Abstract: A method of forming an integrated circuit structure comprises the steps of: providing a semiconductor substrate having a first side and a second side opposite the first side; forming a hole extending from the first side of the semiconductor substrate into the semiconductor substrate; filling the hole with conductive material; thinning the second side of the semiconductor substrate to a first predetermined thickness, so that the bottom of the hole does not protrude from the second side of the semiconductor substrate; and etching the second side of the semiconductor to substrate to a second predetermined thickness, thereby exposing the bottom of the hole.

Abstract: A printed circuit board includes a heat sink and a circuit board. The heat sink defines two fixing blind holes respectively arranged on adjacent opposite ends of the heat sink. The circuit board includes a heat-generating component and two fixing elements corresponding to the fixing blind holes. Each fixing elements includes a fixing portion fixed on the circuit board, a locking portion, and an elastic portion extending from a first end of the locking portion to be connected to the fixing portion. A second end of the locking portion of each fixing element is inserted into a corresponding fixing blind hole, to fix the heat sink on the heat-generating component.

Abstract: A shredder includes a housing having a throat for receiving at least one article to be shredded, and a shredder mechanism having a motor and cutter elements. The shredder also includes a detector that is configured to detect a thickness of the at least one article being received by the throat, and a controller that is configured to operate the motor to drive the cutter elements to shred the at least one article and to set a flutter threshold higher than the predetermined maximum thickness threshold, if the detected thickness is less than a predetermined maximum thickness threshold. The controller is also configured to thereafter continuously detect the thickness of the at least one article being inserted into a throat of the shredder; and to perform a predetermined operation responsive to the thickness detector detecting that the thickness of the at least one article is greater than the flutter threshold.

Abstract: A power receptacle includes an insulative housing and a number of power contacts received in the insulative housing. The insulative housing has a base extending along a first direction and a mating portion protruding from the base. The mating portion has a first mating surface, a pair of side surfaces extending perpendicularly to the first mating surface, and a first slot recessed into the mating portion from the first mating surface. The first slot extends through the pair of side surfaces of the mating portion along the first direction. The insulative housing includes a first mounting surface opposite to the first mating surface and defines a first through hole extending therethrough which is exposed to the outside from the first mating surface.

Abstract: A liquid crystal display device includes a first substrate, a second substrate, a first vertical electrode, a second vertical electrode, a first pixel electrode, a first counter electrode, and a liquid crystal layer. The second substrate is disposed to be opposite to the first substrate, the liquid crystal layer is interposed between the first and second substrates. The liquid crystal layer includes polymer stabilized positive blue phase liquid crystal. The first vertical electrode is at an inner side of the first substrate, and faces the second substrate. The second vertical electrode is at an inner side surface of the second substrate and faces the first vertical electrode. The second vertical electrode and the first vertical electrode have different electrical potentials thus form a vertical electric field perpendicular to the first substrate and the second substrate. The first pixel electrode is at the inner side of the first substrate and faces the second substrate.

Abstract: A pixel structure includes a first sub-pixel and a second sub-pixel. The first sub-pixel includes a first switching transistor and a first liquid crystal capacitor, wherein when the first switching transistor is turned on, the first liquid crystal capacitor is biased to a first gray level voltage. The second sub-pixel includes a second switching transistor, a second liquid crystal capacitor, a third switching transistor, a charge sharing capacitor and a fourth switching transistor, wherein when the second switching transistor is turned on, the second liquid crystal capacitor is biased to the first gray level voltage; when the fourth switching transistor is turned on, the charge sharing capacitor is reset to a predetermined voltage; and when the third switching transistor is turned on, the second liquid crystal capacitor and the charge sharing capacitor are charge-shared to a second gray level voltage through the third switching transistor.

Abstract: The present invention provides compounds for modulating protein kinase enzymatic activity for modulating cellular activities such as proliferation, differentiation, programmed cell death, migration and chemoinvasion. Compounds of the invention inhibit, regulate and/or modulate kinases, particularly Tie-2. Methods of using the compounds and pharmaceutical compositions thereof to treat kinase-dependent diseases and conditions are also an aspect of the invention.

Abstract: A hybrid internal combustion engine and air motor system is provided and includes at least one chamber having a drivable member and at least one intake valve and at least one exhaust valve, and a reservoir connected to the chamber through at least one of the intake valve and the exhaust valve. The system further comprises a computer configured to calculate air compressor efficiency during an air compressor mode of operation and select an intake and exhaust valve opening and closing timing sequence for maximizing air compressor efficiency and/or a computer configured to calculate air motor efficiency during an air motor mode of operation and select an intake and exhaust valve opening and closing timing sequence for maximizing air motor efficiency. A method for selecting an intake and exhaust valve opening and closing timing sequence for maximizing air compressor efficiency and/or for selecting an intake and exhaust valve opening and closing timing sequence for maximizing air motor efficiency is also disclosed.

Abstract: An MRAM is disclosed that has a MTJ comprised of a ferromagnetic layer with a magnetization direction along a first axis, a super-paramagnetic (SP) free layer, and an insulating layer formed therebetween. The SP free layer has a remnant magnetization that is substantially zero in the absence of an external field, and in which magnetization is roughly proportional to an external field until reaching a saturation value. In one embodiment, a separate storage layer is formed above, below, or adjacent to the MTJ and has uniaxial anisotropy with a magnetization direction along its easy axis which parallels the first axis. In a second embodiment, the storage layer is formed on a non-magnetic conducting spacer layer within the MTJ and is patterned simultaneously with the MTJ. The SP free layer may be multiple layers or laminated layers of CoFeB. The storage layer may have a SyAP configuration and a laminated structure.

