Abstract: A display device includes: a first substrate including an emission area and a non-emission area; a light emitting element on the first substrate in the emission area; a pixel defining layer on the first substrate in the non-emission area; an encapsulation layer on the light emitting element and the pixel defining layer; a first bank on the encapsulation layer in the non-emission area; and a second bank on the encapsulation layer in the non-emission area, and including: a main portion that does not overlap with the first bank; and a protrusion portion overlapping with the first bank, and connected to the main portion.

Abstract: There is provided a display device including a first substrate including a light emission area and a non-light emission area; a first pixel electrode on the light emission area of the first substrate; a pixel defining layer on the non-light emission area of the first substrate, defining a first opening; a thin film encapsulation layer on the first pixel electrode and the pixel defining layer; a first light control layer overlapping the light emission area, on the thin film encapsulation layer; a planarization layer on the thin film encapsulation layer; and a bank pattern overlapping the non-light emission area, on the planarization layer and defining a second opening, wherein the first light control layer includes a first surface directed toward the first pixel electrode, a first side directed toward the bank pattern, and a first inclined surface connecting the first surface with the first side, and the planarization layer is in contact with the first inclined surface.

Abstract: A display device includes a first substrate, a transistor disposed on the first substrate, a light emitting device connected to the transistor, an encapsulation layer covering the light emitting device, a plurality of banks disposed to overlap the encapsulation layer in a plan view and partitioning a first emission area, a second emission area, and a third emission area, a first color conversion layer disposed in the first emission area, a second color conversion layer disposed in the second emission area, and a transmission layer disposed in the third emission area. A thickness of at least one of the first color conversion layer or the second color conversion layer is greater than a thickness of the plurality of banks.

Abstract: A display device includes: a substrate including a first emission area, a second emission area, and a third emission area; a first wavelength conversion pattern overlapping the first emission area; a second wavelength conversion pattern overlapping the second emission area; and a light-transmitting pattern overlapping the third emission area, wherein the first wavelength conversion pattern includes first wavelength shifters configured to convert a first light into a second light, and first scatterers, the second wavelength conversion pattern includes second wavelength shifters configured to convert the first light into a third light, and second scatterers, and a ratio between a concentration of the first wavelength shifters and a concentration of the second wavelength shifters is 1:1.1 to 1:1.3.

Abstract: An image sensor substrate includes a semiconductor substrate layer and a semiconductor epitaxial layer on the substrate layer. The semiconductor substrate layer has a boron (B) doping concentration therein in a range from 3×1018 cm?3 to 1×1019 cm?3, whereas the semiconductor epitaxial layer has a boron (B) doping concentration therein in a range from 1×1016 cm?3 to 6×1016 cm?3.

Abstract: A manufacturing method of a display device according to an embodiment includes forming a bank separating a first opening, a second opening, and a third opening on a first substrate, forming a scatterer layer in the first opening, the second opening, and the third opening, forming a first ink layer in the first opening, forming a second ink layer in the second opening, and forming a third ink layer in the third opening.

Abstract: A method of manufacturing an image sensing apparatus includes: forming a first substrate structure including a first region of a pixel region, the first substrate structure having a first surface and a second surface; forming a second substrate structure including a circuit region for driving the pixel region, the second substrate structure having a third surface and a fourth surface; bonding the first substrate structure to the second substrate structure, such that the first surface is connected to the third surface; forming a second region of the pixel region on the second surface; forming a first connection via, the first connection via extending from the second surface to pass through the first substrate structure; mounting semiconductor chips on the fourth surface, using a conductive bump; and separating a stack structure of the first substrate structure, the second substrate structure, and the semiconductor chips into unit image sensing apparatuses.

Abstract: An ink composition includes a plurality of quantum dots, a liquid monomer, an initiator, and optionally an organic solvent, wherein the plurality of quantum dots includes: a first quantum dot including a first ligand, and a second quantum dot including a second ligand different from the first ligand, and the ink composition is configured to emit a first light.

Abstract: An image sensing apparatus includes a first substrate structure, a second substrate structure, and a memory chip. The first substrate structure includes a pixel region having a photoelectric conversion element. The second substrate structure includes a first surface connected to the first substrate structure and a second surface opposite the first surface, and also includes a circuit region to drive the pixel region. The memory chip is mounted on the second surface of the second substrate structure. The first substrate structure and the second substrate structure are electrically connected by first connection vias passing through the first substrate structure. The second substrate structure and the memory chip are electrically connected by second connection vias passing through a portion of the second substrate structure. The first connection vias and the second connection vias are at different positions on a plane.

Abstract: A method of manufacturing an image sensing apparatus includes: forming a first substrate structure including a first region of a pixel region, the first substrate structure having a first surface and a second surface; forming a second substrate structure including a circuit region for driving the pixel region, the second substrate structure having a third surface and a fourth surface; bonding the first substrate structure to the second substrate structure, such that the first surface is connected to the third surface; forming a second region of the pixel region on the second surface; forming a first connection via, the first connection via extending from the second surface to pass through the first substrate structure; mounting semiconductor chips on the fourth surface, using a conductive bump; and separating a stack structure of the first substrate structure, the second substrate structure, and the semiconductor chips into unit image sensing apparatuses.

