Abstract: The present invention provides an active mini LED display and driving method thereof. The driving method comprises: controlling a gate voltage of the metal oxide field effect transistor by a voltage to modulate the current and luminous brightness required to driver the light emitting diode; processing display data to generate timing-controlled channel signals and scanning signals to driver transistors and light emitting diodes to achieve image display; modulating scanning voltage signals or channel voltage signals into analog-type voltages and/or pulse-width-type voltages, and then compensating the unevenness in brightness produced by the epitaxy of each light-emitting diode. The driving method of the active mini LED display of the present invention can reduce the power loss of transmission, and can integrate with various light emitting diodes within a small pixel pitch to manufacture various displays by means of heterogeneous polycrystalline wafer-level packaging.

Abstract: The invention provides a chip structure of a micro light-emitting diode display, comprising a package substrate, at least one light-emitting diode (LED) element, at least one metal oxide semiconductor field effect transistor (MOSFET), and a connection line. The LED element and the MOSFET are positioned on the package substrate, and each MOSFET comprises a source connected with the input voltage in common, a gate connected with a main control circuit, and a drain. An end of the LED element is connected with the drain of the MOSFET through the connection line, and the other end of the LED element is independently connected with a source drive circuit. Therefore, the MOSFET is provided on the package substrate and integrated in a chip structure, so as to achieve a better heat dissipation effect and requirements of high density and brightness.

Abstract: The present invention provides a packaging method and a packaging structure for a cascode power electronic device, in which a hetero-multiple chip scale package is used to replace the traditional die bonding and wire bonding packaging method. The cascode power electronic device can reduce the inductance resistance and thermal resistance of the connecting wires and reduce the size of the package; and increase the switching frequency of power density. The chip scale package of the present invention uses more than one gallium nitride semiconductor die, more than one diode, and more than one metal oxide semiconductor transistor. The package structure can use TO-220, quad flat package or other shapes and sizes; the encapsulation process of the traditional epoxy molding compounds can be used in low-power applications; and the encapsulation process of ceramic material can be used in high-power applications.

Abstract: The invention provides a chip structure of a micro light-emitting diode display, comprising a package substrate, at least one light-emitting diode (LED) element, at least one metal oxide semiconductor field effect transistor (MOSFET), and a connection line. The LED element and the MOSFET are positioned on the package substrate, and each MOSFET comprises a source connected with the input voltage in common, a gate connected with a main control circuit, and a drain. An end of the LED element is connected with the drain of the MOSFET through the connection line, and the other end of the LED element is independently connected with a source drive circuit. Therefore, the MOSFET is provided on the package substrate and integrated in a chip structure, so as to achieve a better heat dissipation effect and requirements of high density and brightness.

Abstract: The present invention provides a packaging method and a packaging structure for a cascode power electronic device, in which a hetero-multiple chip scale package is used to replace the traditional die bonding and wire bonding packaging method. The cascode power electronic device can reduce the inductance resistance and thermal resistance of the connecting wires and reduce the size of the package; and increase the switching frequency of power density. The chip scale package of the present invention uses more than one gallium nitride semiconductor die, more than one diode, and more than one metal oxide semiconductor transistor. The package structure can use TO-220, quad flat package or other shapes and sizes; the encapsulation process of the traditional epoxy molding compounds can be used in low-power applications; and the encapsulation process of ceramic material can be used in high-power applications.

Abstract: A package structure of photodiode and a forming method of the same are provided. The method includes providing a heat-dissipation plate; placing a circuit board on the heat-dissipation plate, the circuit board having an opening exposing a top surface of the heat-dissipation plate and a first contact pad located on a peripheral area of the opening; placing a carrier with a metal cladding surface into the opening, the carrier connecting the top surface of the heat-dissipation plate; placing a photodiode chip on the carrier wherein the bottom area of the photodiode chip is less than the metal cladding surface such that a portion of the metal cladding surface is exposed; and electrically connecting the exposed metal cladding surface to the first contact pad.

