Patents by Inventor Taemin OK

Taemin OK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961560
    Abstract: An integrated circuit device includes a peripheral circuit structure including a lower substrate, an arc protection diode in the lower substrate, and a common source line driver connected to the arc protection diode, a conductive plate on the peripheral circuit structure, a cell array structure overlapping the peripheral circuit structure in a vertical direction with the conductive plate therebetween, and a first wiring structure connected between the arc protection diode and the conductive plate.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: April 16, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myunghun Lee, Sangwan Nam, Taemin Ok
  • Patent number: 11862624
    Abstract: An integrated circuit device includes a semiconductor substrate having components of a peripheral circuit structure formed in and on a surface of the semiconductor substrate. The peripheral circuit structure comprising a plurality of protective antenna diodes therein. A memory cell array structure is provided on at least a portion of the peripheral circuit structure. A charge accumulating conductive plate is provided, which extends between the peripheral circuit structure and the memory cell array structure. The conductive plate is electrically connected to current carrying terminals of the antenna diodes within the peripheral circuit structure. The conductive plate may have a generally rectangular planar shape with four corners, and the antenna diodes may be arranged into four groups, which extend between respective corners of the conductive plate and the semiconductor substrate.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: January 2, 2024
    Inventors: Taemin Ok, Inmo Kim, Sujeong Kim, Daeseok Byeon
  • Publication number: 20220139904
    Abstract: An integrated circuit device includes a semiconductor substrate having components of a peripheral circuit structure formed in and on a surface of the semiconductor substrate. The peripheral circuit structure comprising a plurality of protective antenna diodes therein. A memory cell array structure is provided on at least a portion of the peripheral circuit structure. A charge accumulating conductive plate is provided, which extends between the peripheral circuit structure and the memory cell array structure. The conductive plate is electrically connected to current carrying terminals of the antenna diodes within the peripheral circuit structure. The conductive plate may have a generally rectangular planar shape with four corners, and the antenna diodes may be arranged into four groups, which extend between respective corners of the conductive plate and the semiconductor substrate.
    Type: Application
    Filed: May 20, 2021
    Publication date: May 5, 2022
    Inventors: Taemin Ok, Inmo Kim, Sujeong Kim, Daeseok Byeon
  • Publication number: 20210343342
    Abstract: An integrated circuit device includes a peripheral circuit structure including a lower substrate, an arc protection diode in the lower substrate, and a common source line driver connected to the arc protection diode, a conductive plate on the peripheral circuit structure, a cell array structure overlapping the peripheral circuit structure in a vertical direction with the conductive plate therebetween, and a first wiring structure connected between the arc protection diode and the conductive plate.
    Type: Application
    Filed: November 12, 2020
    Publication date: November 4, 2021
    Inventors: Myunghun Lee, Sangwan NAM, Taemin OK