Patents by Inventor Tai-Jui Wang
Tai-Jui Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250219033Abstract: A bonding structure, including a first dielectric layer, multiple first conductors, a second dielectric layer, and multiple second conductors, is provided. The first conductors are embedded in the first dielectric layer, the first dielectric layer is bonded with the second dielectric layer, and the second conductors are embedded in the second dielectric layer, wherein the first conductors are bonded with the second conductors, and a bonding interface between the first conductors and the second conductors is a bonding interface containing silver.Type: ApplicationFiled: February 5, 2024Publication date: July 3, 2025Applicant: Industrial Technology Research InstituteInventors: Jui-Wen Yang, Chieh-Wei Feng, Chih Wei Lu, Hsien-Wei Chiu, Tai-Jui Wang
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Publication number: 20250126722Abstract: A circuit compensation method applied to pattern displacement includes: disposing at least one chip on a carrier; measuring a shift of the chip, performing circuit position compensation on a predetermined pattern of a redistribution layer, and calculating a resistance difference of the pattern before and after the circuit position compensation; estimating a circuit proportion and a range of resistance variation in the pattern needed for resistance compensation after the circuit position compensation according to the resistance difference; determining a compensation position and a scheme of circuit proportion and adjusting a circuit width, area, length, pattern, or combination thereof of a circuit within the circuit proportion according to the resistance difference; outputting a picture file of the pattern after the circuit position and resistance compensation; and forming the redistribution layer according to the picture file and electrically connecting the redistribution layer to the chip.Type: ApplicationFiled: October 16, 2024Publication date: April 17, 2025Applicant: Industrial Technology Research InstituteInventors: Chieh-Wei Feng, Cheng-Yueh Chang, Tai-Jui Wang
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Publication number: 20240130657Abstract: A physiological sensing device for sensing physiological signal of an organism is provided. The physiological sensing device includes a sensing chip, a coupling sensing electrode and a coupling dielectric stacked layer. The coupling sensing electrode is electrically connected to the sensing chip. The coupling dielectric stacked layer covers the coupling sensing electrode. The coupling dielectric stacked layer is located between the coupling sensing electrode and the organism. The coupling dielectric stacked layer includes a first dielectric layer and a second dielectric layer. The dielectric constant of the second dielectric layer is greater than that of the first dielectric layer. The second dielectric layer is located between the first dielectric layer and the organism.Type: ApplicationFiled: August 23, 2023Publication date: April 25, 2024Applicant: Industrial Technology Research InstituteInventors: Hsien-Wei Chiu, Tai-Jui Wang, Chieh-Wei Feng, Jui-Wen Yang
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Publication number: 20240088004Abstract: A stacked wiring structure includes a first wiring substrate and a second wiring substrate. The first wiring substrate includes a first glass substrate, multiple first conductive through vias penetrating through the first glass substrate, and a first multi-layered redistribution wiring structure disposed on the first glass substrate. The second wiring substrate includes a second glass substrate, multiple second conductive through vias penetrating through the second glass substrate, and a second multi-layered redistribution wiring structure disposed on the second glass substrate. The first conductive through vias are electrically connected to the second conductive through vias. The first glass substrate is spaced apart from the second glass substrate. The first multi-layered redistribution wiring structure is spaced apart from the second multi-layered redistribution wiring structure by the first glass substrate and the second glass substrate.Type: ApplicationFiled: August 21, 2023Publication date: March 14, 2024Applicant: Industrial Technology Research InstituteInventors: Tai-Jui Wang, Jui-Wen Yang, Chieh-Wei Feng, Chih Wei Lu, Hsien-Wei Chiu
