Patents by Inventor Tae-Kyoon Kim

Tae-Kyoon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10951259
    Abstract: Disclosed herein are a method for simultaneously transmitting/receiving upstream and downstream signals using a remote PHY architecture and an apparatus for the same. The method determines whether to divide frequencies depending on whether signal interference occurs among multiple cable modems connected to a cable network, if it is determined to divide the frequencies, categorize the multiple cable modems into multiple groups so that signal interference occurs in each group, but signal interference does not occur between groups, set transmission bands for the multiple groups so that an upstream band and a downstream band of one group alternate with upstream bands and downstream bands of remaining groups by dividing the frequencies in accordance with a number of groups, and cancels, by a remote physical layer (PHY) device located at an optical network terminal of the cable network, self-interference signals for respective groups based on the transmission bands.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: March 16, 2021
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Joon-Young Jung, Tae-Kyoon Kim, Eun-Hee Hyun, Heung-Mook Kim
  • Patent number: 10469100
    Abstract: Disclosed herein are a method for transmitting and receiving compressed data and an apparatus therefor. According to the method for transmitting compressed data, a transmission apparatus for transmitting compressed data standardizes the value of an In-phase/Quadrature-phase (IQ) data sample to a preset type that is selected from among a positive number and a negative number, determines the sample type of the IQ data sample, the value of which is standardized to the preset type, based on a sample type determination rule, generates a compressed bit string based on the compression rule pertaining to the determined sample type, generates compressed data, including at least one of a reference bit corresponding to the sample type, the sign bit of the IQ data sample, and the compressed bit string, for each IQ data sample, and transmits the compressed data to a reception apparatus.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: November 5, 2019
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Eun-Hee Hyun, Je-Won Lee, Heung-Mook Kim, Joon-Young Jung, Tae-Kyoon Kim
  • Publication number: 20190182515
    Abstract: Disclosed herein are an apparatus and method for providing a broadcasting service. The method for providing a broadcasting service is performed using a broadcasting service provision apparatus and a terminal device, and includes performing, by the broadcasting service provision apparatus and the terminal device, initialization using information acquired from a downstream signal received from a Cable Modem Termination System (CMTS), converting, by the terminal device, an upstream signal received from a Cable Modem (CM) into a digital signal, encapsulating the digital signal into an IP packet, and transmitting the IP packet to the broadcasting service provision apparatus, and extracting, by the broadcasting service provision apparatus, the digital signal from the IP packet received from the terminal device, converting the digital signal into an analog signal, and transmitting an upstream signal corresponding to the analog signal to the CMTS.
    Type: Application
    Filed: November 14, 2018
    Publication date: June 13, 2019
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Tae-Kyoon Kim, Dong-Joon Choi, Eun-Hee Hyun, Yong-Seong Cho, Joon-Young Jung, Heung-Mook Kim
  • Publication number: 20190173487
    Abstract: Disclosed herein are a method for transmitting and receiving compressed data and an apparatus therefor. According to the method for transmitting compressed data, a transmission apparatus for transmitting compressed data standardizes the value of an In-phase/Quadrature-phase (IQ) data sample to a preset type that is selected from among a positive number and a negative number, determines the sample type of the IQ data sample, the value of which is standardized to the preset type, based on a sample type determination rule, generates a compressed bit string based on the compression rule pertaining to the determined sample type, generates compressed data, including at least one of a reference bit corresponding to the sample type, the sign bit of the IQ data sample, and the compressed bit string, for each IQ data sample, and transmits the compressed data to a reception apparatus.
    Type: Application
    Filed: December 4, 2018
    Publication date: June 6, 2019
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Eun-Hee HYUN, Je-Won LEE, Heung-Mook KIM, Joon-Young JUNG, Tae-Kyoon KIM
  • Publication number: 20190132022
    Abstract: Disclosed herein are a method for simultaneously transmitting/receiving upstream and downstream signals using a remote PHY architecture and an apparatus for the same. The method determines whether to divide frequencies depending on whether signal interference occurs among multiple cable modems connected to a cable network, if it is determined to divide the frequencies, categorize the multiple cable modems into multiple groups so that signal interference occurs in each group, but signal interference does not occur between groups, set transmission bands for the multiple groups so that an upstream band and a downstream band of one group alternate with upstream bands and downstream bands of remaining groups by dividing the frequencies in accordance with a number of groups, and cancels, by a remote physical layer (PHY) device located at an optical network terminal of the cable network, self-interference signals for respective groups based on the transmission bands.
