Abstract: Provided is an acoustic resonator including: a substrate including a first cavity; a first electrode formed above the substrate; a piezoelectric layer formed on one surface of the first electrode; and a second electrode formed on one surface of the piezoelectric layer, wherein the first electrode and the piezoelectric layer include an overlapping area that corresponds to a first end and a second end of the first cavity, the first electrode has a termination surface formed as an inclined surface of a first acute angle ?1 outside the overlapping area with respect to the second end of the first cavity, the piezoelectric layer is formed to include a first air bridge area that has a second cavity and is formed between the piezoelectric layer and the first electrode in a vertical direction and between the second end of the first cavity and the termination surface in a horizontal direction.

Abstract: Disclosed is an acoustic resonator including a substrate including a first cavity, a first electrode formed above the substrate, a piezoelectric layer formed on one surface of the first electrode, and a second electrode formed on one surface of the piezoelectric layer. Here, the piezoelectric layer includes a longitudinal section not to cover a longitudinal section of the first electrode. Also, the second electrode covers the longitudinal section of the piezoelectric layer and extends to a first interpolar cavity which spaces the first electrode at least partially apart from the piezoelectric layer. A quality factor may be increased by fixing an increase in resistance which occurs due to thin film electrodes.

Abstract: A front end module includes an antenna terminal connected to an antenna, a first filter having a first end connected to the antenna terminal and having a first pass band; and a second filter having a first end connected to the antenna terminal and having a second pass band different from the first pass band. The first filter and the second filter simultaneously filter an RF signal received by the antenna, and simultaneously filter an RF signal transmitted externally through the antenna. The first filter and the second filter are configured to support wireless communications of a same standard.

Abstract: An acoustic resonator includes: an upper electrode including a first active region disposed on an upper portion of a piezoelectric layer, and a first extended region extended from the first active region; a lower electrode including a second active region disposed on a lower portion of the piezoelectric layer, and a second extended region extended from the second active region; a first metal layer including a first resistance reduction region disposed on the first extended region; and a second metal layer including a second resistance reduction region disposed on the second extended region. The first metal layer includes a first conductive link region extended from the first resistance reduction region. The second metal layer includes a second conductive link region extended from the second resistance reduction region. The first and second conductive link regions correspond to respective portions of a side boundary of the first and second active regions.

Abstract: An acoustic resonator includes: an upper electrode including a first active region disposed on an upper portion of a piezoelectric layer, and a first extended region extended from the first active region; a lower electrode including a second active region disposed on a lower portion of the piezoelectric layer, and a second extended region extended from the second active region; a first metal layer including a first resistance reduction region disposed on the first extended region; and a second metal layer including a second resistance reduction region disposed on the second extended region. The first metal layer includes a first conductive link region extended from the first resistance reduction region. The second metal layer includes a second conductive link region extended from the second resistance reduction region. The first and second conductive link regions correspond to respective portions of a side boundary of the first and second active regions.

Abstract: An acoustic wave filter device includes resonance portions, first and second metal pads. The resonance portions each includes a lower electrode disposed on a substrate, a piezoelectric layer disposed on at least a portion of the lower electrode, and an upper electrode disposed on at least a portion of the piezoelectric layer. The first metal pads are connected to one of the upper electrode and the lower electrode of a corresponding resonance portion among the resonance portions. The second metal pads are disposed outwardly of an active region and connected to the other one of the upper electrode and the lower electrode of adjacent resonant portions among the resonance portions. A ring portion is disposed outwardly of the active region in which the lower electrode, the piezoelectric layer, and the upper electrode overlap is disposed only on a portion of any one of the first and second metal pads.

Abstract: A front end module includes a filter portion including filters each including at least one bulk-acoustic wave resonator including a first electrode, a piezoelectric layer, and a second electrode stacked in order, and the filters each have a different allocated passband such that a frequency band of each passband overlaps a portion of a frequency band of an adjacent passband; and a switch portion to be selectively connected to the filters to form a path of a wireless frequency signal.

Abstract: An acoustic wave filter device includes resonance portions, first and second metal pads. The resonance portions each includes a lower electrode disposed on a substrate, a piezoelectric layer disposed on at least a portion of the lower electrode, and an upper electrode disposed on at least a portion of the piezoelectric layer. The first metal pads are connected to one of the upper electrode and the lower electrode of a corresponding resonance portion among the resonance portions. The second metal pads are disposed outwardly of an active region and connected to the other one of the upper electrode and the lower electrode of adjacent resonant portions among the resonance portions. A ring portion is disposed outwardly of the active region in which the lower electrode, the piezoelectric layer, and the upper electrode overlap is disposed only on a portion of any one of the first and second metal pads.

Abstract: A bulk acoustic wave (BAW) resonator includes: a substrate; a first BAW resonator including a first air cavity disposed in the substrate, and further including a first electrode, a first piezoelectric layer, and a second electrode stacked on the first air cavity; a second BAW resonator including a second air cavity disposed in the substrate, and further including a first electrode, a second piezoelectric layer, and a second electrode stacked on the second air cavity, wherein the second BAW resonator is connected in parallel to the first BAW resonator and has polarities that are opposite of polarities of the first BAW resonator; and a compensation capacitor circuit connected between the first BAW resonator and the second BAW resonator.

