Abstract: A method of operating a memory module that communicates with a memory controller includes: entering a one-time programmable (OTP) addressing mode based on an OTP command received from the memory controller; determining whether a guard key sequence is satisfied based on a plurality of mode register commands received from the memory controller; and programming, based on a determination that the guard key sequence is satisfied, a unique identifier (ID), corresponding to a target memory device, into the target memory device, among a plurality of memory devices included in the memory module.

Abstract: A semiconductor memory device includes a memory cell array, a data input/output (I/O) buffer, an I/O gating circuit and a control logic circuit. The memory cell array includes a plurality of sub array blocks arranged in a first direction and a second direction. The data I/O buffer exchanges user data with a memory controller through I/O pads. The I/O gating circuit is connected to the data I/O buffer through data buses and connected to the memory cell array through data I/O lines, and programs mapping relationship between the sub array blocks and the I/O pads, based on a mapping control signal such that uncorrectable errors that are detected by an error correction code engine in the memory controller are reduced. The control logic circuit generates the mapping control signal based on identifier information indicating a type of a central processing unit of the memory controller.

Abstract: Provided are a memory device and a method for command start point (CSP) synchronization. The memory device includes: a control logic circuit configured to receive command address (CA) signals and control an operation of the memory device; a clock circuit configured receive a clock signal and divide the clock signal to generate first to fourth phase clock signals that are respectively synchronized with first to fourth rising edges of the CA signals indicating a command start point (CSP) command, wherein the first to fourth rising edges of the CA signals constitute a command window; and a CA parity circuit configured to perform a command address parity (CAPAR) checking operation on the CSP command, wherein the CAPAR checking operation includes a plurality of operations respectively corresponding to rolling windows in which the command window is delayed by one clock cycle of the clock signal.

Abstract: A semiconductor memory device includes a memory cell array and a column access circuit. The memory cell array includes a plurality of sub-array blocks and each of the sub-array blocks includes volatile memory cells. The column access circuit receives a plurality of data units, each of which includes normal data and meta data having a ratio of k:1, which is associated with managing the normal data, allocates p column selection lines associated with transferring the data units to the bit-lines to a plurality of normal data and a plurality of meta data in the data units with the ratio of k:1, and stores a sub unit of a first normal data among the plurality of normal data and a sub unit of a first meta data in a first region and a second region of a first sub-array block of the plurality of sub-array blocks, respectively.

Abstract: A semiconductor memory device includes a plurality of memory cells partitioned into a plurality of row blocks that are each associated with at least one respective row block identity bit within a portion of a row address. A row decoder is provided, which includes a repair controller having a plurality of fuse boxes therein that correspond to respective ones of the plurality of row blocks and include a first fuse box configured to store a first defective address.

Abstract: There is provided a memory module including a first memory device constituting a first rank, and a second memory device constituting a second rank sharing a command/address signal and a clock signal with the first memory device. The first memory device and the second memory device receive the command/address signal and the clock signal in a matched type, and the first memory device includes a variable delay line for adjusting a delay of the received clock signal.

Abstract: A semiconductor package includes a memory die stack having a clock signal shared by lower and upper bytes. Each of a plurality of memory dies constituting the memory die stack of the semiconductor package includes a first clock circuit configured to generate a read clock signal for a lower byte and an upper byte constituting a data width of the memory die, and a plurality of first die bond pads corresponding to the number of ranks of a memory system including the memory die, and each of the plurality of first die bond pads is set for each rank. The first clock circuit is connected to, among the plurality of first die bond pads, a die bond pad corresponding to a rank to which the memory die belongs.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of memory cell rows, a row hammer management circuit and a control logic circuit. The row hammer management circuit stores counted values in count cells of each of the plurality of memory cell rows as count data based on an active command applied to the control logic circuit at a first time point, and performs an internal read-update-write operation to read the count data from the count cells of a target memory cell row from among the plurality of memory cell rows, to update the count data that was read to obtain updated count data, and to write the updated count data in the count cells of the target memory cell row in response to a precharge command applied at a second time point after a first command that is applied to the control logic circuit.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of memory cell rows and a row hammer management circuit. The row hammer management circuit stores counted values in count cells of each of the plurality of memory cell rows as count data, and performs an internal read-update-write operation to read the count data from the count cells of a target memory cell row from among the plurality of memory cell rows, to update the count data that was read to obtain updated count data, and to write the updated count data in the count cells of the target memory cell row. The row hammer management circuit includes a hammer address queue. The row hammer management circuit changes the updated count data randomly, based on an event signal indicating a state change of the hammer address queue.

Abstract: A semiconductor memory device includes a memory cell array, a data input/output (I/O) buffer, an I/O gating circuit and a control logic circuit. The memory cell array includes a plurality of sub array blocks arranged in a first direction and a second direction. The data I/O buffer exchanges user data with a memory controller through I/O pads. The I/O gating circuit is connected to the data I/O buffer through data buses and connected to the memory cell array through data I/O lines, and programs mapping relationship between the sub array blocks and the I/O pads, based on a mapping control signal such that uncorrectable errors that are detected by an error correction code engine in the memory controller are reduced. The control logic circuit generates the mapping control signal based on identifier information indicating a type of a central processing unit of the memory controller.

