Patents by Inventor Taein Shin

Taein Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package including embedded cooling structure
    Patent number: 11990389
    Abstract: A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: May 21, 2024
    Assignee: Korea Advanced Institute Of Science And Technology
    Inventors: Keeyoung Son, Joung-Ho Kim, Subin Kim, Shinyoung Park, Seungtaek Jeong, Gapyeol Park, Boogyo Sim, Hyunwook Park, Taein Shin, Seongguk Kim, Kyungjune Son, Minsu Kim
  • SEMICONDUCTOR PACKAGE
    Publication number: 20230028887
    Abstract: A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.
    Type: Application
    Filed: December 14, 2021
    Publication date: January 26, 2023
    Inventors: Keeyoung Son, Joung-Ho Kim, Subin Kim, Shinyoung Park, Seungtaek Jeong, Gapyeol Park, Boogyo Sim, Hyunwook Park, Taein Shin, Seongguk Kim, Kyungjune Son, Minsu Kim