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Patent number: 11839120Abstract: An electronic device including a pixel array structure, a redistribution structure, and a plurality of conductive via structures is provided. The pixel array structure includes a plurality of signal lines. The redistribution structure overlaps the pixel array structure and includes a plurality of conductive lines. The conductive via structures electrically connect the signal lines of the pixel array structure and the conductive lines of the redistribution structure. At least one of the conductive via structures shares at least one conductive layer with the pixel array structure.Type: GrantFiled: September 30, 2020Date of Patent: December 5, 2023Assignee: Industrial Technology Research InstituteInventors: Wei-Chung Chen, Wen-Yu Kuo, Chieh-Wei Feng, Tai-Jui Wang
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Patent number: 11776920Abstract: Provided a filter and a redistribution layer structure including the same. The capacitor includes a first electrode, a second electrode, a third electrode, a dielectric layer, and a conductive through via. The second electrode is disposed above the first electrode. The third electrode is disposed between the first electrode and the second electrode. The dielectric layer is disposed between the first electrode and the third electrode and between the second electrode and the third electrode. The conductive through via penetrates the dielectric layer and the third electrode to be connected to the first electrode and the second electrode, and is electrically separated from the third electrode. The first electrode and the second electrode are signal electrodes, and the third electrode is a ground electrode.Type: GrantFiled: January 26, 2021Date of Patent: October 3, 2023Assignee: Industrial Technology Research InstituteInventors: Tzu-Yang Ting, Chieh-Wei Feng, Tai-Jui Wang
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Patent number: 11764166Abstract: Provided is a semiconductor package structure including a redistribution layer (RDL) structure, a chip, an electronic device and a stress compensation layer. The RDL structure has a first surface and a second surface opposite to each other. The chip is disposed on the first surface and electrically connected to the RDL structure. The electronic device is disposed in the RDL structure, electrically connected to the chip, and includes a dielectric layer disposed therein. The stress compensation layer is disposed in or outside the RDL structure. The dielectric layer provides a first stress between 50 Mpa and 200 Mpa in a first direction perpendicular to the second surface, the stress compensation layer provides a second stress between 50 Mpa and 200 Mpa in a second direction opposite to the first direction, and the difference between the first stress and the second stress does not exceed 60 Mpa.Type: GrantFiled: March 30, 2021Date of Patent: September 19, 2023Assignees: Industrial Technology Research Institute, Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jui-Wen Yang, Hsin-Cheng Lai, Chieh-Wei Feng, Tai-Jui Wang, Yu-Hua Chung, Tzu-Yang Ting
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Publication number: 20230216001Abstract: A pixel structure is provided. The pixel structure includes a substrate and a conductive line electrically connected to the substrate. The ratio of the height to the width of the conductive line is between 0.5 and 6. The pixel structure also includes an electrode electrically connected to the conductive line and a conversion element electrically connected to the conductive lines through the electrode.Type: ApplicationFiled: December 30, 2021Publication date: July 6, 2023Inventors: Yu-Chang LIN, Tai-Jui WANG, Chieh Wei FENG, Wei-Chung CHEN
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Publication number: 20230071946Abstract: The present disclosure provides a package structure, an antenna module, and a probe card. The package structure includes a connection member and a first redistribution structure disposed on the connection member. The connection member includes a conductive connector and an insulation layer surrounding the conductive connector. The first redistribution structure includes a first dielectric layer, and a first wiring pattern, and a first device. The first dielectric layer is disposed on the connection member. The first wiring pattern is disposed in the first dielectric layer. The first device is disposed above the first dielectric layer and is electrically connected to the conductive connector.Type: ApplicationFiled: March 30, 2022Publication date: March 9, 2023Applicant: Industrial Technology Research InstituteInventors: Chieh-Wei Feng, Tai-Jui Wang, Jui-Wen Yang, Tzu-Yang Ting
