Patents by Inventor Tae-Seung Yoon

Tae-Seung Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DISPLAY APPARATUS MANUFACTURING APPARATUS
    Publication number: 20150368790
    Abstract: A thin film encapsulation manufacturing apparatus includes a first cluster configured to form a first inorganic layer on a first substrate, on which an emission unit is formed, by a sputtering process; a second cluster configured to form a first organic layer on the first inorganic layer on the first substrate conveyed from the first cluster by an organic deposition process; a first connection module configured to connect the first cluster and the second cluster, configured to convey the first substrate on which the first inorganic layer is formed from the first cluster to the second cluster, and configured to cool the first substrate in a non-contact manner; and a third cluster configured to form a second inorganic layer on the first organic layer on the first substrate conveyed from the second cluster by a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process.
    Type: Application
    Filed: August 28, 2015
    Publication date: December 24, 2015
    Inventors: Myung-Soo Huh, Tae-Seung Yoon, Jeong-Ho Yi
  • Display apparatus manufacturing method
    Patent number: 9153795
    Abstract: A thin film encapsulation manufacturing apparatus includes a first cluster configured to form a first inorganic layer on a first substrate, on which an emission unit is formed, by a sputtering process; a second cluster configured to form a first organic layer on the first inorganic layer on the first substrate conveyed from the first cluster by an organic deposition process; a first connection module configured to connect the first cluster and the second cluster, configured to convey the first substrate on which the first inorganic layer is formed from the first cluster to the second cluster, and configured to cool the first substrate in a non-contact manner; and a third cluster configured to form a second inorganic layer on the first organic layer on the first substrate conveyed from the second cluster by a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: October 6, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Myung-Soo Huh, Tae-Seung Yoon, Jeong-Ho Yi
  • DISPLAY APPARATUS MANUFACTURING METHOD
    Publication number: 20150064825
    Abstract: A thin film encapsulation manufacturing apparatus includes a first cluster configured to form a first inorganic layer on a first substrate, on which an emission unit is formed, by a sputtering process; a second cluster configured to form a first organic layer on the first inorganic layer on the first substrate conveyed from the first cluster by an organic deposition process; a first connection module configured to connect the first cluster and the second cluster, configured to convey the first substrate on which the first inorganic layer is formed from the first cluster to the second cluster, and configured to cool the first substrate in a non-contact manner; and a third cluster configured to form a second inorganic layer on the first organic layer on the first substrate conveyed from the second cluster by a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process.
    Type: Application
    Filed: June 6, 2014
    Publication date: March 5, 2015
    Inventors: Myung-Soo Huh, Tae-Seung Yoon, Jeong-Ho Yi