Patents by Inventor Tae Yun Lim

Tae Yun Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163278
    Abstract: Disclosed is a user authentication-based packet classification method and apparatus for providing differentiated security services in a ship network. A user authentication-based packet classification method includes receiving an authorization code request message from a user terminal including a client, authenticating and authorizing a user of the client based on the authorization code request message, transmitting an authorization code response message to the user terminal in response to the authorization code request message, receiving an access token request message from the user terminal based on the authorization code response message, and transmitting an access token response message including an access token to the user terminal in response to the access token request message.
    Type: Application
    Filed: August 7, 2023
    Publication date: May 16, 2024
    Inventors: Jin Hyeok OH, Keon YUN, Sun Woo YUN, Sang Min LEE, Myong Cheol LIM, Sang Gyoo SIM, Tae Gyun KIM
  • Patent number: 11981848
    Abstract: A quantum dot including a semiconductor nanocrystal core including Group III-V compound, a first semiconductor nanocrystal shell disposed on the semiconductor nanocrystal core, the first semiconductor nanocrystal shell including zinc and selenium, and a second semiconductor nanocrystal shell disposed on the first semiconductor nanocrystal shell, the second semiconductor nanocrystal shell including zinc and sulfur, and a composite/electronic device. The quantum dot does not include cadmium and the first semiconductor nanocrystal shell includes a polyvalent metal dopant at an interface with the second semiconductor nanocrystal shell.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: May 14, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Jun Park, Junghwa Kim, Tae Gon Kim, Taekhoon Kim, Young Mo Sung, Nayoun Won, Dongjin Yun, Mi Hye Lim, Shin Ae Jun, Hyeonsu Heo
  • Patent number: 6395608
    Abstract: A heterojunction bipolar transistor and its fabrication method is disclosed. The heterojunction bipolar transistor includes a substrate; a collector layer formed to have a ledge or MESA on the substrate; a collector electrode formed on the collector layer surrounding the ledge; a base layer formed on the ledge of the collector layer; an ohmic cap layer on the emitter layer; an emitter layer formed in the center of the base layer; an emitter electrode formed on the ohmic cap layer; a base electrode formed on the base layer surrounding the emitter electrode; an insulating layer formed to cover the base electrode and to overlay on the insulating layer; a metal wire formed to cover the emitter electrode; and an air bridge brought in contact with the metal wire and electrically connected to an external pad lying on an ion-implanted isolation region.
    Type: Grant
    Filed: January 29, 2001
    Date of Patent: May 28, 2002
    Assignee: LG Electronics Inc.
    Inventors: Jin Ho Shin, Tae Yun Lim, Hyung Wook Kim
  • Publication number: 20010005025
    Abstract: A heterojunction bipolar transistor and its fabrication method is disclosed. The heterojunction bipolar transistor includes a substrate; a collector layer formed to have a ledge or MESA on the substrate; a collector electrode formed on the collector layer surrounding the ledge; a base layer formed on the ledge of the collector layer; an ohmic cap layer on the emitter layer; an emitter layer formed in the center of the base layer; an emitter electrode formed on the ohmic cap layer; a base electrode formed on the base layer surrounding the emitter electrode; an insulating layer formed to cover the base electrode and to overlay on the insulating layer; a metal wire formed to cover the emitter electrode; and an air bridge brought in contact with the metal wire and electrically connected to an external pad lying on an ion-implanted isolation region.
    Type: Application
    Filed: January 29, 2001
    Publication date: June 28, 2001
    Applicant: LG Electronics Ins.
    Inventors: Jin Ho Shin, Tae Yun Lim, Hyung Wook Kim