Abstract: An abrasive article comprising a body including abrasive particles contained in a bond material, wherein the body comprises a first portion having a first plane solidity [S1], a second portion having a second plane solidity [S2], and wherein S1 is different than S2.

Abstract: An abrasive article can include a body including a bond material, abrasive particles, and a plurality of pores, wherein the bond material can comprise a vitreous material. In one embodiment, an average particle size of the abrasive particles can be between 0.1 microns to 5 microns, and a porosity of the body may be between 40 vol % to 70 vol %, wherein the porosity may define an average pore size (D50) of at least 0.1 microns and not greater than 5 microns.

Abstract: An abrasive article can include a body including a bond material, abrasive particles, and a plurality of pores, wherein the bond material can comprise a vitreous material. In one embodiment, an average particle size of the abrasive particles can be between 0.1 microns to 5 microns, and a porosity of the body may be between 40 vol % to 70 vol %, wherein the porosity may define an average pore size (D50) of at least 0.1 microns and not greater than 5 microns.

Abstract: An abrasive article can include a body including a bond material, abrasive particles, and a plurality of pores, wherein the bond material can comprise a vitreous material. In one embodiment, an average particle size of the abrasive particles can be between 0.1 microns to 5 microns, and a porosity of the body may be between 40 vol % to 70 vol %, wherein the porosity may define an average pore size (D50) of at least 0.1 microns and not greater than 5 microns.

Abstract: An abrasive article can include a body including a bond material, abrasive particles, and a plurality of pores, wherein the bond material can comprise a vitreous material. In one embodiment, an average particle size of the abrasive particles can be between 0.1 microns to 5 microns, and a porosity of the body may be between 40 vol % to 70 vol %, wherein the porosity may define an average pore size (D50) of at least 0.1 microns and not greater than 5 microns.

Abstract: An abrasive article including a body comprising abrasive segments coupled to a major planar surface of a substrate, where a first abrasive segment comprises a first wear life index (w1) that is different than a second wear life index (w2) of the second abrasive segment by at least 5%.

Abstract: An abrasive article can include a body including a bond material, abrasive particles, and a plurality of pores, wherein the bond material can comprise a vitreous material. In one embodiment, an average particle size of the abrasive particles can be between 0.1 microns to 5 microns, and a porosity of the body may be between 40 vol % to 70 vol %, wherein the porosity may define an average pore size (D50) of at least 0.1 microns and not greater than 5 microns.

Abstract: An abrasive article including a body having a bond material comprising an inorganic material, abrasive particles contained within the bond materials; and pores contained within the bond material defining a porosity of at least 90 vol % and not greater than 97 vol % for a total volume of the body.

Abstract: An abrasive article including a body having a bond material comprising an inorganic material, abrasive particles contained within the bond materials; and pores contained within the bond material defining a porosity of at least 90 vol % and not greater than 97 vol % for a total volume of the body.

Abstract: An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

Abstract: An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad.

Abstract: A study of several key conditioner design parameters has been conducted. The purpose was to improve conditioner performance by considering factors such as wafer defects, pad life, and conditioner life. For this study, several key conditioner design parameters such as diamond type, diamond size, diamond shape, diamond concentration and distribution, were selected to determine their effect on CMP performance and process stability. Experimental validations were conducted. Conditioner specifications were matched to each specific CMP environment (intended application) in order to improve process stability and CMP performance particularly for emerging technology nodes. Several conditioner designs were developed and run successfully in the field. Significant planarity improvement for a 300 mm CMP process was achieved in accordance with one embodiment, and an increase of pad life and wafer polish rate was simultaneously achieved with another embodiment.

Abstract: A tool includes a holder configured to couple to a dual-sided chemical mechanical planarization (CMP) pad conditioner. The holder has a magnetic material, a first magnetic field strength (H1) at a first face, and a second magnetic field strength (H2) at a second face opposite the first face. The first magnetic field strength (H1) is different than the second magnetic field strength (H2).

Abstract: An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

Abstract: An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

Abstract: Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value.

Abstract: An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad.

Abstract: An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

Abstract: A study of several key conditioner design parameters has been conducted. The purpose was to improve conditioner performance by considering factors such as wafer defects, pad life, and conditioner life. For this study, several key conditioner design parameters such as diamond type, diamond size, diamond shape, diamond concentration and distribution, were selected to determine their effect on CMP performance and process stability. Experimental validations were conducted. Conditioner specifications were matched to each specific CMP environment (intended application) in order to improve process stability and CMP performance particularly for emerging technology nodes. Several conditioner designs were developed and run successfully in the field. Significant planarity improvement for a 300 mm CMP process was achieved in accordance with one embodiment, and an increase of pad life and wafer polish rate was simultaneously achieved with another embodiment.

Abstract: Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value.