Abstract: A semiconductor package includes a lower package including at least one electronic device, and an antenna unit disposed on an upper surface of the lower package, wherein the antenna unit includes: a ground portion disposed on an upper surface of the lower package, a radiating portion disposed to be spaced apart from the ground portion, and a support portion separating the radiating portion and the ground portion, and at least a portion between the radiating portion and the grounding portion is empty space.

Abstract: A semiconductor package includes a lower package including at least one electronic device, and an antenna unit disposed on an upper surface of the lower package, wherein the antenna unit includes: a ground portion disposed on an upper surface of the lower package, a radiating portion disposed to be spaced apart from the ground portion, and a support portion separating the radiating portion and the ground portion, and at least a portion between the radiating portion and the grounding portion is empty space.

Abstract: A bulk acoustic wave (BAW) resonator includes: a substrate; a first BAW resonator including a first air cavity disposed in the substrate, and further including a first electrode, a first piezoelectric layer, and a second electrode stacked on the first air cavity; a second BAW resonator including a second air cavity disposed in the substrate, and further including a first electrode, a second piezoelectric layer, and a second electrode stacked on the second air cavity, wherein the second BAW resonator is connected in parallel to the first BAW resonator and has polarities that are opposite of polarities of the first BAW resonator; and a compensation capacitor circuit connected between the first BAW resonator and the second BAW resonator.

Abstract: A fingerprint sensing device includes a board having a sensor array, a sub-board disposed on a bottom surface of the board, a circuit element disposed on the bottom surface of the board, and a through hole disposed through the sub-board, wherein the circuit element is further disposed in the through hole. A thickness of the sub-board is substantially similar to a thickness of the circuit element.

Abstract: There are provided a touch sensing device and a touchscreen device. The touch sensing device includes: a driving circuit applying a driving signal having a predetermined first period to a node capacitor; a buffer circuit converting capacitance of the node capacitor into a voltage signal; a buffer capacitor being charged and discharged depending on an output voltage from the buffer circuit; and an integration circuit integrating voltages charged in the buffer capacitor, wherein, in a normal touch mode, the buffer circuit integrates capacitance of the node capacitor to generate the voltage signal, and, in a proximity touch mode, the buffer circuit generates the voltage signal by following the voltages charged in the node capacitor.

Abstract: An integration circuit may include a plurality of switches, at least one operational amplifier, and at least one feedback capacitor, sequentially transfers electrical charges charged in a node capacitor to the feedback capacitor, and integrates the electrical charges. The operational amplifier may be synchronized with a clock signal applied to at least one of the plurality of switches to thereby be operated in one of a normal mode and a low power mode.

Abstract: There are provided a touch panel and a touchscreen device including the same. The touch panel includes: a substrate; a plurality of first electrodes disposed on a lower surface of the substrate and extending in a first direction; and a plurality of second electrodes disposed on an upper surface of the substrate and extending in a second direction intersecting with the first direction, wherein the first and second electrodes include mesh-like conductive lines, a width of the second electrodes is wider than a width of the first electrodes, and a pitch of conductive lines of the second electrodes is greater than a pitch of conductive lines of the first electrodes.

Abstract: A fingerprint sensor includes: a panel including a sensor array including first electrodes extended in a first direction and second electrodes extended in a second direction intersecting with the first direction; and a forged fingerprint analyzer configured to provide signals having different frequencies to a first electrode group and a second electrode group, and to measure an impedance between the first electrode group and the second electrode group to determine whether a fingerprint applied to the sensor array is forged, wherein the first electrode group includes a portion of a plurality of electrodes among the first electrodes or the second electrodes, and the second electrode group includes another portion of the plurality of electrodes.

Abstract: A fingerprint sensing device includes a board having a sensor array, a sub-board disposed on a bottom surface of the board, a circuit element disposed on the bottom surface of the board, and a through hole disposed through the sub-board, wherein the circuit element is further disposed in the through hole. A thickness of the sub-board is substantially similar to a thickness of the circuit element.

Abstract: A touch sensing apparatus may include a driving signal generating circuit including a first switch and a second switch and providing driving signals to a first node of a node capacitor, the driving signals being generated by switching operations of the first switch and the second switch, and a C-V converting circuit including a buffer circuit having a first feedback capacitor and a third switch disposed between a second node of the node capacitor and the first feedback capacitor and transferring a charging voltage of the node capacitor to the first feedback capacitor through a switching operation of the third switch to generate an output voltage. The buffer circuit further includes a fourth switch disposed between the second node of the node capacitor and a current source, and the fourth switch is turned on in an off operation section of the third switch.

Abstract: There are provided a touchscreen device and a method of sensing a touch. The touchscreen device includes: a panel unit including a plurality of first electrodes and a plurality of second electrodes; a driving circuit unit simultaneously applying driving signals to M first electrodes among the first electrodes, where M is a natural number equal to or greater than two; a sensing circuit unit detecting capacitance generated in intersections between the first electrodes and the second electrodes so as to output sensing signals; and an operation unit determining whether a touch has occurred, based on the sensing signals.