Patents by Inventor Tai An

Tai An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090312742
    Abstract: Embodiments of an implantable electrolytic pump include a first expandable diaphragm and a second flexible diaphragm, and first and second chambers each for containing a fluid, wherein the first expandable diaphragm separates the first and second chambers and provides a fluid barrier therebetween, and the second chamber is formed between the first expandable diaphragm and the second flexible diaphragms. The pump may further include electrolysis electrodes within the first chamber for causing generation of a gas therein and to thereby expand the expandable diaphragm so that fluid is forced from the second chamber into a cannula.
    Type: Application
    Filed: May 8, 2009
    Publication date: December 17, 2009
    Inventors: Changlin Pang, Fukang Jiang, Jason Shih, Sean Caffey, Mark Humayun, Yu-Chong Tai
  • Patent number: 7634041
    Abstract: A dynamic carrying method to prevent saturation of a sigma-delta modulator of a phase locked loop frequency synthesizer. The phase locked loop frequency synthesizer using the dynamic carrying method comprises a forward portion receiving a reference frequency signal and a first frequency signal to generate an output carrier signal; a multi-modulus divider dividing the output carrier signal frequency to generate the first frequency signal; a dynamic carrying device receiving and separating transmitting data into a carrying part and a residue part when the transmitting data amplitude exceeds a threshold; a sigma-delta modulator receiving the residue part to generate a first modulus control signal; an auxiliary modulator receiving the carrying part to generate a second modulus control signal; and a first adder receiving the first modulus control signal, the second modulus control signal, and a third modulus control signal and outputting a modulus modulation signal to modulate the multi-modulus divider.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: December 15, 2009
    Assignee: Mediatek Inc.
    Inventors: Tai Yuan Yu, Ling-Wei Ke, Tser-Yu Lin, Hsin-Hung Chen
  • Patent number: 7633778
    Abstract: A switched-capacitor regulator is provided for regulating the output voltage of a voltage supply. The switched-capacitor regulator includes a supply input terminal capable of receiving a supply voltage, two or more flying capacitors, a regulation switch located between each flying capacitor and the supply input terminal, and a voltage control circuit. The activity of the regulation switches is controlled by the voltage control circuit. In one embodiment of the invention, the voltage control circuit includes a feedback resistance area having one or more feedback resistors located between the output of the flying capacitors and a ground terminal, a first gain stage connected to the feedback resistance area, and two or more second switchable gain stages, which are each connected to a regulation switch and the first gain stage. The switched-capacitor regulator operates in pseudo-continuous regulator mode using three-stage switchable operational amplifiers with time-multiplexed pole-splitting compensation.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: December 15, 2009
    Assignee: The Hong Kong University of Science an Technology
    Inventors: Kwok Tai Philip Mok, Hoi Lee
  • Patent number: 7631959
    Abstract: An ink jet head structure and an adhering method thereof are provided. The ink jet head structure has ink accommodated therein, and the ink is jetted with the operation of the actuator. The ink jet head structure includes a first substrate, a second substrate, and a third substrate sandwiched between the first and the second substrates. A first fluid passage is formed between the first and the third substrates, and a second fluid passage is formed between the second and the third substrates. By injecting glue between the first and the second fluid passages, the first, second and third substrates are bonded. When the actuator operates, the reservoir disposed in the three substrates may jet the ink accommodated therein from the ink outlet thereof, thereby achieving the purpose of easy bonding and ink jetting.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: December 15, 2009
    Assignee: Industrial Technology Research Institute
    Inventor: Chia-Tai Chen
  • Patent number: 7632733
    Abstract: This invention discloses a semiconductor wafer for manufacturing electronic circuit thereon. The semiconductor substrate further includes an etch-back indicator that includes trenches of different sizes having polysilicon filled in the trenches and then completely removed from some of the trenches of greater planar trench dimensions and the polysilicon still remaining in a bottom portion in some of the trenches having smaller planar trench dimensions.