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Patent number: 11387230Abstract: A system in package structure and an electrostatic discharge protection structure thereof are provided. The electrostatic discharge protection structure includes a redistribution layer and a first transistor array. The redistribution layer has a first electrode and a second electrode. The first transistor array is coupled to a pin end of at least one integrated circuit, the first electrode and the second electrode. The first transistor array has a plurality of transistors. A plurality of first transistors of the transistors are coupled in parallel, and a plurality of second transistors of the transistors are coupled in parallel. The first transistors and the second transistors are configured to be turned on for dissipating an electrostatic discharge current.Type: GrantFiled: November 8, 2018Date of Patent: July 12, 2022Assignee: Industrial Technology Research InstituteInventors: Cheng-Hung Yu, Tai-Jui Wang, Chieh-Wei Feng, Yu-Hua Chung
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Publication number: 20220173055Abstract: Provided are a capacitor and a filter and a redistribution layer structure including the same. The capacitor includes a first electrode, a second electrode, a third electrode, a dielectric layer, and a conductive through via. The second electrode is disposed above the first electrode. The third electrode is disposed between the first electrode and the second electrode. The dielectric layer is disposed between the first electrode and the third electrode and between the second electrode and the third electrode. The conductive through via penetrates the dielectric layer and the third electrode to be connected to the first electrode and the second electrode, and is electrically separated from the third electrode. The first electrode and the second electrode are signal electrodes, and the third electrode is a ground electrode.Type: ApplicationFiled: January 26, 2021Publication date: June 2, 2022Applicant: Industrial Technology Research InstituteInventors: Tzu-Yang Ting, Chieh-Wei Feng, Tai-Jui Wang
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Publication number: 20220005768Abstract: Provided is a semiconductor package structure including a redistribution layer (RDL) structure, a chip, an electronic device and a stress compensation layer. The RDL structure has a first surface and a second surface opposite to each other. The chip is disposed on the first surface and electrically connected to the RDL structure. The electronic device is disposed in the RDL structure, electrically connected to the chip, and includes a dielectric layer disposed therein. The stress compensation layer is disposed in or outside the RDL structure. The dielectric layer provides a first stress between 50 Mpa and 200 Mpa in a first direction perpendicular to the second surface, the stress compensation layer provides a second stress between 50 Mpa and 200 Mpa in a second direction opposite to the first direction, and the difference between the first stress and the second stress does not exceed 60 Mpa.Type: ApplicationFiled: March 30, 2021Publication date: January 6, 2022Applicant: Industrial Technology Research InstituteInventors: Jui-Wen Yang, Hsin-Cheng Lai, Chieh-Wei Feng, Tai-Jui Wang, Yu-Hua Chung, Tzu-Yang Ting
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Patent number: 11088135Abstract: An electrostatic discharge (ESD) protection apparatus and an integrated passive device (IPD) with capacitor(s) are provided. The ESD protection apparatus includes a transistor, an impedance, and a capacitor disposed in a redistribution layer (RDL) structure of a package. The first terminal and the second terminal of the transistor are respectively coupled to a first power rail and a second power rail of the RDL structure. A first terminal of the impedance is coupled to the first power rail. A second terminal of the impedance is coupled to a control terminal of the transistor. A first terminal of the capacitor is coupled to the second terminal of the impedance. A second terminal of the capacitor is coupled to the second power rail.Type: GrantFiled: May 8, 2019Date of Patent: August 10, 2021Assignee: Industrial Technology Research InstituteInventors: Yu-Hua Chung, Tai-Jui Wang, Chieh-Wei Feng
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Publication number: 20210098558Abstract: An electronic device including a pixel array structure, a redistribution structure, and a plurality of conductive via structures is provided. The pixel array structure includes a plurality of signal lines. The redistribution structure overlaps the pixel array structure and includes a plurality of conductive lines. The conductive via structures electrically connect the signal lines of the pixel array structure and the conductive lines of the redistribution structure. At least one of the conductive via structures shares at least one conductive layer with the pixel array structure.Type: ApplicationFiled: September 30, 2020Publication date: April 1, 2021Applicant: Industrial Technology Research InstituteInventors: Wei-Chung Chen, Wen-Yu Kuo, Chieh-Wei Feng, Tai-Jui Wang
