Abstract: Disclosed are semiconductor packages and methods of manufacturing the same. The method of manufacturing a semiconductor package may include providing a carrier substrate having a trench formed on a first top surface of the carrier substrate, providing a first semiconductor chip on the carrier substrate, mounting at least one second semiconductor chip on a second top surface of the first semiconductor chip, coating a mold member to surround a first lateral surface of the first semiconductor chip and a second lateral surface of the at least one second semiconductor chip, and curing the mold member to form a mold layer. The trench may be provided along a first edge of the first semiconductor chip. The mold member may cover a second edge of a bottom surface the first semiconductor chip.

Abstract: An electronic device is disclosed that includes a display panel, a data driving circuit, a scan driving circuit, and a driving controller. The driving controller generates image data based on a received image signal. The driving controller includes a minimum emission gray level determining unit that determines a gray level of the image signal, a pattern determining unit that determines a dither pattern of the image signal, a driving frequency sensing unit that determines a driving frequency of the image signal, and a data compensation unit that compensates for the image data based on the gray level and at least one of the dither pattern and the driving frequency.

Abstract: A variable resistance memory device includes a substrate, a first conductive line on the substrate, the first conductive line extending in a first horizontal direction, a second conductive line extending on the first conductive line in a second horizontal direction perpendicular to the first horizontal direction, and a memory cell at an intersection between the first conductive line and the second conductive line, the memory cell having a selection element layer, an intermediate electrode layer, and a variable resistance layer, and the variable resistance layer having a shape of stairs with a concave center.

Abstract: An electronic device is provided. The electronic device includes a foldable housing and a flexible display. The foldable housing may provide a front surface of the electronic device and a rear surface of the electronic device. The flexible display may be located in an inner space of the foldable housing. The flexible display may be combined with a front cover of the foldable housing providing the front surface. The front cover may include a pattern in which a plurality of openings corresponding to a folding portion of the foldable housing or a plurality of recesses provided in a surface facing the flexible display are periodically provided. A plurality of sub-pixels emitting light of a same wavelength in the flexible display may be arranged in a same direction as a direction in which the plurality of openings or the plurality of recesses are periodically arranged.

Abstract: The present invention relates to a magnetic sensor based on a Wheatstone bridge and a manufacturing method thereof. The magnetic sensor according to an embodiment includes a magnetic field sensing unit that is provided with a plurality of magneto resistors forming a resistance bridge, a magneto resistor monitoring unit that monitors resistance values of the plurality of magneto resistors, and an offset adjusting unit that adjusts a resistance value of a thin film variable resistor connected to at least one terminal among a plurality of current terminals provided in the resistance bridge based on the monitoring result of the resistance values.

Abstract: An electronic apparatus is provided. The electronic apparatus includes a camera; a memory configured to store at least one instruction; and at least one processor configured to execute the at least one instruction to: detect at least one object included in an image captured by the camera; identify information on an engagement of each of the at least one object with the electronic apparatus; obtain gesture information of each of the at least one object; obtain a target object from among the at least one object based on an operation status of the electronic apparatus, the information on the engagement of each of the at least one object, and the obtained gesture information of each of the at least one object; identify a function corresponding to gesture information of the target object; and execute the identified function.

Abstract: Provided is an electronic device according to an embodiment of the inventive concept may include a display panel including a plurality of pixels respectively connected to a plurality of data lines and a plurality of scan lines, a data driving circuit connected to the plurality of data lines, a scan driving circuit connected to the plurality of scan lines, and a driving controller generating image data, and controlling the data driving circuit and the scan driving circuit to display a plurality of frames at a first frequency on the display panel based on the image data, wherein at least one of the plurality of frames includes an effective interval during which an image is transmitted, a blanking interval during which the image is not transmitted, and a refresh interval operating at a second frequency different from the first frequency.

Abstract: A semiconductor package including a first substrate including a first bump pad and a filling compensation film (FCF) around the first bump pad; a second substrate facing the first substrate and including a second bump pad; a bump structure (BS) in contact with the first bump pad and the second bump pad; and a non-conductive film (NCF) surrounding the BS and between the first substrate and the second substrate, wherein the NCF covers an upper surface and an edge of the FCF.

Abstract: A semiconductor package includes a base chip including a passivation layer on an upper surface thereof, a semiconductor chip on the base chip, a bump on a lower surface of the semiconductor chip, an underfill layer covering the bump and covering the lower surface of the semiconductor chip, an encapsulant covering the semiconductor chip on the base chip, and an organic material layer on the passivation layer, wherein the base chip includes silicon (Si), the passivation layer has a first region in contact with the underfill layer and a second region, surrounding the first region, and the organic material layer is on the second region.

Abstract: Disclosed herein are a visual story generation method and apparatus for generating a story from a plurality of images by using a deep learning network. The visual story generation method includes: extracting features from a plurality of respective images by using the first extraction unit of a deep learning network; generating the structure of a story based on the overall feature of the plurality of images by using the second extraction unit of the deep learning network; and generating the story by using outputs of the first and second extraction units.