    Type: Grant
    Filed: April 29, 2006
    Date of Patent: December 15, 2009
    Assignee: Alpha & Omega Semiconductor, Inc.
    Inventors: Yu Wang, Tiesheng Li, Sung-Shan Tai, Hong Chang
  • Publication number: 20090306595
    Abstract: In various embodiments, a tool is employed in filling a drug-delivery device. The tool may include, for example, a needle that is admitted through a fill port of the drug-delivery device.
    Type: Application
    Filed: May 8, 2009
    Publication date: December 10, 2009
    Inventors: Jason Shih, Changlin Pang, Fukang Jiang, Sean Caffey, Mark Humayun, Yu-Chong Tai, Raymond Peck
  • Publication number: 20090305871
    Abstract: A hollow fibre containing one or more layers having a mean pore size in one or more of said layers of less than 100 ?m. The invention also extends to a method for preparing porous hollow fibres and to the apparatus for preparing said fibres.
    Type: Application
    Filed: July 7, 2006
    Publication date: December 10, 2009
    Inventors: Semali Priyanthi Perera, Chin-Chin Tai
  • Publication number: 20090304851
    Abstract: A step-down sucking method is provided for minimizing the weaning stress of newborn calves. The method features feeding newborn calves with a sufficient amount of milk corresponding to 15-25% of body weight for 3˜5 weeks following birth, and then with a stepwise decreased amount of milk corresponding finally to 8-15% of body weight for 3-7 days, with the differential amount replaced with water and then with gradually decreased amounts of milk from 8-15% to zero % of the body weight and with solid feedstuffs for a period from 5 weeks to 6-8 weeks after birth. In the method, suckling with a large amount of milk (amounting to 15-25% of body weight) is conducted for 25-35 days after birth, followed by suckling with a decreased amount of milk (amounting to 8-15% of body weight) for 10-20 days, thereby inducing the calves to maximally take solid feedstuff with minimal weaning stress.
    Type: Application
    Filed: December 12, 2006
    Publication date: December 10, 2009
    Applicant: Republic of Korea (Rural Development Administratio n)
    Inventors: Hyun June Lee, Wang Shik Lee, Muhanmmad Ajmal Khan, Kwang Seok Ki, Hyeon Seop Kim, Byeong Seog Ahn, Soo Bong Park, Sung Jai Park, Guk Hyun Suh, Tai Young Hur, Sang Bum Kim, Byong Ho Park
  • Publication number: 20090306594
    Abstract: Embodiments of an implantable electrolytic pump include a drug reservoir, a cannula fluidly coupled to the reservoir, a pumping mechanism for forcing liquid from the reservoir through the cannula, control circuitry for operating the pumping mechanism, and a power source comprising primary and auxiliary batteries in a stacked configuration, only the main battery being operatively coupled to the control circuitry during normal operation, the control circuitry operatively coupling the back-up battery upon detection of an electrical fault. The pump may further include a hermetic enclosure containing the control circuitry and the power source.
    Type: Application
    Filed: May 8, 2009
    Publication date: December 10, 2009
    Inventors: Changlin Pang, Fukang Jiang, Jason Shih, Sean Caffey, Mark Humayun, Yu-Chong Tai, Jeffrey Brennan, Raymond Peck
  • Publication number: 20090302409
    Abstract: An image sensor includes a substrate having a surface at which incident light is received. A pixel array is formed over and within the substrate. The pixel array includes a first and a second pixel arranged to receive light of different colors. The first pixel includes a photosensitive region formed in the substrate and has a first anti-reflective coating (ARC) layer formed over the photosensitive region. The first ARC layer has a first thickness that produces destructive interference above the first ARC layer in response to the incident light. The second pixel includes a photosensitive region formed in the substrate, and a second ARC layer formed over the photosensitive region that produces destructive interference above the second ARC layer in response to the incident light.
