Patents by Inventor Tai Chong Chai
Tai Chong Chai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10755993Abstract: Various embodiments may provide an electrical connection structure. The electrical connection structure may include a first substrate having a first surface defining a cavity, and an inner wall defining a via extending from the cavity. The electrical connection structure may also include an interconnect structure provided in the via so that at least a portion of the interconnect structure protrudes into the cavity. The electrical connection structure may further include a second substrate having a second surface facing the first surface. The electrical connection structure may additionally include a connection element on the second surface. At least a portion of the connection element may be received in the cavity so that the connection element is in electrical connection with the interconnect structure.Type: GrantFiled: March 16, 2017Date of Patent: August 25, 2020Assignee: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCHInventors: David Ho, Vempati Srinivasa Rao, Tai Chong Chai, Surya Bhattacharya
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Publication number: 20190080974Abstract: Various embodiments may provide an electrical connection structure. The electrical connection structure may include a first substrate having a first surface defining a cavity, and an inner wall defining a via extending from the cavity. The electrical connection structure may also include an interconnect structure provided in the via so that at least a portion of the interconnect structure protrudes into the cavity. The electrical connection structure may further include a second substrate having a second surface facing the first surface. The electrical connection structure may additionally include a connection element on the second surface. At least a portion of the connection element may be received in the cavity so that the connection element is in electrical connection with the interconnect structure.Type: ApplicationFiled: March 16, 2017Publication date: March 14, 2019Inventors: David HO, Vempati Srinivasa RAO, Tai Chong CHAI, Surya BHATTACHARYA
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Patent number: 9506823Abstract: A bonding stress testing arrangement and a method of determining stress are provided. The bonding stress testing arrangement includes at least one bond pad; a sensor assembly comprising any one of a first sensor arrangement, a second sensor arrangement and a combination of the first sensor arrangement and the second sensor arrangement; wherein the first sensor arrangement is adapted to measure an average stress on a portion of a bonding area under the at least one bond pad, and the second sensor arrangement is adapted to determine stress distribution over a portion or an entire of the bonding area under the at least one bond pad.Type: GrantFiled: May 3, 2011Date of Patent: November 29, 2016Assignee: Agency for Science, Technology and ResearchInventors: Cheryl Sharmani Selvanayagam, Xiaowu Zhang, Tai Chong Chai, Alastair David Trigg, Cheng Kuo Cheng, Xian Tong Chen, Kripesh Vaidyanathan
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Publication number: 20130199303Abstract: A bonding stress testing arrangement and a method of determining stress are provided. The bonding stress testing arrangement includes at least one bond pad; a sensor assembly comprising any one of a first sensor arrangement, a second sensor arrangement and a combination of the first sensor arrangement and the second sensor arrangement; wherein the first sensor arrangement is adapted to measure an average stress on a portion of a bonding area under the at least one bond pad, and the second sensor arrangement is adapted to determine stress distribution over a portion or an entire of the bonding area under the at least one bond pad.Type: ApplicationFiled: May 3, 2011Publication date: August 8, 2013Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCHInventors: Cheryl Sharmani Selvanayagam, Xiaowu Zhang, Tai Chong Chai, Alastair David Trigg, Cheng Kuo Cheng, Xian Tong Chen, Kripesh Vaidyanathan
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Publication number: 20120126419Abstract: According to one embodiment of the present invention, a substrate arrangement is provided. The substrate arrangement includes a first substrate; a second substrate positioned above the first substrate, the second substrate comprising a first through hole; a third substrate positioned above the second substrate, the third substrate comprising a second through hole; a first electrically conductive interconnect pillar positioned on the first substrate and extending from the first substrate through the first through hole to electrically contact the third substrate; and a second electrically conductive interconnect pillar positioned on the second substrate and extending from the second substrate through the second through hole. A method of manufacturing a substrate arrangement is also provided.Type: ApplicationFiled: July 24, 2008Publication date: May 24, 2012Inventors: Vaidyanathan Kripesh, Navas Khan Orattikalandar, Srinivasa Rao Vempati, Yak Long Samuel Lim, Yee Mong Khoo, Chee Houe Khong, Xiao Wu Zhang, Tai Chong Chai, Hon-Shing John Lau
