Patents by Inventor Tai-Shen Hsiao

Tai-Shen Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220332981
    Abstract: The present disclosure provides a hot melt tape at least including a substrate, an adhesive layer, and an anti-sticking layer, wherein the anti-sticking layer is adjacent to the adhesive layer and is the outermost layer of the hot melt tape. The hot melt tape may be used to seal objects, and preferably is made of a multilayer co-extrusion process. The anti-sticking layer prevents the hot melt tape from sticking the objects without needing a release film, and the hot melt tape can be directly heated during sealing the objects.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 20, 2022
    Inventors: Hung-Wei Pan, Tai-Shen Hsiao, Chin-Huei Yen