Abstract: A base station (BS), a subordinated station (SS) and the transmission methods thereof for use in a multi-input multi-output (MIMO) network are provided. The BS stores resource allocation information about the MIMO network and an SS list, and generate a super frame according to the resource allocation information and the SS list. The super frame comprises a pilot pattern which comprises a plurality of pilots and data. The BS and SS both considers the pilot pattern as an identifier of the SS. When there are communications occurred between the BS and the SS, the BS/SS will confirm whether the pilot pattern of the super frame matches the identifier of the SS to reduce interference from other stations in the MIMO network.

Abstract: An integrated circuit package system includes: providing a substrate; coupling an integrated circuit to the substrate; mounting a shielding element around the integrated circuit; applying a conductive shielding layer on the shielding element; and coupling a system interconnect to the shielding element.

Abstract: A process and apparatus of “Solid Oxide Fuel Cell (SOFC)-CO2 Energy Conversion Cycle (referred to as SOFC-CO2-ECC)” are invented to adopt CO2 as energy sources from waste/stock gas or convert and fix it in the useful compounds. CO2 is converted into CO and O2 via simultaneously catalytic and electrochemical reactions in SOFC for power generation and CO2 cracking. Furthermore, CO is used either as the fuel in SOFC for power generation or starting materials in the chemical reactors to produce CO-derivatives of energy source materials and useful chemical compounds. Hence, SOFC-CO2-ECC is an active or scientific carbon cycle with zero emission of CO2. Thus, the efficacy of environmental protection via solving the problem of CO2 greenhouse effect is achieved, so as to grasp of the “Right of Carbon Emission Trading” issues.

Abstract: A semiconductor device includes a pre-fabricated shielding frame mounted over a sacrificial substrate and semiconductor die. An encapsulant is deposited through an opening in the shielding frame around the semiconductor die. A first portion of the shielding frame to expose the encapsulant. Removing the first portion also leaves a second portion of the shielding frame over the semiconductor die as shielding from interference. A third portion of the shielding frame around the semiconductor die provides a conductive pillar. A first interconnect structure is formed over a first side of the encapsulant, shielding frame, and semiconductor die. The sacrificial substrate is removed. A second interconnect structure over the semiconductor die and a second side of the encapsulant. The shielding frame can be connected to low-impedance ground point through the interconnect structures or TSV in the semiconductor die to isolate the die from EMI and RFI, and other inter-device interference.

Abstract: A computer-implemented user interface method is disclosed that includes displaying on a touch screen of a computing device a keyboard defined by a first character set; displaying on the touch screen an electronic canvas on which information corresponding to keys on the keyboard is displayed as a user selects the keys on the keyboard, the information appearing in a second character set that differs from the first character set; generating a candidate area over a front surface of the canvas; and automatically controlling a location of the candidate area as information is added to the canvas so as to move the candidate area away from being over a location on the canvas that is presently, or next to be, a location at which information is added to the canvas.

Abstract: The present disclosure provides a photomask. The photomask includes a first integrated circuit (IC) feature formed on a substrate; and a second IC feature formed on the substrate and configured proximate to the first IC feature. The first and second IC features define a dense pattern having a first pattern density. The second IC feature is further extended from the dense pattern, forming an isolated pattern having a second pattern density less than the first pattern density. A transition region is defined from the dense pattern to the isolated pattern. The photomask further includes a sub-resolution rod (SRR) formed on the substrate, disposed in the transition region, and connected with the first IC feature.

Abstract: For a graphical user interface (GUI) for an audio video display device (AVDD) showing current video on a portion of the display, a bottom row of category icons is presented on at one end of the row a column of content panes representing content related to a category of a selected one of the icons.

Abstract: Compliance-relevant data from external systems comprising managed entities can be received, stored, processed, transformed and evaluated in an automated fashion. Compliance reporting can be generated dynamically to reflect the most current regulations, guidance and system operating conditions. Compliance data from external systems can be converted into a unified format compatible with a compliance management schema. A series of transformations can be applied to the compliance-relevant data. A compliance threshold can be provided to the compliance management system and compliance scoring can be provided.

Abstract: A method of printing a job having a type using an electrophotographic (EP) printer includes receiving the job and its type. A processor is used to automatically select a first or a second job mode based on the job type; the first job mode indicates aggressive gray component replacement (aGCR) is used but not clear toner, and the second job mode indicates clear toner is used but not aGCR. The data of the job are processed using the processor according to the selected job mode to provide six separations corresponding to respective colorants. Toner corresponding to the six separations is then applied to the receiver using at least one EP printing module in the EP printer to produce a print image of the job.

Abstract: A semiconductor die has a first semiconductor die mounted to a carrier. A plurality of conductive pillars is formed over the carrier around the first die. An encapsulant is deposited over the first die and conductive pillars. A first stepped interconnect layer is formed over a first surface of the encapsulant and first die. The first stepped interconnect layer has a first opening. A second stepped interconnect layer is formed over the first stepped interconnect layer. The second stepped interconnect layer has a second opening. The carrier is removed. A build-up interconnect structure is formed over a second surface of the encapsulant and first die. A second semiconductor die over the first semiconductor die and partially within the first opening. A third semiconductor die is mounted over the second die and partially within the second opening. A fourth semiconductor die is mounted over the second stepped interconnect layer.

Abstract: A battery control circuit includes an electronic switch, first and second diodes, and first and second batteries. A positive terminal of the first battery is connected to a positive terminal of the second battery through the first diode. A negative terminal of the first battery is connected to a positive terminal of the second battery through the electronic switch, and connected to a negative terminal of the second battery through the second diode. When the electronic switch receives a first control signal, the electronic switch is turned on, the first and second diodes are turned off, and the first and second batteries are connected in series. When the electronic switch receives a second control signal, the electronic switch is turned off, the first and second diodes are turned on, and the first and second batteries are connected in parallel.