    Type: Application
    Filed: June 4, 2008
    Publication date: December 10, 2009
    Applicant: Omnivision Technologies, Inc.
    Inventors: Yin Qian, Hsin-Chih Tai, Duli Mao, Vincent Venezia, Hidetoshi Nozaki, Howard E. Rhodes
  • Publication number: 20090303151
    Abstract: An antenna assembly includes a printed circuit board with a first surface and a second surface, a support attached on the first surface of the printed circuit board, and an antenna attached on the support. The printed circuit board includes a fastening area located on the first surface thereof, and a plurality of electric circuit arranged on the first surface of the printed circuit board. The support includes a receiving space corresponding to the fastening area of the printed circuit board. The antenna includes a planar radiating element substantially arranged on a first plane, and a connecting element being located on a second plane perpendicular to the first plane and extending downwardly from one edge of the radiating element. The connecting element includes an L-shaped connecting arm connected to the radiating element, at least one connecting pad and at least one grounding pad respectively extending from the connecting arm.
    Type: Application
    Filed: June 10, 2009
    Publication date: December 10, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Lung-Sheng Tai, Wen-Fong Su, Shang-Jen Chen, Chun-Ming Chiu
  • Publication number: 20090305981
    Abstract: The present invention relates to compositions and methods of use thereof for cancer therapy sensitization. Such compositions comprise functional fragments of the nucleotide and/or polypeptide sequences of a Secreted Protein Acidic and Rich in Cysteine (SPARC). The compositions can be used in combination with existing chemotherapeutic agents for treatment of cancers.
    Type: Application
    Filed: June 26, 2007
    Publication date: December 10, 2009
    Inventor: Isabella T. Tai
  • Publication number: 20090302358
    Abstract: An image sensor with a high full-well capacity includes a photosensitive region, a transfer gate, and sidewall spacers. The photosensitive region is formed to accumulate an image charge in response to light. The transfer gate disposed adjacent to the photosensitive region and coupled to selectively transfer the image charge from the photosensitive region to other pixel circuitry. First and second sidewall spacers are disposed on either side of the transfer gate. The first sidewall spacer closest to the photosensitive region is narrower than the second sidewall spacer. In some cases, the first sidewall spacer may be omitted.
    Type: Application
    Filed: June 4, 2008
    Publication date: December 10, 2009
    Applicant: OMNIVISION TECHNOLOGIES, INC.
    Inventors: Duli Mao, Hsin-Chih Tai, Vincent Venezia, Yin Qian, Howard E. Rhodes
  • Publication number: 20090306585
    Abstract: In various embodiments, an implantable pump includes a cannula. The pump (e.g., the cannula thereof) may include, for example, flow sensors, pressure sensors, filters, and/or other components.
    Type: Application
    Filed: May 8, 2009
    Publication date: December 10, 2009
    Inventors: Changlin Pang, Jason Shih, Fukang Jiang, Sean Caffey, Mark Humayun, Yu-Chong Tai
  • Publication number: 20090302205
    Abstract: An imager apparatus and methods are described. An embodiment of an imager module includes a plurality of groups of optical lenses, a lens frame, and at least one associated lens barrel configured to position and hold the plurality of groups of optical lenses. At least one of the groups of optical lenses is movable with respect to at least one other group of optical lenses for achieving optical focus. The imager module includes an integrated circuit (IC) imager die in proximity to the plurality of lenses, the imager die containing at least one image capture microelectronic device. The imager module includes a modular frame assembly that contains a first portion that holds a plurality of lens barrels, each containing one or more focusing lenses, and a second portion that supports the first portion at a specific distance from the substrate being imaged. The lens barrels are each responsive to different wavelengths or bands of wavelengths.
