Patents by Inventor Taeksun KWON

Taeksun KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12542360
    Abstract: A stacked patch antenna includes an upper ground plate including a first upper hole, a first feed pad provided on the upper ground plate, a first feed line extending from the first feed pad along a first direction, a lower antenna patch provided on the first feed pad, an upper antenna patch provided on the lower antenna patch, a first upper pad provided in the first upper hole, and a first upper stub protruding from a side surface of the first upper pad.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: February 3, 2026
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Taeksun Kwon, Chanju Park, Jungi Jeong, Jungwoo Seo, Seungyoon Lee, Dongjin Jung
  • Patent number: 12418112
    Abstract: The disclosure relates to a fifth generation (5G) or a sixth generation (6G) communication system for supporting a higher data transfer rate. A dual polarization patch antenna structure and an electronic device including same are provided.
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: September 16, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chanju Park, Sanghyuk Wi, Dongjin Jung, Taeksun Kwon, Jungwoo Seo, Junhwa Oh
  • Patent number: 12388166
    Abstract: An antenna module, according to various embodiments, may comprise: a first layer including a first etching region, a first via pad disposed to be spaced apart from an edge of the first etching region, and a first via hole disposed on one surface of the first via pad; and a second layer stacked on one surface of the first layer, and including a second etching region, a plurality of second via pads disposed to be spaced apart from an edge of the second etching region, a plurality of second via holes disposed on one surface of the plurality of second via pads, and a plurality of second dividing lines electrically connecting the plurality of second via pads.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: August 12, 2025
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Dongjin Jung, Chanju Park, Jungi Jeong, Taeksun Kwon, Jungwoo Seo, Junhwa Oh
  • Publication number: 20250007166
    Abstract: The present disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate than a 4G communication system such as LTE. An electronic device comprising an antenna module, according to an embodiment of the present disclosure, comprises: a communication module for communicating with an external electronic device; a first antenna module including a plurality of first antenna cells and first dummy cells surrounding the plurality of first antenna cells; and a controller for controlling the communication module and the first antenna module. Each of the plurality of first antenna cells may be configured to have a first size, and each of the first dummy cells may be configured to have a second size smaller than the first size.
    Type: Application
    Filed: November 14, 2022
    Publication date: January 2, 2025
    Inventors: Jungwoo SEO, Jungi JEONG, Taeksun KWON, Chanju PARK, Dongjin JUNG, Sanghyuk WI, Seungyoon LEE
  • Publication number: 20240266744
    Abstract: A stacked patch antenna includes an upper ground plate including a first upper hole, a first feed pad provided on the upper ground plate, a first feed line extending from the first feed pad along a first direction, a lower antenna patch provided on the first feed pad, an upper antenna patch provided on the lower antenna patch, a first upper pad provided in the first upper hole, and a first upper stub protruding from a side surface of the first upper pad.
    Type: Application
    Filed: April 19, 2022
    Publication date: August 8, 2024
    Inventors: Taeksun KWON, Chanju PARK, Jungi JEONG, Jungwoo SEO, Seungyoon LEE, Dongjin JUNG
  • Publication number: 20240235009
    Abstract: An antenna module, according to various embodiments, may comprise: a first layer including a first etching region, a first via pad disposed to be spaced apart from an edge of the first etching region, and a first via hole disposed on one surface of the first via pad; and a second layer stacked on one surface of the first layer, and including a second etching region, a plurality of second via pads disposed to be spaced apart from an edge of the second etching region, a plurality of second via holes disposed on one surface of the plurality of second via pads, and a plurality of second dividing lines electrically connecting the plurality of second via pads.
    Type: Application
    Filed: April 28, 2022
    Publication date: July 11, 2024
    Inventors: Dongjin JUNG, Chanju PARK, Jungi JEONG, Taeksun KWON, Jungwoo SEO, Junhwa OH
  • Publication number: 20240136703
    Abstract: An antenna module, according to various embodiments, may comprise: a first layer including a first etching region, a first via pad disposed to be spaced apart from an edge of the first etching region, and a first via hole disposed on one surface of the first via pad; and a second layer stacked on one surface of the first layer, and including a second etching region, a plurality of second via pads disposed to be spaced apart from an edge of the second etching region, a plurality of second via holes disposed on one surface of the plurality of second via pads, and a plurality of second dividing lines electrically connecting the plurality of second via pads.
    Type: Application
    Filed: April 27, 2022
    Publication date: April 25, 2024
    Inventors: Dongjin JUNG, Chanju PARK, Jungi JEONG, Taeksun KWON, Jungwoo SEO, Junhwa OH
  • Publication number: 20240039161
    Abstract: The disclosure relates to a fifth generation (5G) or a sixth generation (6G) communication system for supporting a higher data transfer rate. A dual polarization patch antenna structure and an electronic device including same are provided.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 1, 2024
    Inventors: Chanju PARK, Sanghyuk WI, Dongjin JUNG, Taeksun KWON, Jungwoo SEO, Junhwa OH