavity antenna radiates using the remaining two open sides as apertures. The SIW cavity antenna may include a meander line radiator to facilitate the operation of a second frequency band, as well as the use of a tuning stub to further enhance the impedance bandwidth.

Abstract: For example, an apparatus may include a Printed Circuit Board (PCB); a Multiple-Input-Multiple-Output (MIMO) radar antenna on the PCB, the MIMO radar antenna comprising a plurality of Transmit (Tx) antenna elements configured to transmit Tx radar signals, and a plurality of receive (Rx) antenna elements configured to receive Rx radar signals based on the Tx radar signals; and a surface wave mitigator connected to the PCB, the surface wave mitigator configured to mitigate an impact of surface waves via the PCB on a radiation pattern of the MIMO radar antenna.

Abstract: Devices and methods for testing microelectronic assemblies including wireless communications are disclosed herein. For example, in some embodiments, a wireless testing system may include a radio frequency (RF) shielded chamber; a device under test (DUT) in the RF shielded chamber, wherein the DUT includes an array of first antenna elements; a testing apparatus in the RF shielded chamber including an array of second antenna elements at a first surface of a substrate to receive a test signal from the DUT, wherein a distance between individual second antenna elements and an adjacent second antenna element is at least half of a wavelength of the test signal, and wherein a distance between the first antenna elements and the second antenna elements is within a near-field region; and an array of electrical switches, wherein an individual electrical switch is coupled to a respective individual second antenna element.

Abstract: For example, an apparatus may include a Printed Circuit Board (PCB); a Multiple-Input-Multiple-Output (MIMO) radar antenna on the PCB, the MIMO radar antenna comprising a plurality of Transmit (Tx) antenna elements configured to transmit Tx radar signals, and a plurality of receive (Rx) antenna elements configured to receive Rx radar signals based on the Tx radar signals; and a surface wave mitigator connected to the PCB, the surface wave mitigator configured to mitigate an impact of surface waves via the PCB on a radiation pattern of the MIMO radar antenna.

Abstract: Various embodiments provide systems, devices, and methods for an antenna assembly included in an integrated circuit (IC) package. The antenna assembly may be used for near field wireless communication such as package-to-package and/or chip-to-chip communication. The antenna assembly may include a feed plate (e.g., a top feed) that is capacitively coupled to a first via and a second via. The feed plate may further be capacitively coupled to a loading structure. The first via may be conductively coupled to a ground potential. In some embodiments, the antenna assembly may further include a stub structure (e.g., an open stub or a short stub) that is conductively coupled to the second via. An impedance matching network may be coupled between the feed plate and an IC die that communicates using the antenna assembly. Other embodiments may be described and claimed.

Abstract: In some embodiments, a computer system chassis comprises a chassis side having an antenna portion and a fan portion. The antenna portion is located closer to an antenna located on an external surface of the chassis side than the fan portion. The antenna and fan portions comprise ventilation holes that provide for the venting of heated air from the chassis interior to the surrounding environment. In some embodiments, the ventilation holes in the antenna portion are thicker than the ventilation holes in the fan portion. The thicker ventilation holes provide an adequate level of EMI shielding for the antenna from platform noise generated by components (CPUs, GPUs, memories, etc.) located in the chassis interior. In other embodiments, the antenna portion comprises alternating positive and negative cross pattern ventilation holes and provides an adequate level of EMI shielding with the antenna portion ventilation holes having the same thickness as the fan portion ventilation holes.

Abstract: A lens antenna system is disclosed. The lens antenna system comprises a hybrid focal source antenna circuit configured to generate a source antenna beam for integration with different lens structures. In some embodiments, the hybrid focal source antenna circuit comprises a set of antenna elements coupled to one another. In some embodiments, the set of antenna elements comprises a first antenna element configured to be excited in a first spherical mode; and a second antenna element configured to be excited in a second, different, spherical mode. In some embodiments, the first spherical mode and the second spherical mode are co-polarized. In some embodiments, the lens antenna system further comprises a lens configured to shape the source antenna beam associated with the hybrid focal source antenna circuit, in order to provide an output antenna beam.

Abstract: A communication device may include a millimeter wave (mm-wave) antenna array having antenna elements, a mm-wave element (e.g. lens), and one or more transceivers (e.g. first and second transceivers). The mm-wave lens may be configured to adjust the first beam and the second beam as the first and second beams pass through the mm-wave lens. The first transceiver can selectively couple to the antenna elements, the first transceiver being configured to drive a first selected antenna element of the antenna elements to transmit a beam from the selected first antenna element. The second transceiver may selectively couple to the antenna elements, the second transceiver being configured to drive a second selected antenna element of the antenna elements to transmit a second beam from the selected second antenna element.

Abstract: In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element.

Abstract: A radar device may include a digital to analog converter (DAC) stage. The DAC stage may generate a plurality of analog signals. The DAC stage may generate a different analog signal for each transmitter chain of a plurality of transmitter chains. Each analog signal of the plurality of analog signals may represent a single digital signal. Each transmitter chain of the plurality of transmitter chains may include a transmit chain portion and switched analog beamforming network (BFN). The transmit chain portion may generate a plurality of intermediate analog signals representative of the corresponding analog signal. The switched analog BFN may generate a plurality of analog transmit signals for an intermediate analog signal of the plurality of intermediate analog signals. The plurality of analog transmit signals may include a beam formed in accordance with a state of the switched analog BFN.

Abstract: An antenna module and communication device containing the antenna module are disclosed. The antenna module is disposed in a metal cavity. The antenna module includes a switched beam mm-wave antenna array having radiating elements separated by less than a wavelength of the radiating elements. The array is fed by a single transceiver chain. The array is disposed at the focal length of a low-profile mm-wave lens configured to steer the beam. A sub-10 GHz antenna is disposed closer to the opening of the cavity than the lens. The lens is a Fresnel Zone Plate lens having a focal length of less than about the wavelength of the beam, or a Saucer lens having shells of different refractive indexes and having a profile that is more than 6 times smaller than a Luneburg lens with a same focal length.