Abstract: A photodiode device and methods of manufacturing the same are provided. The photodiode device comprises a light absorption layer defining a light-facing side and a back-light side; a via passing through the absorption layer, the via defining a side wall and a bottom surface; a conformal isolation layer covering the side wall and the bottom surface; a first patterned conductive layer disposed on the back-light side, the first patterned conductive layer having a first portion covering a first portion of the conformation isolation layer; a second patterned conductive layer disposed on the light-facing side of the absorption layer; and an opening through the conformal isolation layer, wherein the opening is filled with the second patterned conductive layer such that the second patterned conductive layer is connected with the first portion of the first patterned conductive layer.

Abstract: This invention discloses an electrode of a solar cell electrically connected to a conductive element via a connect structure. The electrode of the solar cell includes a dielectric structure including one or more openings and located on a contact electrode. The connect structure is disposed within the openings to avoid horizontally diffusing into the contact electrode.

Abstract: A packaging structure and process of solar cell is disclosed. The packaging structure of solar cell comprises two conductive films and two surface electrodes disposed on a photovoltaic cell (PV cell), wherein two conductive films are respectively electrically coupled with the surface electrodes via a plurality of solder balls.

Abstract: A three-dimensional type concentrating solar cell system without sun-tracing apparatus is provided. The system comprises a plurality of sphere-like concentrators and a plurality of photovoltaic cell. The sphere-like concentrators are arranged to form a curved surface. There is no need for the system to trace the light source, such as the sun. The present invention can provide sufficient electric power for user's applications.

Abstract: A package structure of photodiode and a forming method of the same are provided. The method includes providing a heat-dissipation plate; placing a circuit board on the heat-dissipation plate, the circuit board having an opening exposing a top surface of the heat-dissipation plate and a first contact pad located on a peripheral area of the opening; placing a carrier with a metal cladding surface into the opening, the carrier connecting the top surface of the heat-dissipation plate; placing a photodiode chip on the carrier wherein the bottom area of the photodiode chip is less than the metal cladding surface such that a portion of the metal cladding surface is exposed; and electrically connecting the exposed metal cladding surface to the first contact pad.

Abstract: A photodiode device and methods of manufacturing the same are provided. The photodiode device comprises a light adsorption layer defining a light-facing side and a back-light side; a via passing through the adsorption layer, the via defining a side wall and a bottom surface; a conformal isolation layer covering the side wall and the bottom surface; a first patterned conductive layer disposed on the back-light side, the first patterned conductive layer having a first portion covering a first portion of the conformation isolation layer; a second patterned conductive layer disposed on the light-facing side of the adsorption layer; and an opening through the conformal isolation layer, wherein the opening is filled with the second patterned conductive layer such that the second patterned conductive layer is connected with the first portion of the first patterned conductive layer.

Abstract: The present invention provides a solar power generating apparatus including a base and multiple power generating units connected in series. Each of the power generating units includes a heat dissipation plate separably connected to the base; a solar cell disposed on the heat dissipation plate; and a rectification device connected in parallel to the solar cell. When the heat dissipation plate of one of the power generating units is detached from the base, the others of the power generating units may continue to operate.

Abstract: An array type concentrating solar cell system without sun-tracing system is provided, wherein a plurality of transparent spheres or sphere-like transparent articles is used as concentrating means and hence there is no need for the concentrating means to trace the light source, such as the Sun. The plurality of transparent spheres (or sphere-like transparent articles), as concentrating means, can provide sufficient electric power for user's applications.

Abstract: A concentrating solar cell module without sun-tracing system is provided, wherein a transparent sphere is used as a concentrator and hence there is no need for the concentrator to trace light source, such as the Sun.

Abstract: An enhanced solar collector is provided in this invention, wherein a through hole is formed in a secondary mirror in Cassegrain system, and a light collecting device focusing lights, originally shaded by the secondary mirror, via the through hole to increase light-collecting efficiency of the enhanced solar collector.