    Type: Application
    Filed: July 5, 2007
    Publication date: December 10, 2009
    Inventors: Richard Olsen, Darryl Sato, Jeffrey Brady, James Gates, Han Tai
  • Publication number: 20090302439
    Abstract: A semiconductor device is made by forming an integrated passive device (IPD) structure on a substrate, mounting first and second electrical devices to a first surface of the IPD structure, depositing encapsulant over the first and second electrical devices and IPD structure, forming a shielding layer over the encapsulant, and electrically connecting the shielding layer to a conductive channel in the IPD structure. The conductive channel is connected to ground potential to isolate the first and second electrical devices from external interference. A recess can be formed in the encapsulant material between the first and second electrical devices. The shielding layer extends into the recess. An interconnect structure is formed on a second surface of the IPD structure. The interconnect structure is electrically connected to the first and second electrical devices and IPD structure. A shielding cage can be formed over the first electrical device prior to depositing encapsulant.
    Type: Application
    Filed: June 4, 2008
    Publication date: December 10, 2009
    Applicant: STATS CHIPPAC, LTD.
    Inventors: Reza A. Pagaila, Byung Tai Do, Yaojian Lin, Rui Huang
  • Publication number: 20090307293
    Abstract: A method for determining an optimum sampling frequency to be performed by a power analyzer includes the following computer-implemented steps: sampling a time domain signal to obtain a sampling signal according to a predetermined sampling frequency; obtaining two reference sampling signals using higher and lower sampling frequencies compared to the predetermined sampling frequency; transforming the sampling signal and the reference sampling signals to frequency domain signals; computing a sum-of-amplitudes for each of the three frequency domain signals; estimating a minimum sum-of-amplitudes value and a corresponding re-sampling frequency; obtaining a new reference sampling signal using the re-sampling frequency; transforming the new reference sampling signal to a frequency domain signal, and computing a sum-of-amplitudes therefor; and re-estimating the minimum sum-of-amplitudes value and the corresponding re-sampling frequency.
    Type: Application
    Filed: February 12, 2009
    Publication date: December 10, 2009
    Applicant: I SHOU UNIVERSITY
    Inventors: Rong-Ching WU, Ching-Tai Chiang, Jong-Ian Tsai
  • Publication number: 20090300905
    Abstract: A fixing device for a voice coil motor component includes a first clamp, a second clamp and a connecting element. The first clamp has a first surface which defines a first recess. The second clamp has a second surface which defines a second recess. The connecting element engages the first clamp and the second clamp to fix the voice coil motor component between the first clamp and the second clamp.
    Type: Application
    Filed: December 9, 2008
    Publication date: December 10, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: TAI-HSU CHOU
  • Publication number: 20090301873
    Abstract: The present application is directed to complexes according to Formulae (I) or (II) as described herein, and their use as redox mediators in electrochemical biosensors.
    Type: Application
    Filed: December 21, 2006
    Publication date: December 10, 2009
    Applicant: OXFORD BIOSENSORS LTD.
    Inventors: Hugh Oliver Allen Hill, Christopher Paul Newman, Luet Lok Wong, Tai-Chu Lau
  • Publication number: 20090302445
    Abstract: A semiconductor package includes a semiconductor die. Encapsulant is flowed around a portion of the semiconductor die. The encapsulant is etched and a conductive material is deposited into the etched portion of the encapsulant to form a thermally conductive structure. In one embodiment, a trench is etched into the encapsulant and a thermally conductive material is deposited into the trench to form a thermal channel. In alternative embodiments, thermally conductive through hole vias (THVs) are formed in the encapsulant. A thermally conductive pad may be formed over the semiconductor die to facilitate removal of heat energy from the hot spots of the semiconductor die. A thermally conductive trace is formed to interconnect the thermal channel and the thermally conductive pad. A heat sink may be deposited over the semiconductor package. The packages are singulated by cutting through the encapsulant or the thermal channel.
    Type: Application
    Filed: June 9, 2008
    Publication date: December 10, 2009
    Applicant: STATS CHIPPAC, LTD.
    Inventors: Reza A. Pagaila, Byung Tai Do, Zigmund R. Camacho