Patents by Inventor Tai-Hsiang Chen

Tai-Hsiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12087690
    Abstract: An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a power conductive line, and a power via. The contact conductive line extends from the source region. The power conductive line is coupled to the contact conductive line. The power via interconnects the supply conductive line and the power conductive line.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: September 10, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Sheng-Hsiung Chen, Chung-Hsing Wang, Fong-yuan Chang, Lee-Chung Lu, Li-Chun Tien, Po-Hsiang Huang, Shao-huan Wang, Ting Yu Chen, Yen-Pin Chen, Chun-Chen Chen, Tzu-Hen Lin, Tai-Yu Cheng
  • Patent number: 12067164
    Abstract: Techniques for proving haptic feedback in computing systems are described. In operation, an input representing utilisation parameters of an electronic pen is received. In an example, the electronic pen may be electronically coupled to the computing system. Based on the received utilisation parameters, the computing system provides a pattern of haptic feedback to the user.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: August 20, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Charles J. Stancil, Tai Hsiang Chen, Hung-Ming Chen, Simon Wong, Hsiang-Ta Ke, Yi-Hsien Lin, Jung-Hsing Wang
  • Patent number: 11726570
    Abstract: In some examples, an electronic device includes a tip pressure sensor to capture tip pressure data based on a writing surface. In some examples, the electronic device includes a processor to produce a classification of the writing surface based on the tip pressure data via a machine learning model. In some examples, the electronic device may include a haptic device to control haptic feedback based on the classification.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: August 15, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Tai Hsiang Chen, Charles J. Stancil, Wei-Hung Lin, Kun-Hung Lin
  • Publication number: 20230101000
    Abstract: Examples of an input device holder assembly are described herein. In one example, the input device holder assembly can include a first holding element and a second holding element to cooperate with the first holding element to hold a writing instrument. The first holding element includes a first receptacle channel and the second holding element includes a second receptacle channel. Both, the first and the second receptacle channels are formed as open-ended slots. The first holding element and the second holding element are positioned relative to each other to align the first receptacle channel and the second receptacle channel to receive and remove the writing instrument.
    Type: Application
    Filed: March 27, 2020
    Publication date: March 30, 2023
    Inventors: Cheng-Han Tsai, Wen-Hua Ni, Tai-Hsiang Chen
  • Publication number: 20230077550
    Abstract: In some examples, an electronic device includes a tip pressure sensor to capture tip pressure data based on a writing surface. In some examples, the electronic device includes a processor to produce a classification of the writing surface based on the tip pressure data via a machine learning model. In some examples, the electronic device may include a haptic device to control haptic feedback based on the classification.
    Type: Application
    Filed: September 15, 2021
    Publication date: March 16, 2023
    Inventors: Tai Hsiang Chen, Charles J. Stancil, Wei-Hung Lin, Kun-Hung Lin
  • Patent number: 11520418
    Abstract: In one example, an input pen may include an electronic component, a communication interface to establish a short-range wireless connection with an electronic device, and a controller communicatively coupled to the electronic component and the communication interface. The controller may receive a command from the electronic device via the communication interface. The command may uniquely correspond to an operating mode of the electronic device. Further, the controller may control a power state of the electronic component based on the command.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: December 6, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Charles J Stancil, Dale R Knutson, Tai Hsiang Chen, Simon H Wong
  • Patent number: 11474623
    Abstract: An example stylus pen may include a main body including a first battery and a writing tip attached to the main body. Further, the stylus pen may include a cap removably disposed on the main body to cover the writing tip. The cap may include a second battery. Furthermore, the stylus pen may include a controller to charge the first battery from the second battery.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: October 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Tai Hsiang Chen, Wei Hung Lin, Hung Sung Pan
  • Publication number: 20220283641
    Abstract: In one example, an electronic device may include a touch panel defining an input surface having an input region and a display panel disposed below the touch panel. The display panel may visualize a virtual keyboard including a set of virtual keys. Further, the electronic device may include a haptic array module disposed below the display panel. The haptic array module may include a first actuator disposed below the input region corresponding to a first virtual key of the set of virtual keys. Further, the electronic device may include a controller in communication with the haptic array module to trigger the first actuator to generate a haptic output at the input region in response to an activation of the virtual keyboard.
    Type: Application
    Filed: November 8, 2019
    Publication date: September 8, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hung-Ming Chen, Charles Stancil, Tai Hsiang Chen, Wei Hung Lin
  • Publication number: 20220229494
    Abstract: Techniques for proving haptic feedback in computing systems are described. In operation, an input representing utilisation parameters of an electronic pen is received. In an example, the electronic pen may be electronically coupled to the computing system. Based on the received utilisation parameters, the computing system provides a pattern of haptic feedback to the user.
    Type: Application
    Filed: September 16, 2019
    Publication date: July 21, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Charles J. Stancil, Tai Hsiang Chen, Hung-Ming Chen, Simon Wong, Hsiang-Ta Ke, Yi-Hsien Lin, Jung-Hsing Wang
  • Publication number: 20220027001
    Abstract: In one example, an input pen may include an electronic component, a communication interface to establish a short-range wireless connection with an electronic device, and a controller communicatively coupled to the electronic component and the communication interface. The controller may receive a command from the electronic device via the communication interface. The command may uniquely correspond to an operating mode of the electronic device. Further, the controller may control a power state of the electronic component based on the command.
    Type: Application
    Filed: April 16, 2019
    Publication date: January 27, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Charles J Stancil, Dale R. Knutson, Tai Hsiang Chen, Simon H. Wong
  • Publication number: 20120138981
    Abstract: A light-emitting diode apparatus includes a light-emitting diode, a first package layer provided over the light-emitting diode, and a second package layer provided over the first package layer. The first package layer is dosed with phosphor. The second package layer is not dosed with any phosphor. The second package layer is formed with a textured light-emitting surface.
    Type: Application
    Filed: December 2, 2010
    Publication date: June 7, 2012
    Applicant: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
    Inventors: Hsuen-Li Chen, Shih-Liang Ku, Tai-Hsiang Chen, Chan-Wei Hsu