Patents by Inventor Tai M. Liang

Tai M. Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radiation curable coating having low gloss and coated articles made therefrom
    Patent number: 6787225
    Abstract: A radiation curable coating comprising: (i) at least one radiation polymerizable reactant; (ii) at least one initiator for initiating cure; (iii) at least one wax; wherein the wax is present in an amount sufficient to reduce the 60° gloss of the cured coating to a gloss level less than 40 when the coating is cured by exposure to radiation in the presence of oxygen to provide a dry film thickness of 1.0±0.1 mil.
    Type: Grant
    Filed: August 16, 2002
    Date of Patent: September 7, 2004
    Assignee: The Sherwin-Williams Company
    Inventors: William R. Dawson, Tai M. Liang, Joseph E. Miller
  • Radiation curable coating having low gloss and coated articles made therefrom
    Publication number: 20030054116
    Abstract: A radiation curable coating comprising:
    Type: Application
    Filed: August 16, 2002
    Publication date: March 20, 2003
    Applicant: The Sherwin-Williams Company
    Inventors: William R. Dawson, Tai M. Liang, Joseph E. Miller
  • Radiation curable coatings having low gloss and coated articles made therefrom
    Patent number: 6448302
    Abstract: A radiation curable coating comprising: (i) at least one radiation polymerizable reactant; (ii) at least one initiator for initiating cure; (iii) at least one wax; wherein the wax is present in an amount sufficient to reduce the 60° gloss of the cured coating to a gloss level less than 40 when the coating is cured by exposure to radiation in the presence of oxygen to provide a dry film thickness of 1.0±0.1 mil.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: September 10, 2002
    Assignee: The Sherwin-Williams Company
    Inventors: William R. Dawson, Tai M. Liang, Joseph E. Miller