Abstract: A user device is provided. The device includes a main power supply, and an auxiliary power supply. The main power supply provides a main power. The auxiliary power supply cuts off the main power according to a power level of the main power supply and provides an auxiliary power upon Sudden Power-Off (SPO).

Abstract: A method of manufacturing a light-emitting diode (LED) includes preparing a substrate, forming a plurality of semiconductor light-emitting units on the substrate, each of the plurality of semiconductor light-emitting units protruding from the substrate and including a first conductive semiconductor layer, and an active layer and a second conductive semiconductor layer, the active layer and the second conductive semiconductor layer sequentially covering the first conductive semiconductor layer, dipping the semiconductor light-emitting units into an aqueous solution containing metal salt and an alkaline ligand compound, and forming an electrode layer on the plurality of semiconductor light-emitting units, wherein the forming the electrode layer includes maintaining a temperature of the aqueous solution between about 40° C. and about 200° C.

Abstract: A probing interposer includes a supporting substrate with first and second surfaces facing each other and via patterns penetrating the supporting substrate. Each of the via patterns have a concave portion that is exposed through the first surface and has a shape recessed in a direction from the first surface toward the second surface. The concave portion has a width that is smaller than that of the via pattern, and the width decreases in the direction from the first surface toward the second surface.

Abstract: A semiconductor package includes first and second slave chips stacked vertically; and a master chip connected to the first and second slave chips, each of the slave chips including, a plurality of memory blocks, and a redundancy block, and the master chip including, a fuse block configured to repair a defective memory block detected from the first slave chip and a defective memory block detected from the second slave chip by using the redundancy block of the first slave chip and the redundancy block of the second slave chip, respectively, and a block selection circuit configured to, connect the redundancy blocks of the first and second slave chips, one or more non-defective ones of the plurality of memory blocks of the first slave chip, and one or more non-defective ones of the plurality of memory blocks of the second slave chip to an input/output circuit.

Abstract: A method is provided for controlling a write operation in a nonvolatile memory device to provide wear leveling, where the nonvolatile memory device includes multiple memory blocks. The method includes reading write indication information with respect to at least a selected memory block of the multiple memory blocks; determining whether a write order of data to be stored in the selected memory block is an ascending order or a descending order, based on the write indication information of the selected memory block; and generating addresses of memory regions in the selected memory block in an ascending order when the write order of the data is determined to be an ascending order, and generating addresses of the memory regions in the selected memory block in a descending order when the write order is determined to be a descending order.

Abstract: A user device is provided. The device includes a main power supply, and an auxiliary power supply. The main power supply provides a main power. The auxiliary power supply cuts off the main power according to a power level of the main power supply and provides an auxiliary power upon Sudden Power-Off (SPO).

Abstract: A semiconductor package includes first and second slave chips stacked vertically; and a master chip connected to the first and second slave chips, each of the slave chips including, a plurality of memory blocks, and a redundancy block, and the master chip including, a fuse block configured to repair a defective memory block detected from the first slave chip and a defective memory block detected from the second slave chip by using the redundancy block of the first slave chip and the redundancy block of the second slave chip, respectively, and a block selection circuit configured to, connect the redundancy blocks of the first and second slave chips, one or more non-defective ones of the plurality of memory blocks of the first slave chip, and one or more non-defective ones of the plurality of memory blocks of the second slave chip to an input/output circuit.

Abstract: A user device is provided. The device includes a main power supply, and an auxiliary power supply. The main power supply provides a main power. The auxiliary power supply cuts off the main power according to a power level of the main power supply and provides an auxiliary power upon Sudden Power-Off (SPO).

Abstract: A method is provided for controlling a write operation in a nonvolatile memory device to provide wear leveling, where the nonvolatile memory device includes multiple memory blocks. The method includes reading write indication information with respect to at least a selected memory block of the multiple memory blocks; determining whether a write order of data to be stored in the selected memory block is an ascending order or a descending order, based on the write indication information of the selected memory block; and generating addresses of memory regions in the selected memory block in an ascending order when the write order of the data is determined to be an ascending order, and generating addresses of the memory regions in the selected memory block in a descending order when the write order is determined to be a descending order.

