Patents by Inventor Tai-Jui Wang

Tai-Jui Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250219033
    Abstract: A bonding structure, including a first dielectric layer, multiple first conductors, a second dielectric layer, and multiple second conductors, is provided. The first conductors are embedded in the first dielectric layer, the first dielectric layer is bonded with the second dielectric layer, and the second conductors are embedded in the second dielectric layer, wherein the first conductors are bonded with the second conductors, and a bonding interface between the first conductors and the second conductors is a bonding interface containing silver.
    Type: Application
    Filed: February 5, 2024
    Publication date: July 3, 2025
    Applicant: Industrial Technology Research Institute
    Inventors: Jui-Wen Yang, Chieh-Wei Feng, Chih Wei Lu, Hsien-Wei Chiu, Tai-Jui Wang
  • Publication number: 20250126722
    Abstract: A circuit compensation method applied to pattern displacement includes: disposing at least one chip on a carrier; measuring a shift of the chip, performing circuit position compensation on a predetermined pattern of a redistribution layer, and calculating a resistance difference of the pattern before and after the circuit position compensation; estimating a circuit proportion and a range of resistance variation in the pattern needed for resistance compensation after the circuit position compensation according to the resistance difference; determining a compensation position and a scheme of circuit proportion and adjusting a circuit width, area, length, pattern, or combination thereof of a circuit within the circuit proportion according to the resistance difference; outputting a picture file of the pattern after the circuit position and resistance compensation; and forming the redistribution layer according to the picture file and electrically connecting the redistribution layer to the chip.
    Type: Application
    Filed: October 16, 2024
    Publication date: April 17, 2025
    Applicant: Industrial Technology Research Institute
    Inventors: Chieh-Wei Feng, Cheng-Yueh Chang, Tai-Jui Wang
  • Publication number: 20240130657
    Abstract: A physiological sensing device for sensing physiological signal of an organism is provided. The physiological sensing device includes a sensing chip, a coupling sensing electrode and a coupling dielectric stacked layer. The coupling sensing electrode is electrically connected to the sensing chip. The coupling dielectric stacked layer covers the coupling sensing electrode. The coupling dielectric stacked layer is located between the coupling sensing electrode and the organism. The coupling dielectric stacked layer includes a first dielectric layer and a second dielectric layer. The dielectric constant of the second dielectric layer is greater than that of the first dielectric layer. The second dielectric layer is located between the first dielectric layer and the organism.
    Type: Application
    Filed: August 23, 2023
    Publication date: April 25, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Hsien-Wei Chiu, Tai-Jui Wang, Chieh-Wei Feng, Jui-Wen Yang
  • Publication number: 20240088004
    Abstract: A stacked wiring structure includes a first wiring substrate and a second wiring substrate. The first wiring substrate includes a first glass substrate, multiple first conductive through vias penetrating through the first glass substrate, and a first multi-layered redistribution wiring structure disposed on the first glass substrate. The second wiring substrate includes a second glass substrate, multiple second conductive through vias penetrating through the second glass substrate, and a second multi-layered redistribution wiring structure disposed on the second glass substrate. The first conductive through vias are electrically connected to the second conductive through vias. The first glass substrate is spaced apart from the second glass substrate. The first multi-layered redistribution wiring structure is spaced apart from the second multi-layered redistribution wiring structure by the first glass substrate and the second glass substrate.
    Type: Application
    Filed: August 21, 2023
    Publication date: March 14, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Tai-Jui Wang, Jui-Wen Yang, Chieh-Wei Feng, Chih Wei Lu, Hsien-Wei Chiu
  • Patent number: 11839120
    Abstract: An electronic device including a pixel array structure, a redistribution structure, and a plurality of conductive via structures is provided. The pixel array structure includes a plurality of signal lines. The redistribution structure overlaps the pixel array structure and includes a plurality of conductive lines. The conductive via structures electrically connect the signal lines of the pixel array structure and the conductive lines of the redistribution structure. At least one of the conductive via structures shares at least one conductive layer with the pixel array structure.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: December 5, 2023
    Assignee: Industrial Technology Research Institute
    Inventors: Wei-Chung Chen, Wen-Yu Kuo, Chieh-Wei Feng, Tai-Jui Wang
  • Patent number: 11776920
    Abstract: Provided a filter and a redistribution layer structure including the same. The capacitor includes a first electrode, a second electrode, a third electrode, a dielectric layer, and a conductive through via. The second electrode is disposed above the first electrode. The third electrode is disposed between the first electrode and the second electrode. The dielectric layer is disposed between the first electrode and the third electrode and between the second electrode and the third electrode. The conductive through via penetrates the dielectric layer and the third electrode to be connected to the first electrode and the second electrode, and is electrically separated from the third electrode. The first electrode and the second electrode are signal electrodes, and the third electrode is a ground electrode.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: October 3, 2023
