Abstract: The image data analytics for computation configuration method and computer system with computation accessibility is provided. The computation accessibility and configuration on image data processing are implemented by a plurality of computers having a plurality of processors and a plurality of data storages, the image data analytics for computation accessibility and configuration includes the following steps: inputting an original image by an input device and initializing the original image; defining a plurality of tiles equally dividing the original image into a same size of a regular shape; transferring the plurality of image regions to form a graph having vertices and edges; cutting the graph into a plurality of sub-graphs; arranging the plurality of sub-graphs to the plurality of processors or cores to conduct parallel processing simultaneously for analyzing the image data; and storing a plurality of processing results respectively in the plurality of data storages.

Abstract: The image data analytics for computation configuration method and computer system with computation accessibility is provided. The computation accessibility and configuration on image data processing are implemented by a plurality of computers having a plurality of processors and a plurality of data storages, the image data analytics for computation accessibility and configuration includes the following steps: inputting an original image by an input device and initializing the original image; defining a plurality of tiles equally dividing the original image into a same size of a regular shape; transferring the plurality of image regions to form a graph having vertices and edges; cutting the graph into a plurality of sub-graphs; arranging the plurality of sub-graphs to the plurality of processors or cores to conduct parallel processing simultaneously for analyzing the image data; and storing a plurality of processing results respectively in the plurality of data storages.

Abstract: A semiconductor package includes a semiconductor structure. The semiconductor structure includes a plurality of dielectric layers and a plurality of conductive interconnects embedded in the semiconductor structure. The semiconductor structure also includes a plurality of proximity communication signal input terminals. At least one of the plurality of proximity communication signal input terminals includes a first electrode and a second electrode. The first electrode and the second electrode are spaced apart so as to be configured to provide proximity communication through capacitive coupling. The first electrode is exposed proximate to a surface of the semiconductor structure.

Abstract: A semiconductor package includes a semiconductor structure. The semiconductor structure includes a plurality of dielectric layers and a plurality of conductive interconnects embedded in the semiconductor structure. The semiconductor structure also includes a plurality of proximity communication signal input terminals. At least one of the plurality of proximity communication signal input terminals includes a first electrode and a second electrode. The first electrode and the second electrode are spaced apart so as to be configured to provide proximity communication through capacitive coupling. The first electrode is exposed proximate to a surface of the semiconductor structure.