    Type: Application
    Filed: September 14, 2018
    Publication date: May 2, 2019
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Joon-Young JUNG, Tae-Kyoon KIM, Eun-Hee HYUN, Heung-Mook KIM
  • Patent number: 10084112
    Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: September 25, 2018
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Kyung Wan Kim, Tae Kyoon Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Jin Woong Lee, In Soo Kim
  • Publication number: 20180063559
    Abstract: Disclosed herein is technology for controlling transmission of a switched digital video service through which an operator management and control system for efficiently managing and controlling a switched digital video transmission system, which may improve utilization of frequency resources, may be simply constructed and managed. To this end, a method for controlling transmission of a switched digital video service includes configuring a multicast session based on information about a request to transmit a video, which is transmitted from a user end; forming and controlling a service flow to be transmitted through the multicast session; allocating and managing a frequency channel resource through which the service flow is to be transmitted; and sharing information about the frequency channel resource and allocation thereof with a switched digital video control module and managing and controlling the switched digital video control module.
    Type: Application
    Filed: July 26, 2017
    Publication date: March 1, 2018
    Inventors: Tae-Kyoon KIM, Yong-Seong CHO, Joon-Young JUNG, Nam-Ho HUR
  • Publication number: 20170200857
    Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.
    Type: Application
    Filed: March 24, 2017
    Publication date: July 13, 2017
    Inventors: Kyung Wan KIM, Tae Kyoon KIM, Yeo Jin YOON, Ye Seul KIM, Sang Hyun OH, Jin Woong LEE, In Soo KIM
  • Publication number: 20170180049
    Abstract: Provided are an apparatus and method for broadcasting-communications convergence in a hybrid fiber coax (HFC) network. The apparatus includes an optical connector configured to receive broadcast data and communication data from a cable broadcasting station through an optical cable, a channel switch configured to receive the broadcast data from the optical connector and select a piece of broadcast data to be transmitted to a subscriber from among pieces of the broadcast data, and a convergence processor configured to receive the communication data from the optical io connector, receive the selected piece of broadcast data from the channel switch, generate broadcasting-communications convergence data by multiplexing the received communication data and the selected piece of broadcast data, and transmit the broadcasting-communications convergence data.
    Type: Application
    Filed: September 23, 2016
    Publication date: June 22, 2017
    Inventors: Tae Kyoon KIM, Joon Young JUNG, Dong Joon CHOI, Yong Seong CHO, Nam Ho HUR
  • Patent number: 9608165
    Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: March 28, 2017
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Kyung Wan Kim, Tae Kyoon Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Jin Woong Lee, In Soo Kim
  • Patent number: 9202968
    Abstract: Provided is a method of fabricating a vertical light emitting diode (LED). Initially, a semiconductor structure layer including an active layer is formed on a front surface of a growth substrate. A conductive support substrate is formed on the semiconductor structure layer. A rear surface of the growth substrate is abraded to reduce the thickness of the growth substrate. The rear surface of the growth substrate whose thickness is reduced due to the abrasion is dry etched to remove the growth substrate.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: December 1, 2015
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Chang Yeon Kim, Tae Kyoon Kim, Tae Hyuk Im
  • Patent number: 9202984
    Abstract: A light-emitting diode (LED) including a semiconductor stack structure including a first semiconductor layer, an active layer, and a second semiconductor layer, the semiconductor stack disposed on a substrate, a conductive substrate disposed on the semiconductor stack structure, and an electrode disposed on the conductive substrate and in ohmic contact with the conductive substrate, wherein the electrode comprises grooves penetrating the electrode and a portion of the conductive substrate.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: December 1, 2015
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Jin Woong Lee, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim, Tae Kyoon Kim
  • Publication number: 20150311390
    Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.
