Patents by Inventor Taek-Min Kim

Taek-Min Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible cable jumper structure, and method for producing same
    Patent number: 11785713
    Abstract: A flexible cable jumper structure and manufacturing method thereof. The flexible cable jumper device of the present disclosure includes a cover layer, a first metal layer stacked on the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat-resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat-resistant layer and electrically connected to the first metal layer and the second metal layer.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: October 10, 2023
    Assignee: AMOGREENTECH CO., LTD.
    Inventors: Jeong-Sang Yu, Young-Suk Oh, Taek-Min Kim
  • FLEXIBLE CABLE JUMPER STRUCTURE, AND METHOD FOR PRODUCING SAME
    Publication number: 20220192004
    Abstract: A flexible cable jumper structure and manufacturing method thereof. The flexible cable jumper device of the present disclosure includes a cover layer, a first metal layer device of the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat-resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat-resistant layer and electrically connected to the first metal layer and the second metal layer.
    Type: Application
    Filed: January 13, 2020
    Publication date: June 16, 2022
    Inventors: Jeong-Sang Yu, Young-Suk Oh, Taek-Min Kim