Abstract: A method of manufacturing an image sensing apparatus includes: forming a first substrate structure including a first region of a pixel region, the first substrate structure having a first surface and a second surface; forming a second substrate structure including a circuit region for driving the pixel region, the second substrate structure having a third surface and a fourth surface; bonding the first substrate structure to the second substrate structure, such that the first surface is connected to the third surface; forming a second region of the pixel region on the second surface; forming a first connection via, the first connection via extending from the second surface to pass through the first substrate structure; mounting semiconductor chips on the fourth surface, using a conductive bump; and separating a stack structure of the first substrate structure, the second substrate structure, and the semiconductor chips into unit image sensing apparatuses.

Abstract: A semiconductor device including a via plug formed on a substrate and a metal layer for interconnection formed at an end of the via plug, wherein an insulating structure is under the metal layer for interconnection and the insulating structure has a different layered structure according to a positional relationship with the metal layer for interconnection is disclosed.

Abstract: An image sensing apparatus includes a first substrate structure, a second substrate structure, and a memory chip. The first substrate structure includes a pixel region having a photoelectric conversion element. The second substrate structure includes a first surface connected to the first substrate structure and a second surface opposite the first surface, and also includes a circuit region to drive the pixel region. The memory chip is mounted on the second surface of the second substrate structure. The first substrate structure and the second substrate structure are electrically connected by first connection vias passing through the first substrate structure. The second substrate structure and the memory chip are electrically connected by second connection vias passing through a portion of the second substrate structure. The first connection vias and the second connection vias are at different positions on a plane.

Abstract: An image sensing apparatus includes a first substrate structure, a second substrate structure, and a memory chip. The first substrate structure includes a pixel region having a photoelectric conversion element. The second substrate structure includes a first surface connected to the first substrate structure and a second surface opposite the first surface, and also includes a circuit region to drive the pixel region. The memory chip is mounted on the second surface of the second substrate structure. The first substrate structure and the second substrate structure are electrically connected by first connection vias passing through the first substrate structure. The second substrate structure and the memory chip are electrically connected by second connection vias passing through a portion of the second substrate structure. The first connection vias and the second connection vias are at different positions on a plane.

Abstract: A semiconductor device including a via plug formed on a substrate and a metal layer for interconnection formed at an end of the via plug, wherein an insulating structure is under the metal layer for interconnection and the insulating structure has a different layered structure according to a positional relationship with the metal layer for interconnection is disclosed.

Abstract: An image sensing apparatus includes a first substrate structure, a second substrate structure, and a memory chip. The first substrate structure includes a pixel region having a photoelectric conversion element. The second substrate structure includes a first surface connected to the first substrate structure and a second surface opposite the first surface, and also includes a circuit region to drive the pixel region. The memory chip is mounted on the second surface of the second substrate structure. The first substrate structure and the second substrate structure are electrically connected by first connection vias passing through the first substrate structure. The second substrate structure and the memory chip are electrically connected by second connection vias passing through a portion of the second substrate structure. The first connection vias and the second connection vias are at different positions on a plane.

Abstract: A method of manufacturing an image sensing apparatus includes: forming a first substrate structure including a first region of a pixel region, the first substrate structure having a first surface and a second surface; forming a second substrate structure including a circuit region for driving the pixel region, the second substrate structure having a third surface and a fourth surface; bonding the first substrate structure to the second substrate structure, such that the first surface is connected to the third surface; forming a second region of the pixel region on the second surface; forming a first connection via, the first connection via extending from the second surface to pass through the first substrate structure; mounting semiconductor chips on the fourth surface, using a conductive bump; and separating a stack structure of the first substrate structure, the second substrate structure, and the semiconductor chips into unit image sensing apparatuses.

Abstract: A screen scroll apparatus of a portable device includes: a sensor unit which senses and outputs 2-dimensional coordinate values of at least one position related to the portable device; a display unit; a memory storing contents with a resolution higher than that of the screen that can be displayed; and a control unit which scrolls the screen based on the 2-dimensional coordinate values if the 2-dimensional coordinate values change when contents are read from the memory and provided to the display unit. A screen scroll method includes: if a resolution of contents displayed on the portable device is higher than a resolution of a screen that can be displayed, monitoring 2-dimensional coordinate values of at least one position related to the portable device output from the sensor unit; and if the 2-dimensional coordinate values change, scrolling a screen displayed on the portable device based on the 2-dimensional coordinate values.

Abstract: A content management method and apparatus are provided. A method for a first device to provide content to a second device in a home network includes: receiving content information through a Really Simple Syndication (RSS) feed provided from a content server outside of the home network; updating a content list, which can be provided by the first device through the home network, based on the content information which is received; and transmitting the updated content list to the second device.

Abstract: A content management method and apparatus are provided. A method for a first device to provide content to a second device in a home network includes: receiving content information through a Really Simple Syndication (RSS) feed provided from a content server outside of the home network; updating a content list, which can be provided by the first device through the home network, based on the content information which is received; and transmitting the updated content list to the second device.