Abstract: A mask is provided for vapor deposition. The mask includes a plurality of effective open areas each of which includes apertures formed therein and extending therethrough to define hollow openings through which a deposition material is allowed to pass. The mask also includes ineffective areas that include solid portions located around the effective open areas. The ineffective areas include recesses formed therein such that the ineffective areas that have the same surface area as that of the effective open areas are made to have substantially the same mass as that of the effective open areas.

Abstract: The present invention provides a conductive flexible substrate and a manufacture method thereof and an OLED display device and a manufacture method thereof. The conductive flexible substrate comprises a flexible substrate (1), mesh conductive lines (2) located on the flexible substrate (1) and embossing from a surface of one side of the flexible substrate (1), and a conductive layer (3) filling among the mesh conductive lines (2); a surface of one side of the flexible substrate (1) away from the mesh conductive lines (2) and the conductive layer (3) is flat. The conductive flexible substrate is capable of promoting the conductivity of the flexible substrate, and applying the conductive flexible substrate to an OLED display device can solve the issue of low conductivity of anodes in the OLED display device.

Abstract: The present invention provides an OLED package method and an OLED package structure. The method comprises steps of: providing a substrate (1) to be packaged, and a package cover plate (2); forming an inorganic protective frame (11) in a round at the edges of the substrate (1); manufacturing an OLED element (12) on the substrate (1) inside the inorganic protective frame (11); pasting a solid glue film (21) on the package cover plate (2); forming an adhesive (22) in a round on the package cover plate (2) corresponding to a location of the inorganic protective frame (11); oppositely attaching the substrate (1) and the package cover plate (2), and the substrate (1) and the package cover plate (2) are affixed together by the solid glue film (21) and the adhesive (22) to accomplish the package to the substrate (1) with the package cover plate (2).

Abstract: A mask is provided for vapor deposition. The mask includes a plurality of effective open areas each of which includes apertures formed therein and extending therethrough to define hollow openings through which a deposition material is allowed to pass. The mask also includes ineffective areas that include solid portions located around the effective open areas. The ineffective areas include recesses formed therein such that the ineffective areas that have the same surface area as that of the effective open areas are made to have substantially the same mass as that of the effective open areas.

Abstract: Disclosed are a method for manufacturing a photo mask and a photo mask manufactured with the method. The method includes (1) providing a partially finished photo mask, which has effective open areas and ineffective areas located around the effective open areas and (2) applying a half-etching process to form recesses in the ineffective areas. With the recesses formed through a half-etching process in the ineffective areas located around the effective open areas, a mass difference between the effective open areas and the ineffective areas is reduced so that in the process of attracting the photo mask, inconsistent sequence of attraction caused by a great mass difference between the effective open areas and the ineffective areas can be eliminated to thereby ensure that the effective open areas of the photo mask can be laid completely flat on a substrate at predetermined locations and thus ensure the preciseness of a deposited pattern.

Abstract: The present invention provides a flexible OLED display device and a manufacture method thereof, and the flexible OLED display device comprises a flexible OLED substrate (100) and a flexible package cover plate (200). By employing the package cover plate (200) comprising an isolation layer (201), a flexible metal layer (202) and a rollable hard coating layer (203) to implement package, and utilizing the excellent abilities of anti-water, anti-oxygen and extensibility of the flexible metal layer (202), the flexible OLED display device can be protected and does not react with the external water and oxygen to raise the lighting efficiency of the flexible OLED display device and extending the usage lifetime of the flexible OLED display device.

Abstract: The present invention provides an OLED package structure and package method thereof, and the structure comprises a package cover plate (1), a substrate (2), oppositely positioned with the package cover plate (1), an OLED element (21), positioned between the package cover plate (1) and the substrate (2) and set on the substrate (2), dryer (12), positioned at periphery of the OLED element (21) between the package cover plate (1) and the substrate (2), seal (13), positioned at periphery of the dryer (12) to bond the package cover plate (1) and the substrate (2) and frit glass (11), located at periphery of the seal (13) to bond the package cover plate (1) and the substrate (2); the structure utilizes the seal and the frit glass together to implement the package to make the package structure possess well tightness and mechanical strength at the same time, and meanwhile, the dryer filler is located at the periphery of the OLED element, which applies to the OLED element packages of both top emitting type and bottom

Abstract: The present invention provides a flexible OLED display device and a manufacturing method thereof. The OLED display device includes a flexible substrate (1) and a flexible packaging lid (2) opposite to the flexible substrate (1), a TFT layer (3) formed on the flexible substrate (1), an OLED thin-film device (4) formed on the TFT layer (3), a passivation layer (5) formed on the OLED thin-film device (4) and enclosing the OLED thin-film device (4), and an organic packaging film (6) arranged on the side of the flexible packaging lid (2) that is close to the flexible substrate (1) to bond the flexible packaging lid (2) and the flexible substrate (1) to each other. The flexible substrate (1) is one of a thin metal sheet and a sheet of ultra-thin glass and the flexible packaging lid (2) is another one of the thin metal sheet and the ultra-thin glass that is different from the one of the flexible substrate (1).