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Patent number: 7189594Abstract: A wafer level package formed on an integrated circuit chip having bondpads and a fabrication method therefor is disclosed. The wafer level package comprises at least one first, second and third separation layer having at least one first and second conductive layer formed in-between the separation layers. The at least one first conductive layer is formed on the at least one first separation layer and is coupled to the bondpads. The at least one second conductive layer is formed on the at last one second separation layer wherein the at least one second conductive layer is electrically coupled to the at least one first conductive layer. The at least one third separation layer allows solder to be attached to the at least one second conductive layer for electrically coupling the solder to the bondpads. A chip ground plane is laid in the integrated circuit chip for providing a ground to the at least one first conductive layer and the solder.Type: GrantFiled: September 10, 2004Date of Patent: March 13, 2007Assignee: Agency for Science, Technology and ResearchInventors: Vaidyanathan Kripesh, Wai Kwan Wong, Mihai Dragos Rotaru, Tai Chong Chai, Mahadevan Krishna Iyer
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Publication number: 20060057832Abstract: A wafer level package formed on an integrated circuit chip having bondpads and a fabrication method therefor is disclosed. The wafer level package comprises at least one first, second and third separation layer having at least one first and second conductive layer formed in-between the separation layers. The at least one first conductive layer is formed on the at least one first separation layer and is coupled to the bondpads. The at least one second conductive layer is formed on the at last one second separation layer wherein the at least one second conductive layer is electrically coupled to the at least one first conductive layer. The at least one third separation layer allows solder to be attached to the at least one second conductive layer for electrically coupling the solder to the bondpads. A chip ground plane is laid in the integrated circuit chip for providing a ground to the at least one first conductive layer and the solder.Type: ApplicationFiled: September 10, 2004Publication date: March 16, 2006Applicant: Agency for Science, Technology and ResearchInventors: Vaidyanathan Kripesh, Wai Kwan Wong, Mihai Rotaru, Tai Chong Chai, Mahadevan Iyer
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Patent number: 6621151Abstract: A lead-frame for connecting and supporting an integrated circuit having an apertured frame with dimensions smaller than the corresponding dimensions of the chip so that chip-pad shoulder can be eliminated and the chip attach fillet is made remote from the chip corner.Type: GrantFiled: February 7, 2000Date of Patent: September 16, 2003Assignee: Institute of MicroelectronicsInventors: Tai Chong Chai, Thiam Beng Lim, Yong Chua Teo, James Tan, Raymundo Camenforte, Eric Neo, Daniel Yap
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Patent number: 6583501Abstract: A lead-frame for connecting and supporting an integrated circuit chip with a chip accommodating zone with inwardly extending ears for supporting the chip including minimum shoulder area, and having open crack and delamination stopping regions.Type: GrantFiled: February 7, 2000Date of Patent: June 24, 2003Assignee: Institute of MicroelectronicsInventors: Tai Chong Chai, Thiam Beng Lim, Yong Chua Teo, James Tan, Ray Camenforte, Eric Neo, Daniel Yap
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Publication number: 20020163078Abstract: A lead-frame for connecting and supporting an integrated circuit chip with a chip accommodating zone with inwardly extending ears for supporting the chip including minimum shoulder area, and having open crack and delamination stopping regions.Type: ApplicationFiled: February 7, 2000Publication date: November 7, 2002Inventors: Tai-Chong Chai, Thiam Beng Lim, Yong Chua Teo, James Tan, Raymundo Camenforte, Eric Neo, Daniel Yap
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Patent number: 5967577Abstract: A dispenser contains a chamber enclosed by an upper wall and a lower wall, both walls are oriented parallel to each other. The upper wall has a vertically bored inlet port and the lower wall has a plurality of vertically bored outlet ports for providing access to the chamber. The outlet ports are geometrically arranged in an array pattern characterized by equidistantly spaced rows and columns of bores. There is a plurality of baffle plates interposed between the upper wall and the lower wall. The baffle plates, which are spatially separated from each other, are oriented parallel to and spatially separated from the upper and lower walls. The baffle plates have a plurality of vertically bored holes for providing access between the inlet port and the outlet ports, whereby the dispenser is effective in providing homogeneous flow of fluid through the outlet ports.Type: GrantFiled: September 3, 1998Date of Patent: October 19, 1999Assignee: Institute of MicroelectronicsInventors: Sarvotham M. Bhandarkar, Kishore Kumar Chakravorty, Tai Chong Chai, Jian Hua Wu
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Patent number: 5836520Abstract: A dispenser contains a chamber enclosed by an upper wall and a lower wall, both walls are oriented parallel to each other. The upper wall has a vertically bored inlet port and the lower wall has a plurality of vertically bored outlet ports for providing access to the chamber. The outlet ports are geometrically arranged in an array pattern characterized by equidistantly spaced rows and columns of bores. There is a plurality of baffle plates interposed between the upper wall and the lower wall. The baffle plates, which are spatially separated from each other, are oriented parallel to and spatially separated from the upper and lower walls. The baffle plates have a plurality of vertically bored holes for providing access between the inlet port and the outlet ports, whereby the dispenser is effective in providing homogeneous flow of fluid through the outlet ports.Type: GrantFiled: January 4, 1996Date of Patent: November 17, 1998Assignee: Institute of MicroelectronicsInventors: Sarvotham M. Bhandarkar, Kishore Kumar Chakravorty, Tai Chong Chai, Jian Hua Wu