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Patent number: 10950588Abstract: A chip package structure including a redistribution structure layer, at least one chip, and an encapsulant is provided. The redistribution structure layer includes at least one redistribution circuit, at least one transistor electrically connected to the redistribution circuit, and a plurality of conductive vias electrically connected to the redistribution circuit and the transistor. The chip is disposed on the redistribution structure layer and electrically connected to the redistribution structure layer. The encapsulant is disposed on the redistribution structure layer and at least encapsulates the chip. A manufacturing method of a chip package structure is also provided.Type: GrantFiled: July 5, 2018Date of Patent: March 16, 2021Assignee: Industrial Technology Research InstituteInventors: Cheng-Hung Yu, Tai-Jui Wang, Chieh-Wei Feng, Wei-Yuan Cheng
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Patent number: 10941498Abstract: A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.Type: GrantFiled: June 20, 2019Date of Patent: March 9, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chien-Hsun Chu, Chien-Chou Tseng, Ming-Huan Yang, Tai-Jui Wang, Yu-Hua Chung, Chieh-Wei Feng
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Publication number: 20200212033Abstract: An electrostatic discharge (ESD) protection apparatus and an integrated passive device (IPD) with capacitor(s) are provided. The ESD protection apparatus includes a transistor, an impedance, and a capacitor disposed in a redistribution layer (RDL) structure of a package. The first terminal and the second terminal of the transistor are respectively coupled to a first power rail and a second power rail of the RDL structure. A first terminal of the impedance is coupled to the first power rail. A second terminal of the impedance is coupled to a control terminal of the transistor. A first terminal of the capacitor is coupled to the second terminal of the impedance. A second terminal of the capacitor is coupled to the second power rail.Type: ApplicationFiled: May 8, 2019Publication date: July 2, 2020Applicant: Industrial Technology Research InstituteInventors: Yu-Hua Chung, Tai-Jui Wang, Chieh-Wei Feng
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Patent number: 10644167Abstract: A thin film transistor including a flexible substrate, a semiconductor layer, a first gate, and a first gate dielectric layer is provided. The semiconductor layer is located on the flexible substrate. The first gate is located on the flexible substrate and corresponds to a portion of the semiconductor layer. The first gate dielectric layer is located between the first gate and the semiconductor layer. The first gate dielectric layer is in contact with the semiconductor layer, and the hydrogen atom concentration of the first gate dielectric layer is less than 6.5×1020 atoms/cm3. A method of manufacturing the thin film transistor is also provided.Type: GrantFiled: March 6, 2018Date of Patent: May 5, 2020Assignees: Industrial Technology Research Institute, Intellectual Property Innovation CorporationInventors: Tai-Jui Wang, Yung-Hui Yeh, Jui-Wen Yang, Hsiao-Chiang Yao, Chun-Hung Chu
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Publication number: 20200063282Abstract: A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.Type: ApplicationFiled: June 20, 2019Publication date: February 27, 2020Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chien-Hsun CHU, Chien-Chou TSENG, Ming-Huan YANG, Tai-Jui WANG, Yu-Hua CHUNG, Chieh-Wei FENG
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Publication number: 20190355713Abstract: A system in package structure and an electrostatic discharge protection structure thereof are provided. The electrostatic discharge protection structure includes a redistribution layer and a first transistor array. The redistribution layer has a first electrode and a second electrode. The first transistor array is coupled to a pin end of at least one integrated circuit, the first electrode and the second electrode. The first transistor array has a plurality of transistors. A plurality of first transistors of the transistors are coupled in parallel, and a plurality of second transistors of the transistors are coupled in parallel. The first transistors and the second transistors are configured to be turned on for dissipating an electrostatic discharge current.Type: ApplicationFiled: November 8, 2018Publication date: November 21, 2019Applicant: Industrial Technology Research InstituteInventors: Cheng-Hung Yu, Tai-Jui Wang, Chieh-Wei Feng, Yu-Hua Chung