Abstract: A semiconductor package may include a package substrate with a top surface and a bottom surface opposite to the top surface, the top surface of the package substrate configured to have a semiconductor chip mounted thereon, a power block and a ground block in the package substrate, the power block configured as a power pathway penetrating the package substrate, and the ground block configured as a ground pathway penetrating the package substrate, first vias extended from the power block and the ground block, and the first vias electrically connected to the semiconductor chip, second vias extended from the power block and the ground block toward the bottom surface of the package substrate, and block vias to penetrate the power block and the ground block, the block vias electrically connected to the semiconductor chip and electrically separated from the power block and the ground block.

Abstract: A semiconductor package may include a package substrate with a top surface and a bottom surface opposite to the top surface, the top surface of the package substrate configured to have a semiconductor chip mounted thereon, a power block and a ground block in the package substrate, the power block configured as a power pathway penetrating the package substrate, and the ground block configured as a ground pathway penetrating the package substrate, first vias extended from the power block and the ground block, and the first vias electrically connected to the semiconductor chip, second vias extended from the power block and the ground block toward the bottom surface of the package substrate, and block vias to penetrate the power block and the ground block, the block vias electrically connected to the semiconductor chip and electrically separated from the power block and the ground block.

Abstract: A camera module includes an image sensor package including an image sensor chip and a chip cover layer protecting the image sensor chip, a first lens disposed above the image sensor package to be coupled with an upper surface of the chip cover layer, a second lens disposed over the first lens, and an infrared blocking film formed in direct contact with the upper surface of the chip cover layer or an upper surface of the second lens.

Abstract: In one embodiment, an image sensor module having an auto-aligned lens includes: a substrate on which an image sensor chip is mounted; a housing which has an opening to expose an upper surface of the image sensor chip, and which is attached onto the substrate; a lens holder which extends the opening vertically and upwardly; and a lens unit incorporating spacers which is fixed to an inner sidewall of the lens holder and is aligned automatically. Friction-caused particles are not produced, and focal alignment is readily automated.

Abstract: In one embodiment, an image sensor module having an auto-aligned lens includes: a substrate on which an image sensor chip is mounted; a housing which has an opening to expose an upper surface of the image sensor chip, and which is attached onto the substrate; a lens holder which extends the opening vertically and upwardly; and a lens unit incorporating spacers which is fixed to an inner sidewall of the lens holder and is aligned automatically. Friction-caused particles are not produced, and focal alignment is readily automated.