Abstract: Provided is a feed side spacer comprising a network structure, wherein the network structure includes a hexagonal eye, the hexagonal eye includes a pair of parallel portions parallel to a flow direction of a supply liquid, and an inclined portion disposed in a diagonal direction with respect to the flow direction of the supply liquid; the parallel portion has a length of 1 mm to 5 mm; the inclined portion has a length of 5.1 mm to 10 mm; and an angle formed by sides in contact with each other of the inclined portion is from 50° to 80°, and a separation membrane element comprising same.

Abstract: A system for monitoring alignment of a second component relative to a first component includes a camera, and a controller including a processor and a nontransitory memory. The controller is configured to receive a first captured image from the camera when the second component is in a predetermined position relative to the first component, receive a selection of a region of interest (ROI) in the first captured image, identify a visible feature of the second component within the ROI of the first captured image, receive captured images from the camera during a subsequent operation, identify a second captured image when the second component is expected to be in the predetermined position relative to the first component, and determine if the second component is in the predetermined position relative to the first component based on the second captured image and the identified visible feature of the first captured image.

Abstract: A semiconductor package includes a base structure, a lower semiconductor chip disposed on the base structure, an upper semiconductor chip disposed on the lower semiconductor chip, a connecting structure including a lower pad disposed on the lower semiconductor chip, an upper pad disposed under the upper semiconductor chip, and a connecting bump disposed between the lower pad and the upper pad, a dummy chip disposed on the upper semiconductor chip, an upper adhesive layer including an upper adhesive portion disposed between the upper semiconductor chip and the dummy chip, and an upper protrusion portion disposed at opposite sides of the upper adhesive portion, to surround lower portions of opposite side surfaces of the dummy chip, and a molding layer disposed at opposite sides of the dummy chip, to surround upper portions of the opposite side surfaces of the dummy chip and the upper protrusion portion.

Abstract: A method of forming a material film includes providing a non-photosensitive mask on a substrate to expose a partial region of the substrate, forming a material film on the partial region of the substrate using a sputtering process, removing the non-photosensitive mask, and heat-treating the substrate and the material film from which the non-photosensitive mask is removed under a first gas atmosphere. The material film includes a transition metal and a chalcogen element. The sputtering process may include an RF magnetron sputtering process. The heat treatment may be performed at a higher temperature than a temperature of the forming the material film.

Abstract: Provided is a feed spacer for reducing differential pressure of a reverse osmosis element, the feed spacer forming the reverse osmosis element, the feed spacer comprising a plurality of strands disposed in a mesh shape having predetermined intersection points, and wherein a vertical cross section of each of the strands has a rhombic shape such that a pressure loss of in the feed spacer is minimized by an effective flow of raw water at an interface of a reverse osmosis membrane, and a nozzle for forming the feed spacer.

Abstract: Disclosed is a semiconductor package comprising a first semiconductor chip and at least one second semiconductor chip on the first semiconductor chip. The second semiconductor chip includes first and second test bumps that are adjacent to an edge of the second semiconductor chip and are on a bottom surface of the second semiconductor chip. The first and second test bumps are adjacent to each other. The second semiconductor chip also includes a plurality of data bumps that are adjacent to a center of the second semiconductor chip and are on the bottom surface of the second semiconductor chip. A first interval between the second test bump and one of the data bumps is greater than a second interval between the first test bump and the second test bump. The one of the data bumps is most adjacent to the second test bump.

Abstract: Provided is a reverse osmosis spacer and a reverse osmosis element with a high recovery rate, and, more particularly, to a reverse osmosis spacer and a reverse osmosis element with a high recovery rate, which are capable of increasing a flow rate of produced water and decreasing less a salt removal rate in the reverse osmosis element during an operation at a high recovery rate with a structure of the reverse osmosis spacer that comprises the reverse osmosis element.

Abstract: Disclosed is a semiconductor package comprising a first semiconductor chip and at least one second semiconductor chip on the first semiconductor chip. The second semiconductor chip includes first and second test bumps that are adjacent to an edge of the second semiconductor chip and are on a bottom surface of the second semiconductor chip. The first and second test bumps are adjacent to each other. The second semiconductor chip also includes a plurality of data bumps that are adjacent to a center of the second semiconductor chip and are on the bottom surface of the second semiconductor chip. A first interval between the second test bump and one of the data bumps is greater than a second interval between the first test bump and the second test bump. The one of the data bumps is most adjacent to the second test bump.

Abstract: A display apparatus includes a backlight unit including a first light source for outputting a first color light, and a second light source for outputting a second color light that is different from the first color light, a switching element layer on the backlight unit, and including a plurality of switching elements, a liquid crystal layer on the switching element layer, and a color conversion layer on the liquid crystal layer, including a color-converting material for converting a color of light passing therethrough, including a first color area, a second color area, and a third color area, and including quantum dot particles.

Abstract: A mobile terminal includes a memory; a touch screen; a first camera having a first capturing angle; a second camera having a second capturing angle that is wider than the first capturing angle; and a controller. The controller is configured to: cause the touch screen to display a first preview image of the first camera, a second preview image of the second camera, or both the first and second preview images overlapping each other; cause the memory to store a first image taken by the first camera in response to a first capture command received while the first preview image is displayed; and cause the memory to store both the first image and a second image taken by the second camera when a wide-angle capturing condition is satisfied while at least one of the first preview image or the second preview image is displayed.