Patents by Inventor Tai-Hsuan WU

Tai-Hsuan WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power shared cell architecture
    Patent number: 11068640
    Abstract: An integrated circuit structure includes a metal level comprising a plurality of interconnect lines along a first direction. A cell is on the metal level, wherein one or more of the plurality of interconnect lines that extend through the cell comprise a power shared track that is segmented inside the cell into one or more power segments and one or more signal segments so that both power and signals share a same track.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: July 20, 2021
    Assignee: Intel Corporation
    Inventors: Ranjith Kumar, Mark T. Bohr, Ruth A. Brain, Marni Nabors, Tai-Hsuan Wu, Sourav Chakravarty
  • POWER SHARED CELL ARCHITECTURE
    Publication number: 20200279069
    Abstract: An integrated circuit structure includes a metal level comprising a plurality of interconnect lines along a first direction. A cell is on the metal level, wherein one or more of the plurality of interconnect lines that extend through the cell comprise a power shared track that is segmented inside the cell into one or more power segments and one or more signal segments so that both power and signals share a same track.
    Type: Application
    Filed: December 28, 2017
    Publication date: September 3, 2020
    Inventors: Ranjith KUMAR, Mark T. BOHR, Ruth A. BRAIN, Marni NABORS, Tai-Hsuan WU, Sourav CHAKRAVARTY