Patents by Inventor Tahir Iqbal

Tahir Iqbal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low application temperature elastic attachment adhesive
    Patent number: 7799863
    Abstract: Low application temperature thermoplastic hot melt adhesives are particularly useful as elastic attachment adhesives. The adhesives have a viscosity at 275° F. of less than about 8,000 cp, a yield stress of less than about than 80 psi and a creep performance for a bond made through strand coating of less than about 15%. Preferred are adhesives that have a creep performance for a bond made through spiral coating of less than about 25%.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: September 21, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Qiwei He, Michael G. Harwell, Ju-ming Hung, Martin Riswick, Wei Kong, Kenneth E. Martin, Tahir Iqbal
  • Ionomer-containing hot melt adhesive
    Patent number: 7795341
    Abstract: Adhesives comprising up to about 40 wt % of an ionomer can be applied at low temperatures and exhibit good bond strength. The adhesives are particularly useful as elastic attachment adhesives.
    Type: Grant
    Filed: February 6, 2004
    Date of Patent: September 14, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Qiwei He, Michael G. Harwell, Ju-ming Hung, Kenneth E. Martin, Tahir Iqbal, Sam L. Samuels
  • Low application temperature elastic attachment adhesive
    Publication number: 20070161742
    Abstract: Low application temperature thermoplastic hot melt adhesives are particularly useful as elastic attachment adhesives. The adhesives have a viscosity at 275° F. of less than about 8,000 cp, a yield stress of less than about than 80 psi and a creep performance for a bond made through strand coating of less than about 15%. Preferred are adhesives that have a creep performance for a bond made through spiral coating of less than about 25%.
    Type: Application
    Filed: January 31, 2005
    Publication date: July 12, 2007
    Inventors: Qiwei He, Michael Hapwell, Ju-ming Hung, Martin Riswick, Wei Kong, Kenneth Martin, Tahir Iqbal
  • Ionomer-containing hot melt adhesive
    Publication number: 20050176868
    Abstract: Adhesives comprising up to about 40 wt % of an ionomer can be applied at low temperatures and exhibit good bond strength. The adhesives are particularly useful as elastic attachment adhesives.
    Type: Application
    Filed: February 6, 2004
    Publication date: August 11, 2005
    Inventors: Qiwei He, Michael Harwell, Ju-ming Hung, kenneth Martin, Tahir Iqbal, Sam Samuels
  • Low application temperature elastic attachment adhesive
    Publication number: 20050176867
    Abstract: Low application temperature thermoplastic hot melt adhesives are particularly useful as elastic attachment adhesives. The adhesives have a viscosity at 275° F. of less than about 8,000 cp, a yield stress of less than about than 80 psi and a creep performance for a bond made through strand coating of less than about 15%. Preferred are adhesives that have a creep performance for a bond made through spiral coating of less than about 25%.
    Type: Application
    Filed: February 6, 2004
    Publication date: August 11, 2005
    Inventors: Qiwei He, Michael Harwell, Ju-ming Hung, Martin Riswick, Wei Kong, Kenneth Martin, Tahir Iqbal
  • Substrates containing adhesion promoting additives and articles prepared therewith
    Publication number: 20050176872
    Abstract: Adhesion of an adhesive to a substrate can be improved by incorporating into the substrate an adhesion-enhancing amount of an adhesion promoter.
    Type: Application
    Filed: January 31, 2005
    Publication date: August 11, 2005
    Applicant: INVISTA North America S.a r.l.
    Inventors: Kenneth Martin, Tahir Iqbal, Qiwei He, Michael Harwell
  • Spandex containing certain alkali metal salts
    Patent number: 5539037
    Abstract: An alkali metal salt additive in very low concentration in spandex (e.g., 0.02-0.25%) increases the heat set efficiency of spandex. The anion of the salt is a carboxylate having 1 to 10 carbon atoms or thiocyanate.
    Type: Grant
    Filed: September 30, 1993
    Date of Patent: July 23, 1996
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Tahir Iqbal
  • Process for preparing Tc-99m tris(isonitrile) copper complexes
    Patent number: 5028699
    Abstract: Tris(isonitrile)copper(I) complex salts with anions selected from BF.sub.4, PF.sub.6, ClO.sub.4, I, Br, Cl and CF.sub.3 COO are useful in preparing radionuclide complexes rapidly at room temperature. Preferred isonitrile ligands are ether isonitriles. The tris(isonitrile)copper(I) adducts enable technetium complexes, such as those of Tc99m, to be prepared easily just prior to their use as imaging agents.
    Type: Grant
    Filed: August 23, 1989
    Date of Patent: July 2, 1991
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Tahir Iqbal, John H. Cain, Jr., Jack J. Slosky
  • Tris(isonitrile)copper(I) adducts for preparing radionuclide complexes
    Patent number: 5008418
    Abstract: Tris(isonitrile)copper(I) complex salts with anions selected from BF.sub.4, PF.sub.6, ClO.sub.4, I, Br, Cl and CF.sub.3 COO are useful in preparing radionuclide complexes rapidly at room temperature. Preferred isonitrile ligands are ether isonitriles. The tris(isonitrile)copper(I) adducts enable technetium complexes, such as those of Tc99m, to be prepared easily just prior to their use as imaging agents.
    Type: Grant
    Filed: August 23, 1989
    Date of Patent: April 16, 1991
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Tahir Iqbal, John H. Cain, Jr., Jack J. Slosky
  • Tris(isonitrile)copper(I) adducts for preparing radionuclide complexes
    Patent number: 4885100
    Abstract: Tris(isonitrile)copper(I) complex salts with anions selected from BF.sub.4, PF.sub.6, ClO.sub.4, I, Br, Cl and CF.sub.3 COO are useful in preparing radionuclide complexes rapidly at room temperature. Preferred isonitrile ligands are ether isonitriles. The tris(isonitrile)copper(I) adducts enable technetium complexes, such as those of Tc99m, to be prepared easily just prior to their use as imaging agents.
    Type: Grant
    Filed: September 11, 1987
    Date of Patent: December 5, 1989
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Tahir Iqbal, John H. Cain, Jr., Jack J. Slosky