Abstract: A system for testing a die (or chip) of a semiconductor wafer is disclosed. It features measuring the temperature of the die according to a light beam originating from the die. The temperature so measured functions as part of test record and/or the basis for controlling the temperature of the die. Measuring the temperature of a die in such a way will replace measuring the temperature of a die conventionally via the wafer carrier on which the die being tested is placed. The system comprises: a die test device for testing the performance and/or quality of a die; and a temperature detector separated from the die and the wafer, for measuring the temperature of the die according to a light beam originating from the die. The temperature detector may be either connected to or embedded in the die test device, or be placed at another location. Another feature is the use of a light emitter which produces light beams directed to the die or the wafer for providing heat thereto.

Abstract: A system for testing a die (or chip) of a semiconductor wafer is disclosed. It features measuring the temperature of the die according to a light beam radiated from the die. The temperature so measured functions as part of test record and/or the basis for controlling the temperature of the die. Measuring the temperature of a die in such a way will replace measuring the temperature of a die conventionally via the wafer carrier on which the die being tested is placed. The system comprises: a die test device for testing the performance and/or quality of a die; and a temperature detector separated from the die and the wafer, for measuring the temperature of the die according to a light beam radiated from the die. The temperature detector may be either connected to or embedded in the die test device, or be placed at another location. Another feature is the use of a light emitter which produces light beams directed to the die or the wafer for providing heat thereto.