Patents by Inventor Tai-Jen Chen

Tai-Jen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240194785
    Abstract: A fin-type field-effect transistor (FinFET) device includes a plurality of fins formed over a substrate. The semiconductor device further includes a dielectric layer filled in a space between each fin and over a first portion of the plurality of fins and a dielectric trench formed in the dielectric layer. The dielectric trench has a vertical profile. The semiconductor device further includes a second portion of the plurality of fins recessed and exposed in the dielectric trench. The second portion of the plurality of fins have a rounded-convex-shape top profile.
    Type: Application
    Filed: February 19, 2024
    Publication date: June 13, 2024
    Inventors: Chia Tai Lin, Yih-Ann Lin, An-Shen Chang, Ryan Chia-Jen Chen, Chao-Cheng Chen
  • Publication number: 20240166711
    Abstract: The present application provides a method for promoting the sternness and/or transdifferentiation of acinar cells, comprising the following steps: providing an acinar cell, transfecting a plasmid into the acinar cell, and culturing the transfected acinar cell, wherein the plasmid contains a genetic material for overexpression of N-acetylglucosaminyltransferase V (GnT-V).
    Type: Application
    Filed: November 18, 2022
    Publication date: May 23, 2024
    Inventors: Pei-Jen Lou, Tai-Horng Young, Ching-Chia Cheng, Mei-Chun Lin, Hisn-Lin Chen
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Publication number: 20070154865
    Abstract: A method includes the steps of preparing a tooth mold of a rollover from a patient's mouse; scanning the tooth mold to convert it into digital data and to create a digital model; conducting operations of at least positioning, integration, and edition of the digital model to create a digital plaster mold; and converting the digital plaster mold through computer-added manufacturing (CAM) into a program for a processing machine and then processing a material with the processing machine based on the program to produce a substantial plaster mold. Accordingly, the present invention can simplify the delivery/transportation process, reduce the costs, speed up the production, and do the standardization.
    Type: Application
    Filed: July 21, 2006
    Publication date: July 5, 2007
    Applicant: POU YUEN TECHNOLOGY CO., LTD.
    Inventors: Hong-Tzong Yau, Chuan-Chu Kuo, Yin-Shih Lu, Chine-An Chen, Tai-Jen Chen, Bin-Ru Tseng