    Assignee: Industrial Technology Research Institute
    Inventors: Tzu-Yang Ting, Chieh-Wei Feng, Tai-Jui Wang
  • Patent number: 11764166
    Abstract: Provided is a semiconductor package structure including a redistribution layer (RDL) structure, a chip, an electronic device and a stress compensation layer. The RDL structure has a first surface and a second surface opposite to each other. The chip is disposed on the first surface and electrically connected to the RDL structure. The electronic device is disposed in the RDL structure, electrically connected to the chip, and includes a dielectric layer disposed therein. The stress compensation layer is disposed in or outside the RDL structure. The dielectric layer provides a first stress between 50 Mpa and 200 Mpa in a first direction perpendicular to the second surface, the stress compensation layer provides a second stress between 50 Mpa and 200 Mpa in a second direction opposite to the first direction, and the difference between the first stress and the second stress does not exceed 60 Mpa.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: September 19, 2023
    Assignees: Industrial Technology Research Institute, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jui-Wen Yang, Hsin-Cheng Lai, Chieh-Wei Feng, Tai-Jui Wang, Yu-Hua Chung, Tzu-Yang Ting
  • Publication number: 20230216001
    Abstract: A pixel structure is provided. The pixel structure includes a substrate and a conductive line electrically connected to the substrate. The ratio of the height to the width of the conductive line is between 0.5 and 6. The pixel structure also includes an electrode electrically connected to the conductive line and a conversion element electrically connected to the conductive lines through the electrode.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Inventors: Yu-Chang LIN, Tai-Jui WANG, Chieh Wei FENG, Wei-Chung CHEN
  • Publication number: 20230071946
    Abstract: The present disclosure provides a package structure, an antenna module, and a probe card. The package structure includes a connection member and a first redistribution structure disposed on the connection member. The connection member includes a conductive connector and an insulation layer surrounding the conductive connector. The first redistribution structure includes a first dielectric layer, and a first wiring pattern, and a first device. The first dielectric layer is disposed on the connection member. The first wiring pattern is disposed in the first dielectric layer. The first device is disposed above the first dielectric layer and is electrically connected to the conductive connector.
    Type: Application
    Filed: March 30, 2022
    Publication date: March 9, 2023
    Applicant: Industrial Technology Research Institute
    Inventors: Chieh-Wei Feng, Tai-Jui Wang, Jui-Wen Yang, Tzu-Yang Ting
  • Patent number: 11387230
    Abstract: A system in package structure and an electrostatic discharge protection structure thereof are provided. The electrostatic discharge protection structure includes a redistribution layer and a first transistor array. The redistribution layer has a first electrode and a second electrode. The first transistor array is coupled to a pin end of at least one integrated circuit, the first electrode and the second electrode. The first transistor array has a plurality of transistors. A plurality of first transistors of the transistors are coupled in parallel, and a plurality of second transistors of the transistors are coupled in parallel. The first transistors and the second transistors are configured to be turned on for dissipating an electrostatic discharge current.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: July 12, 2022
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Hung Yu, Tai-Jui Wang, Chieh-Wei Feng, Yu-Hua Chung
  • Publication number: 20220173055
    Abstract: Provided are a capacitor and a filter and a redistribution layer structure including the same. The capacitor includes a first electrode, a second electrode, a third electrode, a dielectric layer, and a conductive through via. The second electrode is disposed above the first electrode. The third electrode is disposed between the first electrode and the second electrode. The dielectric layer is disposed between the first electrode and the third electrode and between the second electrode and the third electrode. The conductive through via penetrates the dielectric layer and the third electrode to be connected to the first electrode and the second electrode, and is electrically separated from the third electrode. The first electrode and the second electrode are signal electrodes, and the third electrode is a ground electrode.
    Type: Application
    Filed: January 26, 2021
    Publication date: June 2, 2022
    Applicant: Industrial Technology Research Institute
    Inventors: Tzu-Yang Ting, Chieh-Wei Feng, Tai-Jui Wang
  • Publication number: 20220005768
    Abstract: Provided is a semiconductor package structure including a redistribution layer (RDL) structure, a chip, an electronic device and a stress compensation layer. The RDL structure has a first surface and a second surface opposite to each other. The chip is disposed on the first surface and electrically connected to the RDL structure. The electronic device is disposed in the RDL structure, electrically connected to the chip, and includes a dielectric layer disposed therein. The stress compensation layer is disposed in or outside the RDL structure. The dielectric layer provides a first stress between 50 Mpa and 200 Mpa in a first direction perpendicular to the second surface, the stress compensation layer provides a second stress between 50 Mpa and 200 Mpa in a second direction opposite to the first direction, and the difference between the first stress and the second stress does not exceed 60 Mpa.