Abstract: A semiconductor device has a semiconductor body including a source region, a channel region, and a drain region, which are sequentially arranged in a longitudinal direction and are doped with the same type of impurity, a gate electrode including metal, and a gate dielectric layer interposed between the semiconductor body and the gate electrode.

Abstract: In one embodiment, the semiconductor device includes a non-volatile memory cell array, a write circuit configured to write to the non-volatile memory cell array, and a control circuit. The control circuit is configured to store at least one erase indicator. The erase indicator is associated with at least a portion of the non-volatile memory cell array and indicates a logic state. The control circuit is configured to control the write circuit to write the logic state indicated by the erase indicator in the non-volatile memory cell array during an erase operation of the associated portion of the non-volatile memory cell array.

Abstract: In one embodiment, the semiconductor device includes a non-volatile memory cell array, a write circuit configured to write to the non-volatile memory cell array, and a control circuit. The control circuit is configured to store at least one erase indicator. The erase indicator is associated with at least a portion of the non-volatile memory cell array and indicates a logic state. The control circuit is configured to control the write circuit to write the logic state indicated by the erase indicator in the non-volatile memory cell array during an erase operation of the associated portion of the non-volatile memory cell array.

Abstract: Disclosed is a semiconductor memory device including a memory cell array having a plurality of variable resistance memory cells divided into first and second areas. An I/O circuit is configured to access the memory cell array under the control of control logic so as to access the first or second area in response to an external command. The I/O circuit accesses the first area using a memory cell unit and the second area using a page unit.

Abstract: A semiconductor memory device includes a memory cell array having a plurality of variable resistance memory cells divided into first and second areas. An I/O circuit is configured to access the memory cell array under the control of control logic so as to access the first or second area in response to an external command. The I/O circuit accesses the first area using a memory cell unit and the second area using a page unit.

Abstract: A data storage system comprising a storage device comprising at least one nonvolatile memory, and a controller connected to the storage device through a channel. The memory controller sends part or all of a command, address and data for a next operation to the nonvolatile memory while the nonvolatile memory device is in a busy state. The memory controller then performs a background operation while the nonvolatile memory device remains in the busy state.

Abstract: A user device is provided. The device includes a main power supply, and an auxiliary power supply. The main power supply provides a main power. The auxiliary power supply cuts off the main power according to a power level of the main power supply and provides an auxiliary power upon Sudden Power-Off (SPO).

Abstract: Disclosed is a semiconductor memory device including a memory cell array having a plurality of variable resistance memory cells divided into first and second areas. An I/O circuit is configured to access the memory cell array under the control of control logic so as to access the first or second area in response to an external command. The I/O circuit accesses the first area using a memory cell unit and the second area using a page unit.

Abstract: In one embodiment, the semiconductor device includes a non-volatile memory cell array, a write circuit configured to write to the non-volatile memory cell array, and a control circuit. The control circuit is configured to store at least one erase indicator. The erase indicator is associated with at least a portion of the non-volatile memory cell array and indicates a logic state. The control circuit is configured to control the write circuit to write the logic state indicated by the erase indicator in the non-volatile memory cell array during an erase operation of the associated portion of the non-volatile memory cell array.

Abstract: Disclosed is a semiconductor memory device including a memory cell array having a plurality of variable resistance memory cells divided into first and second areas. An I/O circuit is configured to access the memory cell array under the control of control logic so as to access the first or second area in response to an external command. The I/O circuit accesses the first area using a memory cell unit and the second area using a page unit.

Abstract: In one embodiment, the semiconductor device includes a non-volatile memory cell array, a write circuit configured to write to the non-volatile memory cell array, and a control circuit. The control circuit is configured to store at least one erase indicator. The erase indicator is associated with at least a portion of the non-volatile memory cell array and indicates a logic state. The control circuit is configured to control the write circuit to write the logic state indicated by the erase indicator in the non-volatile memory cell array during an erase operation of the associated portion of the non-volatile memory cell array.