Patents by Inventor Taehoi HWANG

Taehoi HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module
    Patent number: 11791236
    Abstract: A semiconductor module may include a first PCB, at least one first semiconductor chip, a heat sink and at least one first TEC. The at least one semiconductor chip is on the first PCB. The heat sink may be configured to surround the first PCB and the at least one semiconductor control chip. The first TEC may be on the first PCB to cool heat from the first PCB. Thus, performances of the semiconductor module may not be deteriorated by the heat.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: October 17, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jaebeom Byun, Taehoi Hwang
  • SEMICONDUCTOR MODULE
    Publication number: 20220165640
    Abstract: A semiconductor module may include a first PCB, at least one first semiconductor chip, a heat sink and at least one first TEC. The at least one semiconductor chip is on the first PCB. The heat sink may be configured to surround the first PCB and the at least one semiconductor control chip. The first TEC may be on the first PCB to cool heat from the first PCB. Thus, performances of the semiconductor module may not be deteriorated by the heat.
    Type: Application
    Filed: June 29, 2021
    Publication date: May 26, 2022
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jaebeom BYUN, Taehoi HWANG