Abstract: Apparatus for removing thermal energy from PC circuit board devices such as graphics cards and the like, and including a waterblock adapted to be positioned on one side of a graphics cards, or the like, a heat sink adapted to be secured to the opposite side of the card, and a bridge plate adapted to extend over an edge of the card and be sandwiched between the heat sink and waterblock to serve as a means for coupling heat from the heat sink to the waterblock where it can be transferred to a liquid coolant and transported to an external radiator for disposal. The heat sink may include radiating vanes and an associated heat pipe for enhancing transport of thermal energy collected by the heat sink to the bridge plate.

Abstract: Systems for displaying a plurality of images. A system includes: a hollow post having a recessed portion; and a pair of pivot arms that include mounting protrusions pivotally mounted in the recessed portion. Each pivot arm is adapted to pivot about a first axis parallel to a longitudinal axis of the hollow post. The system also includes a pair of mounting assemblies respectively affixed to the pivot arms and a pair of monitors respectively secured to the mounting assemblies. Each mounting assembly is adapted to allow one of the monitors to rotate relative to one of the pivot arms about a second axis substantially perpendicular to the first axis and includes a first signal connector. Each monitor frame includes two second signal connectors configured to respectively engage the first signal connector at portrait and landscape orientations thereof relative to the post.

Abstract: Systems for displaying a plurality of images. A system includes: a hollow post that is adapted for connection to a support means and has a recessed portion; and a pair of pivot arms that include mounting protrusions pivotally mounted in the recessed portion. Each pivot arm is adapted to pivot about a first axis parallel to a longitudinal axis of the hollow post. The system also includes a pair of mounting assemblies respectively affixed to the pivot arms and a pair of monitors respectively secured to the mounting assemblies. Each mounting assembly is adapted to allow one of the monitors to rotate relative to one of the pivot arms about a second axis substantially perpendicular to the first axis.

Abstract: A cooling mechanism to dissipate thermal energy generated by the heat generating components of a graphics card assembly. An apparatus includes a circuit board having at least one heat generating component affixed thereto. The apparatus also includes a fan and carrier therefor including a heat sink plate having a portion thermally coupled to the heat generating component. The heat sink plate includes a means for forming at least one slot proximate the portion. The fan is adapted to direct airflow cross the portion. The thermal energy generated by the heat generating component is transferred to the fan carrier and ultimately removed from the fan carrier by the airflow. The airflow inducts a secondary airflow drawn through the slot during operation thereby to enhance transfer of the thermal energy from the heat generating component.

Abstract: A device to dissipate thermal energy generated by a heat generating component. The device includes a base plate and a housing secured to and disposed on the base plate to form an enclosed space surrounded thereby. The device also includes a plurality of fins secured to the base plate and disposed in the space; an inlet pipe for introducing cooling fluid into the space and an outlet pipe for exhausting the cooling fluid from the space. The inlet pipe has a flow exit positioned over the fins so that the cooling fluid flows from the top portions of the fins toward the base plate.

Abstract: A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally coupled to the active electronic components and that has a tubing therewithin. The radiator includes a pipe and baffles attached to the pipe, where one end of the pipe is connected to one end of the tubing. A pump, connected to the other ends of the tubing and pipe, circulates coolant through the pipe and tubing to transfer thermal energy from the metal block to the radiator. The mechanism also includes a fan unit to generate and direct an air flow toward the radiator and metal block, where the air flow removes the thermal energy from the radiator and metal block.

Abstract: Devices for removing heat from electronic components. A device includes a heat sink for attachment to an electronic component and multiple miniature fans. Each miniature fan includes an elongated, generally tubular outer housing member adapted to receive end closure plugs or caps at each end, a miniature electric motor mounted within one of the end caps, and a generally cylindrical shaped rotor/impeller disposed within the tubular housing and extending along the length thereof between the end caps, one end thereof being coupled to the motor. The housing member is provided with openings that extend longitudinally along one side thereof to provide an entrance port, and openings that extend along another side to provide an outlet or exit port. With the exception of the motor, all other parts can be made of an injection molded plastic, metal, or a combination of plastic and metal.

Abstract: A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally coupled to the active electronic components and that has a tubing therewithin. The radiator includes a pipe and baffles attached to the pipe, where one end of the pipe is connected to one end of the tubing. A pump, connected to the other ends of the tubing and pipe, circulates coolant through the pipe and tubing to transfer thermal energy from the metal block to the radiator. The mechanism also includes a heat sink that is thermally coupled to the metal block via a thermal transfer plate. A fan unit of the mechanism generates and directs an air flow toward the radiator, metal block and heat sink, where the air flow removes the thermal energy therefrom.

Abstract: A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally coupled to the active electronic components and that has a tubing therewithin. The radiator includes a pipe and baffles attached to the pipe, where one end of the pipe is connected to one end of the tubing. A pump, connected to the other ends of the tubing and pipe, circulates coolant through the pipe and tubing to transfer thermal energy from the metal block to the radiator. The mechanism also includes a fan unit to generate and direct an air flow toward the radiator and metal block, where the air flow removes the thermal energy from the radiator and metal block.