Abstract: A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.

Abstract: A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.

Abstract: A sawing and sorting system combines a sawing apparatus and a sorting apparatus. The sawing and sorting system comprises a loader. The loader comprises a magazine receiving a plurality of strips. A mounting unit mounts the strip thereon. A plurality of transfer and sawing robots each comprises a picker unit. The picker unit comprises a rotatable chuck table. The transfer and sawing robot transfers the picker unit horizontally and vertically. The rotatable chuck table holds the strip. The picker unit rotates the rotatable chuck table. A plurality of sawing spindle units each comprises a rotary blade. The sawing spindle unit moves the blade horizontally to divide the strip into unit packages. A cleaning unit cleans the unit package. A test means inspects the unit package according to a test criteria. A sorting table mounts the unit package for sorting. An unloader provides trays. A sorting transfer robot sorts the unit packages into the trays.

Abstract: A lead forming apparatus and a method for removing tin dust from the surface of the outer leads of semiconductor package are disclosed. The apparatus, in which a brushing operation removes tin dust from the outer leads, includes a supplier part; a lead forming part; a collection part; an intermediate post; a package transportation part; a brush block; and a brush transportation part. The method includes steps of providing a leadframe, forming the package leads, removing tin dust from the leads, and collecting the packages in a container.

Abstract: A lead frame unloading apparatus includes a pair of opposing plate members, one of which has a long horizontal slit. The opposing plate members define a central space where one or more sliding blocks are located, each of the sliding blocks having a vertical through hole at its center. A picker penetrates through the vertical hole within each respective sliding block, each picker is immobilized when it contacts a lead frame for pickup thereby allowing the sliding block to move vertically up and down on the immobilized pickers, each of the pickers having a vacuum suction device at one end thereof, and a vacuum screw at the other end thereof. The vacuum screw has a hollow projection connected to a vacuum supplier. A spring is disposed beneath respective of the one or more sliding blocks, with the spring being fitted to an outside of the vacuum suction device. Spring stoppers support the springs and fastening devices fasten the one or more sliding blocks to the opposing plate members.