Patents by Inventor Taechung Yi

Taechung Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Digital optical switch apparatus and process for manufacturing same
    Patent number: 7236279
    Abstract: The present invention provides a digital optical switch apparatus and process for manufacturing the apparatus. The apparatus includes a mirror assembly coupled to a top cap and to a bottom cap. The top and bottom caps each include one or more electrodes that, when energized with electrical energy, move a mirrored surface to one of a plurality of discrete positions. Mirror assemblies can be cascaded to create a packaged assembly having any multiple of discrete positions. The process includes planar micro-machining techniques to create isolated islands for electrical feed through. The process enables mechanical bonding of multiple tiers via a single bond region and through a bond-pad window.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: June 26, 2007
    Assignee: Input/Output, Inc.
    Inventors: Duli Yu, Arjun Selvakumar, Howard Goldberg, Taechung Yi
  • Digital optical switch apparatus and process for manufacturing same
    Publication number: 20030118277
    Abstract: The present invention provides a digital optical switch apparatus and process for manufacturing the apparatus. The apparatus includes a mirror assembly coupled to a top cap and to a bottom cap. The top and bottom caps each include one or more electrodes that, when energized with electrical energy, move a mirrored surface to one of a plurality of discrete positions. Mirror assemblies can be cascaded to create a packaged assembly having any multiple of discrete positions. The process includes planar micro-machining techniques to create isolated islands for electrical feed through. The process enables mechanical bonding of multiple tiers via a single bond region and through a bond-pad window.
    Type: Application
    Filed: October 18, 2002
    Publication date: June 26, 2003
    Applicant: Input/Output, Inc.
    Inventors: Duli Yu, Arjun Selvakumar, Howard Goldberg, Taechung Yi