    Type: Application
    Filed: March 30, 2021
    Publication date: January 6, 2022
    Applicant: Industrial Technology Research Institute
    Inventors: Jui-Wen Yang, Hsin-Cheng Lai, Chieh-Wei Feng, Tai-Jui Wang, Yu-Hua Chung, Tzu-Yang Ting
  • Patent number: 11088135
    Abstract: An electrostatic discharge (ESD) protection apparatus and an integrated passive device (IPD) with capacitor(s) are provided. The ESD protection apparatus includes a transistor, an impedance, and a capacitor disposed in a redistribution layer (RDL) structure of a package. The first terminal and the second terminal of the transistor are respectively coupled to a first power rail and a second power rail of the RDL structure. A first terminal of the impedance is coupled to the first power rail. A second terminal of the impedance is coupled to a control terminal of the transistor. A first terminal of the capacitor is coupled to the second terminal of the impedance. A second terminal of the capacitor is coupled to the second power rail.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: August 10, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Hua Chung, Tai-Jui Wang, Chieh-Wei Feng
  • Publication number: 20210098558
    Abstract: An electronic device including a pixel array structure, a redistribution structure, and a plurality of conductive via structures is provided. The pixel array structure includes a plurality of signal lines. The redistribution structure overlaps the pixel array structure and includes a plurality of conductive lines. The conductive via structures electrically connect the signal lines of the pixel array structure and the conductive lines of the redistribution structure. At least one of the conductive via structures shares at least one conductive layer with the pixel array structure.
    Type: Application
    Filed: September 30, 2020
    Publication date: April 1, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Wei-Chung Chen, Wen-Yu Kuo, Chieh-Wei Feng, Tai-Jui Wang
  • Patent number: 10950588
    Abstract: A chip package structure including a redistribution structure layer, at least one chip, and an encapsulant is provided. The redistribution structure layer includes at least one redistribution circuit, at least one transistor electrically connected to the redistribution circuit, and a plurality of conductive vias electrically connected to the redistribution circuit and the transistor. The chip is disposed on the redistribution structure layer and electrically connected to the redistribution structure layer. The encapsulant is disposed on the redistribution structure layer and at least encapsulates the chip. A manufacturing method of a chip package structure is also provided.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: March 16, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Hung Yu, Tai-Jui Wang, Chieh-Wei Feng, Wei-Yuan Cheng
  • Patent number: 10941498
    Abstract: A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: March 9, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chien-Hsun Chu, Chien-Chou Tseng, Ming-Huan Yang, Tai-Jui Wang, Yu-Hua Chung, Chieh-Wei Feng
  • Publication number: 20200212033
    Abstract: An electrostatic discharge (ESD) protection apparatus and an integrated passive device (IPD) with capacitor(s) are provided. The ESD protection apparatus includes a transistor, an impedance, and a capacitor disposed in a redistribution layer (RDL) structure of a package. The first terminal and the second terminal of the transistor are respectively coupled to a first power rail and a second power rail of the RDL structure. A first terminal of the impedance is coupled to the first power rail. A second terminal of the impedance is coupled to a control terminal of the transistor. A first terminal of the capacitor is coupled to the second terminal of the impedance. A second terminal of the capacitor is coupled to the second power rail.
    Type: Application
    Filed: May 8, 2019
    Publication date: July 2, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Hua Chung, Tai-Jui Wang, Chieh-Wei Feng
  • Patent number: 10644167
    Abstract: A thin film transistor including a flexible substrate, a semiconductor layer, a first gate, and a first gate dielectric layer is provided. The semiconductor layer is located on the flexible substrate. The first gate is located on the flexible substrate and corresponds to a portion of the semiconductor layer. The first gate dielectric layer is located between the first gate and the semiconductor layer. The first gate dielectric layer is in contact with the semiconductor layer, and the hydrogen atom concentration of the first gate dielectric layer is less than 6.5×1020 atoms/cm3. A method of manufacturing the thin film transistor is also provided.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: May 5, 2020
    Assignees: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Tai-Jui Wang, Yung-Hui Yeh, Jui-Wen Yang, Hsiao-Chiang Yao, Chun-Hung Chu
  • Publication number: 20200063282
    Abstract: A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.
    Type: Application
    Filed: June 20, 2019
    Publication date: February 27, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chien-Hsun CHU, Chien-Chou TSENG, Ming-Huan YANG, Tai-Jui WANG, Yu-Hua CHUNG, Chieh-Wei FENG
  • Publication number: 20190355713
    Abstract: A system in package structure and an electrostatic discharge protection structure thereof are provided. The electrostatic discharge protection structure includes a redistribution layer and a first transistor array. The redistribution layer has a first electrode and a second electrode. The first transistor array is coupled to a pin end of at least one integrated circuit, the first electrode and the second electrode. The first transistor array has a plurality of transistors. A plurality of first transistors of the transistors are coupled in parallel, and a plurality of second transistors of the transistors are coupled in parallel. The first transistors and the second transistors are configured to be turned on for dissipating an electrostatic discharge current.
    Type: Application
    Filed: November 8, 2018
    Publication date: November 21, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Cheng-Hung Yu, Tai-Jui Wang, Chieh-Wei Feng, Yu-Hua Chung