    Type: Application
    Filed: July 9, 2015
    Publication date: October 29, 2015
    Inventors: Kyung Wan KIM, Tae Kyoon KIM, Yeo Jin YOON, Ye Seul KIM, Sang Hyun OH, Jin Woong LEE, In Soo KIM
  • Publication number: 20150255679
    Abstract: A light-emitting diode (LED) including a semiconductor stack structure including a first semiconductor layer, an active layer, and a second semiconductor layer, the semiconductor stack disposed on a substrate, a conductive substrate disposed on the semiconductor stack structure, and an electrode disposed on the conductive substrate and in ohmic contact with the conductive substrate, wherein the electrode comprises grooves penetrating the electrode and a portion of the conductive substrate.
    Type: Application
    Filed: May 26, 2015
    Publication date: September 10, 2015
    Inventors: Jin Woong LEE, Kyoung Wan KIM, Yeo Jin YOON, Ye Seul KIM, Tae Kyoon KIM
  • Patent number: 9112102
    Abstract: Provided are a light emitting diode (LED) and a method of fabricating the same. The LED includes a unit chip. The unit chip includes a substrate, and a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer which are sequentially stacked on the substrate. A concavo-convex structure having the shape of irregular vertical lines is disposed in a side surface of the unit chip.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: August 18, 2015
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Kyung Wan Kim, Tae Kyoon Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Jin Woong Lee, In Soo Kim
  • Patent number: 9041038
    Abstract: Exemplary embodiments of the present invention disclose a light-emitting diode (LED) including a semiconductor stack structure including a first semiconductor layer, an active layer, and a second semiconductor layer, the semiconductor stack disposed on a substrate, a conductive substrate disposed on the semiconductor stack structure, and an electrode disposed on the conductive substrate and in ohmic contact with the conductive substrate, wherein the electrode comprises grooves penetrating the electrode and a portion of the conductive substrate.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: May 26, 2015
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Jin Woong Lee, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim, Tae Kyoon Kim
  • Publication number: 20140159089
    Abstract: Exemplary embodiments of the present invention disclose a light-emitting diode (LED) including a semiconductor stack structure including a first semiconductor layer, an active layer, and a second semiconductor layer, the semiconductor stack disposed on a substrate, a conductive substrate disposed on the semiconductor stack structure, and an electrode disposed on the conductive substrate and in ohmic contact with the conductive substrate, wherein the electrode comprises grooves penetrating the electrode and a portion of the conductive substrate.
    Type: Application
    Filed: December 6, 2013
    Publication date: June 12, 2014
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Jin Woong LEE, Kyoung Wan KIM, Yeo Jin YOON, Ye Seul KIM, Tae Kyoon KIM
  • Publication number: 20140117395
    Abstract: Provided are a light emitting diode (LED) and a method of fabricating the same. The LED includes a unit chip. The unit chip includes a substrate, and a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer which are sequentially stacked on the substrate. A concavo-convex structure having the shape of irregular vertical lines is disposed in a side surface of the unit chip.
    Type: Application
    Filed: October 30, 2013
    Publication date: May 1, 2014
    Applicant: Seoul Viosys Co., Ltd.
    Inventors: Kyung Wan KIM, Tae Kyoon KIM, Yeo Jin YOON, Ye Seoul KIM, Sang Hyun OH, Jin Woong LEE, In Soo KIM
  • Publication number: 20040117817
    Abstract: A package service management system and method in digital cable broadcasting comprises: a host having middleware for receiving broadcast signals of a headend and bidirectional service information, and executing a package application program for providing a package service; a POD for analyzing data, and decoding a package subscription and termination message using an encoded key so as to allow or disallow watching channels; and a headend for defining package-setting information, transmitting it to the host or the POD, generating entitlement test messages on a paid channel, transmitting them to the POD, and transmitting the subscriber's encoded key according to a request by the POD. Therefore, the subscriber can watch TV and remotely subscribe or terminate a paid package service, thereby increasing user's convenience.
    Type: Application
    Filed: April 22, 2003
    Publication date: June 17, 2004
    Inventors: Eun-Jung Kwon, Han-Seung Koo, Tae-Kyoon Kim, Yong-Seong Cho, Joon-Young Jung, O-Hyung Kwon, Chieteuk Ahn