Patents by Inventor Tai-Hung KUO

Tai-Hung KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20240109768
    Abstract: A sensor device package and method of manufacturing the same are provided. The sensor device package includes a carrier, a sensor component, an encapsulation layer and a protection film. The sensor component is disposed on the carrier, and the sensor component includes an upper surface and edges. The encapsulation layer is disposed on the carrier and encapsulates the edges of the sensor component. The protection film covers at least a portion of the upper surface of the sensor component.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 4, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chieh-An YEH, Tai-Hung KUO
  • METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
    Publication number: 20230037117
    Abstract: A method of manufacturing a semiconductor structure is provided. The method includes the following operations: providing a semiconductor substrate; performing a first cutting operation along a first set of cutting lines of the semiconductor substrate; and performing a second cutting operation along a second set of cutting lines of the semiconductor substrate later than performing the first cutting operation, wherein the second set of cutting lines are arranged interlacedly with the first set of cutting lines along a first direction.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Bo Hua CHEN, Yan Ting SHEN, Tsung Chi WU, Tai-Hung KUO
  • Stacked structure and method for manufacturing the same
    Patent number: 11332363
    Abstract: A stacked structure includes a polymer layer and a metal layer. The metal layer is disposed on the polymer layer. A burr length on a surface of the polymer layer is about 0.8 ?m to about 150 ?m, and a burr length on a surface of the metal layer is about 0.8 ?m to about 7 ?m.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: May 17, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chieh-An Yeh, Tai-Hung Kuo
  • SEMICONDUCTOR DEVICE PACKAGE CONTAINING A MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210249371
    Abstract: A semiconductor device package includes a substrate, a lid, a MEMS device and a gel. The lid is disposed on the substrate and defines a cavity together with the substrate. The MEMS device is disposed in the cavity. The gel covers the MEMS component. The lid is attached to the substrate through a silicone-based adhesive.
    Type: Application
    Filed: February 10, 2020
    Publication date: August 12, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jia-Zhe LEE, Tai-Hung KUO
  • SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210246015
    Abstract: A sensor device package and method of manufacturing the same are provided. The sensor device package includes a carrier, a sensor component, an encapsulation layer and a protection film. The sensor component is disposed on the carrier, and the sensor component includes an upper surface and edges. The encapsulation layer is disposed on the carrier and encapsulates the edges of the sensor component. The protection film covers at least a portion of the upper surface of the sensor component.
    Type: Application
    Filed: February 6, 2020
    Publication date: August 12, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chieh-An YEH, Tai-Hung KUO
  • STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210130166
    Abstract: A stacked structure includes a polymer layer and a metal layer. The metal layer is disposed on the polymer layer. A burr length on a surface of the polymer layer is about 0.8 ?m to about 150 ?m, and a burr length on a surface of the metal layer is about 0.8 ?m to about 7 ?m.
    Type: Application
    Filed: October 31, 2019
    Publication date: May 6, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chieh-An YEH, Tai-Hung KUO
  • Semiconductor package structure, product and method for manufacturing the same
    Patent number: 10892199
    Abstract: A semiconductor package structure includes a substrate, a semiconductor sensor, a lid and an air-permeable film. The semiconductor sensor is disposed on the substrate. The lid covers the semiconductor sensor and defines a through hole. The air-permeable film covers the through hole of the lid and has a first surface. The first surface is hydrophilic.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: January 12, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Ming Chen, Yu-Sung Lin, Tai-Hung Kuo
  • SEMICONDUCTOR PACKAGE STRUCTURE, PRODUCT AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20200312730
    Abstract: A semiconductor package structure includes a substrate, a semiconductor sensor, a lid and an air-permeable film. The semiconductor sensor is disposed on the substrate. The lid covers the semiconductor sensor and defines a through hole. The air-permeable film covers the through hole of the lid and has a first surface. The first surface is hydrophilic.
    Type: Application
    Filed: April 1, 2019
    Publication date: October 1, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Ming CHEN, Yu-Sung LIN, Tai-Hung KUO