Patents by Inventor Tai O. CHUNG

Tai O. CHUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Warpage reduction device and warpage reduction method
    Patent number: 11065805
    Abstract: A warpage reduction device the present disclosure includes a jig having a warped shape capable of distributing stress of a workpiece, a light source heating the workpiece so as to be flat, a pressurizer applying pressure to the heated workpiece to be pressed against the jig so as to be deformed, a cooler cooling the deformed workpiece, and a controller controlling operations of the light source, the pressurizer, and the cooler.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: July 20, 2021
    Assignee: EO TECHNICS CO., LTD.
    Inventors: Tai O. Chung, Dae Ho Jung, In Su Kim, Gi Hong Seo
  • WARPAGE REDUCTION DEVICE AND WARPAGE REDUCTION METHOD
    Publication number: 20200171738
    Abstract: A warpage reduction device the present disclosure includes a jig having a warped shape capable of distributing stress of a workpiece, a light source heating the workpiece so as to be flat, a pressurizer applying pressure to the heated workpiece to be pressed against the jig so as to be deformed, a cooler cooling the deformed workpiece, and a controller controlling operations of the light source, the pressurizer, and the cooler.
    Type: Application
    Filed: April 9, 2018
    Publication date: June 4, 2020
    Applicant: EO TECHNICS CO., LTD.
    Inventors: Tai O. CHUNG, Dae Ho JUNG, In Su KIM, Gi Hong SEO