Abstract: Disclosed are display panels and methods of fabricating the same. The display panel includes a base substrate having a pixel area and a peripheral area adjacent to the pixel area, a light emitting element on the base substrate to generate a first light and overlapping the pixel area, a light control layer on the light emitting element to convert the first light into a white light, and a color filter layer on the light control layer and includes a first color filter that allows penetration of the first light, a second color filter that allows penetration of a second light different from the first light, and a third color filter that allows penetration of a third light different from the first light and the second light.

Abstract: A method of manufacturing a semiconductor device includes: providing a first process gas including oxygen and a second process gas including carbon and fluorine to a process chamber at a first flow rate ratio to etch an etch target layer; and providing the first process gas and the second process gas to the process chamber at a second flow rate ratio to passivate the etch target layer, wherein a flow rate of the first process gas is substantially constant.

Abstract: The present invention provides a welding rod holder for easy weaving motion, comprising: a main body part including a case, and a driving handle driving a driving part while being installed in the case; the driving part installed in the main body part, including a driving motor, a small bevel gear rotating while being connected to a driving shaft of the driving motor, and a large bevel gear rotating at a reduced speed while being connected to the small bevel gear in a perpendicular direction; a weaving part formed to be connected to the driving part including a weaving frame where an installation space is formed inside, a slider fixated by being connected to one plane of the weaving frame, a protrusion and a groove formed in turn on both sides and an upper protruding bar and a lower protruding bar separated from each other formed to protrude in the installation space and moved up and down by adhering to a rotating sphere, and the rotating sphere eccentrically connected to a close point close to a center of th

Abstract: The quenchable steel sheet has an alloy composition including carbon (C) in an amount of 0.15 to 0.30 wt %, silicon (Si) in an amount of 0.05 to 0.5 wt %, manganese (Mn) in an amount of 1.0 to 2.0 wt %, boron (B) in an amount of 0.0005 to 0.0040 wt %, sulfur (S) in an amount of 0.003 wt % or less, phosphorus (P) in an amount of 0.012 wt % or less, one or more selected from among calcium (Ca) in an amount of 0.0010 to 0.0040 wt % and copper (Cu) in an amount of 0.05 to 1.0 wt %, two or more selected from among cobalt (Co), zirconium (Zr) and antimony (Sb), and iron (Fe). Alloy elements are controlled to increasing hot ductility and enabling pressing at 600 to 900° C. so that a tensile strength of 1400 MPa or more and an elongation of 8% or more are obtained after pressing.

Abstract: The quenchable steel sheet has an alloy composition including carbon (C) in an amount of 0.15˜0.30 wt %, silicon (Si) in an amount of 0.05˜0.5 wt %, manganese (Mn) in an amount of 1.0˜2.0 wt %, boron (B) in an amount of 0.0005˜0.0040 wt %, sulfur (S) in an amount of 0.003 wt % or less, phosphorus (P) in an amount of 0.012 wt % or less, one or more selected from among calcium (Ca) in an amount of 0.0010˜0.0040 wt % and copper (Cu) in an amount of 0.05˜1.0 wt %, two or more selected from among cobalt (Co), zirconium (Zr) and antimony (Sb), and iron (Fe). Alloy elements are controlled to increasing hot ductility and enabling pressing at 600˜900° C. so that a tensile strength of 1400 MPa or more and an elongation of 8% or more are obtained after pressing.

Abstract: The quenchable steel sheet has an alloy composition including carbon (C) in an amount of 0.15˜0.30 wt %, silicon (Si) in an amount of 0.05˜0.5 wt %, manganese (Mn) in an amount of 1.0˜2.0 wt %, boron (B) in an amount of 0.0005˜0.0040 wt %, sulfur (S) in an amount of 0.003 wt % or less, phosphorus (P) in an amount of 0.012 wt % or less, one or more selected from among calcium (Ca) in an amount of 0.0010˜0.0040 wt % and copper (Cu) in an amount of 0.05˜1.0 wt %, two or more selected from among cobalt (Co), zirconium (Zr) and antimony (Sb), and iron (Fe). Alloy elements are controlled to increasing hot ductility and enabling pressing at 600˜900° C. so that a tensile strength of 1400 MPa or more and an elongation of 8% or more are obtained after pressing.