Abstract: The present invention provides a conductive flexible substrate and a manufacture method thereof and an OLED display device and a manufacture method thereof. The conductive flexible substrate comprises a flexible substrate (1), mesh conductive lines (2) located on the flexible substrate (1) and embossing from a surface of one side of the flexible substrate (1), and a conductive layer (3) filling among the mesh conductive lines (2); a surface of one side of the flexible substrate (1) away from the mesh conductive lines (2) and the conductive layer (3) is flat. The conductive flexible substrate is capable of promoting the conductivity of the flexible substrate, and applying the conductive flexible substrate to an OLED display device can solve the issue of low conductivity of anodes in the OLED display device.

Abstract: The present invention relates to an encapsulating method of OLED substrate and an OLED structure. The encapsulating method includes steps of: step 1: providing an OLED substrate (1) and an encapsulation cover plate (3), a top surface of the OLED substrate (1) having a metal cathode (135); step 2: performing a surface treatment onto the metal cathode (135) by ion bombardment to thereby form a metal oxide layer (5) on a surface of the metal cathode (135); step 3: coating an encapsulation glue (7) and disposing a filler (9) on the encapsulation cover plate (3); step 4: oppositely disposing and bonding the encapsulation cover plate (3) and the OLED substrate (1); and step 5: curing the encapsulation glue (7) by UV light illumination and thereby realizing the encapsulation of the OLED substrate (1) by use of the encapsulation cover plate (3).

Abstract: The present invention provides an OLED package method and an OLED package structure. The method comprises steps of: providing a substrate (1) to be packaged, and a package cover plate (2); forming an inorganic protective frame (11) in a round at the edges of the substrate (1); manufacturing an OLED element (12) on the substrate (1) inside the inorganic protective frame (11); pasting a solid glue film (21) on the package cover plate (2); forming an adhesive (22) in a round on the package cover plate (2) corresponding to a location of the inorganic protective frame (11); oppositely attaching the substrate (1) and the package cover plate (2), and the substrate (1) and the package cover plate (2) are affixed together by the solid glue film (21) and the adhesive (22) to accomplish the package to the substrate (1) with the package cover plate (2).

Abstract: The present invention is related with a heating vessel for preventing leakage of high temperature metal material and a manufacture method thereof. The heating vessel comprises: an internal heating vessel employed for containing metal material, an external heating vessel employed to be heated by a heating apparatus and a top cap having a vapor hole employed for escape of the vaporized metal material; the internal heating vessel is completely contained in the external heating vessel and positionally fixed relative to the external heating vessel, and an interspace exists between a side wall of the internal heating vessel and a side wall of the external heating vessel, and the top cap is fixed on tops of the internal heating vessel and the external heating vessel to cover opens of the internal heating vessel and the external heating vessel. The present invention also provides the manufacture method of the vessel.

Abstract: Disclosed are a method for manufacturing a photo mask and a photo mask manufactured with the method. The method includes (1) providing a partially finished photo mask, which has effective open areas and ineffective areas located around the effective open areas and (2) applying a half-etching process to form recesses in the ineffective areas. With the recesses formed through a half-etching process in the ineffective areas located around the effective open areas, a mass difference between the effective open areas and the ineffective areas is reduced so that in the process of attracting the photo mask, inconsistent sequence of attraction caused by a great mass difference between the effective open areas and the ineffective areas can be eliminated to thereby ensure that the effective open areas of the photo mask can be laid completely flat on a substrate at predetermined locations and thus ensure the preciseness of a deposited pattern.

Abstract: The present invention provides a masking device for vapor deposition of organic material of an organic electroluminescent diode, which includes a mask frame, cover plates arranged at opposite end edges of the mask frame to face toward a vapor deposition side, and a mask positioned on the cover plates. The mask frame is rectangular in shape and has a central portion forming a rectangular receiving opening, whereby size of the receiving opening is variable through adjustment made on positions of the cover plates. The mask forms a plurality of openings that is uniformly distributed thereon. The masking device includes a mask that shows a uniform distribution of mass so as to avoid inconsistent timing of attraction of various zones of the mask during magnetic attraction of the mask and thus positional shift of pixel caused thereby.

Abstract: The present invention provides a masking device for vapor deposition of organic material of an organic electroluminescent diode, including a mask frame and a plurality of divide shallow masks mounted on the mask frame. Gaps are formed between the divide shallow masks. The gap formed between two adjacent ones of the divide shallow masks is identical. The mask frame is rectangular in shape and has a central portion forming a receiving opening. The number of the divide shallow masks is determined according to width of the receiving opening of the mask frame and widths of the divide shallow masks. The overall width of all the divide shallow masks plus the widths of the gaps therebetween is greater than or equal to the width of the receiving opening. This arrangement helps realizing size enlargement of mask for vapor deposition of the diode and also facilitates vapor deposition of the organic material.