Patents by Inventor Tai Qui

Tai Qui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Grounding device for bundled cables
    Patent number: 7288720
    Abstract: A device for electrically grounding bundled cables includes a first half component having an outer surface portion and an abutting surface portion, and a second half component having an outer surface portion and an abutting surface portion. The outer surface portion of the first half component and the outer surface portion of the second half component each define at least one groove longitudinally extending therealong for accommodating one of a plurality of cables held closely together in a bundled configuration. The abutting surface portion of the first half component and the abutting surface portion of the second half component are configured for engaging and cooperating with one another to form a grounding structure.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: October 30, 2007
    Assignee: Times Microwave Systems, Inc.
    Inventors: Kevin Moyher, Raymond Allard, Paul Merola, Tao Duan, Jun Zhang, Xin Fu, Wei Wang, Tai Qui, Jason Zhu, Yunchuan Zhu