Abstract: A semiconductor memory device, including a memory cell array; a row hammer management circuit configured to: count a number of accesses based on an active command, and based on a first command applied after the active command, perform an internal read-update-write operation to read the count data from the count cells of a target memory cell row, and to write updated count data in the count cells of the target memory cell row; and a column decoder configured to: access a first memory cell using a first bit-line; and store data in the first memory cell using a first voltage, or perform an internal write operation to store the count data in the first memory cell using a second voltage greater than the first voltage during an internal write time interval smaller than a reference write time interval.

Abstract: A semiconductor memory device includes a memory cell array, a row hammer management circuit and a refresh control circuit. The row hammer management circuit automatically stores random count data in count cells of each of a plurality of memory cell rows during a power-up sequence of the semiconductor memory device and determines counted values by counting a number of times of access associated with each of the plurality of memory cell rows in response to an active command from an external memory controller and stores the counted values in the count cells of each of the plurality of memory cell rows as count data. The refresh control circuit receives a hammer address and performs a hammer refresh operation on one or more of the plurality of memory cell rows that are physically adjacent to a memory cell row that corresponds to the hammer address.

Abstract: Provided is a memory system including a host system including a memory controller configured to control a read or write operation for a plurality of memory ranks, based on target or non-target information for the plurality of memory ranks, and a memory device including a storage configured to store on-die termination (ODT) information of the memory ranks. Here, the memory controller is further configured to determine a target rank to be read or written, and transmit information about the determined target rank, to the memory device, and the memory device is further configured to perform a comparison of the ODT information of the memory ranks stored in the storage with target or non-target information received from the memory controller, and change an ODT value of the target rank, based on target information received from the memory controller based on a result of the comparison.

Abstract: A semiconductor die includes a first pin configured to output a first on-die termination (ODT) control signal to a second semiconductor die, the second semiconductor die comprising a plurality of second ODT circuits each having an ODT that is responsive to the first ODT control signal; and a second pin configured to receive a second ODT control signal output from the second semiconductor die, the semiconductor die comprising a plurality of first ODT circuits each having an ODT that is responsive to the second ODT control signal.

Abstract: A semiconductor device includes an input/output interface with a first data input/output pin, a plurality of second data input/output pins, and a write clock signal pin, which is configured to receive a write clock signal from a memory controller. The first data input/output pin is configured to receive write training data from the memory controller during a write training operation, and the plurality of second data input/output pins feed result values of the write training to the memory controller. This write training is performed by the semiconductor device using the write clock signal and the write training data.

Abstract: A semiconductor memory device includes a row hammer management circuit and a refresh control circuit. The row hammer management circuit counts the number of times of access on each memory cell row to store the counted values in count cells of each memory cell row as count data. A hammer address queue in the row hammer management circuit stores candidate hammer addresses, which are intensively accessed, in response to a number of the candidate hammer addresses reaching a second number, transitions a logic level of an error signal provided to the memory controller, and, in response to the number of the candidate hammer addresses reaching the first number, outputs one of the candidate hammer addresses as a hammer address. The refresh control circuit performs a hammer refresh operation on victim memory cell rows which are physically adjacent to a memory cell row corresponding to the hammer address.

Abstract: A memory system that controls latency for a plurality of clock signals and outputs at least one of read data and write data includes a memory controller configured to receive a data output command from a host, generate a plurality of clock signals for outputting data, and control latency of the plurality of clock signals, and an input/output (I/O) circuit configured to output data based on the clock signals having the controlled latency.

Abstract: A method of operating a memory device includes receiving, from a memory controller, an operation command that is synchronized with a clock signal, receiving a data clock signal having a full-rate frequency and a synchronization pattern provided by at least one of a plurality of data signals. The clock signal and the data clock signal are then synchronized using a synchronization operation based on the synchronization pattern. The data clock signal may be received after a first delay time passes from a time point at which the operation command is received. The first delay time is a delay time necessary to prepare the synchronization operation.

Abstract: A semiconductor memory device includes a memory cell array, a row hammer management circuit and a control logic circuit. The memory cell array includes a plurality of memory cell rows. The row hammer management circuit counts the number of instances of access of each of the memory cell rows, such as in response to the receipt of an active command, to store the counted values in count cells of each of the memory cell rows as count data and, in response to a first command, initiates an internal read-update-write operation to read the count data, to update the read count data, and to write the updated count data in the count cells. The control logic circuit may performs an internal write operation to write the updated count data in the count cells during a second write time interval that is smaller than a first write time interval associated with a normal write operation.

Abstract: A semiconductor memory device includes a command decoder configured to generate an auto-sync signal in response to a command for writing data at a memory cell or reading data from a memory cell, and an internal data clock generating circuit configured to phase synchronize a second clock, having a clock frequency higher than a clock frequency of a first clock, with the first clock in response to the auto-sync signal.